Full-Time
Staff Software Engineer
Subsystem Integration Test, Machine Learning Engineering
Qualcomm
10,001+ employees
Designs, manufactures, and licenses wireless semiconductors
Compensation Overview
$158.4k - $237.6k/yr
Company Historically Provides H1B Sponsorship
San Diego, CA, USA
In Person
Bachelor's, Master's, PhD
 AI & Machine Learning (1) |
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 Software Engineering (1) |
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- A Bachelor's degree in Computer Science, Engineering, Information Systems, or a related field and 4+ years of Hardware Engineering, Software Engineering, Systems Engineering, or related work experience; or a Master's degree in one of those fields and 3+ years of related experience; or a PhD in one of those fields and 2+ years of related experience.
- A Bachelor's degree with 8 years, or a Master's degree with 6 years, in Software Engineering, Computer Science, Systems Engineering, or a related field.
- Strong Python skills and hands-on experience building automated test frameworks using PyTest or an equivalent.
- C/C++ reading proficiency sufficient to debug delegate and runtime issues at the source level.
- Demonstrated experience in subsystem or integration testing within a hardware/software product development cycle.
- Experience with continuous integration and continuous delivery platforms such as Jenkins or GitHub Actions, and integrating test automation into build pipelines.
- Strong analytical and debugging skills with the ability to isolate failures across multilayer software stacks.
- Partner with delegate engineers from feature inception to define testability requirements, acceptance criteria, and subsystem test plans covering ONNX Runtime QNN Execution Provider, ExecuTorch HTP backend, and LiteRT delegate.
- Own the subsystem-level integration test strategy for each feature, including scope, entry and exit criteria, coverage targets, and risk-based prioritization.
- Embed in sprint planning, design reviews, and code reviews to ensure features are architected for testability from day one.
- Develop and maintain automated test content targeting subsystem boundaries, including operator and feature coverage, numerical accuracy, model-level functional correctness, and backend interface contracts.
- Validate on-device behavior on Snapdragon systems-on-chip using hardware-in-the-loop infrastructure, covering functional correctness, latency, and memory under real hardware conditions.
- Build Python and PyTest-based test suites integrated into the Delegates continuous integration pipeline and enforce subsystem integration test gates on every code change.
- Develop and use AI-assisted tooling and agentic workflows, including Claude Code and GitHub Copilot, to accelerate test-content generation, coverage analysis, and failure triage.
- Triage failures and isolate root causes across the delegate stack from machine-learning framework through QNN runtime to HTP hardware, and drive resolution with development owners.
- Flag integration risks during feature development and distinguish subsystem-level issues from upstream framework bugs and downstream backend or system-integration issues.
- Define and own handoff criteria from subsystem integration testing to quality assurance and system integration testing, including documented test results, known issues, coverage gaps, and risk summaries.
- Serve as the primary technical liaison between the Delegates development team and quality assurance/system integration testing, translating feature context into actionable downstream test guidance.
- Maintain traceability between subsystem integration test artifacts and quality assurance/system integration test plans through JIRA, and feed defects that trace to subsystem gaps back into subsystem integration coverage.
- Set the subsystem integration test quality strategy and test architecture for the full Delegates portfolio at Staff level while operating independently with minimal direction.
- Co-own feature quality from the beginning alongside development engineers and define subsystem-validation completion criteria before handoff to quality assurance.
- Serve as the primary technical bridge between the Delegates development team and downstream quality assurance/system integration testing.
- Mentor junior and senior subsystem integration test engineers and establish team norms for test coverage, triage discipline, and handoff documentation standards.
- Collaborate with continuous integration, build, and release engineers to embed subsystem integration test automation in the delivery pipeline and make readiness signals visible to Program Management.
- Experience validating machine-learning inference frameworks such as ONNX Runtime, ExecuTorch, TFLite/LiteRT, or an equivalent framework.
- Hands-on experience with Qualcomm QNN, HTP/DSP, or Snapdragon system-on-chip-based on-device validation.
- Familiarity with model-accuracy validation, including quantization correctness, operator-level numerical comparison, and tolerance analysis.
- C/C++ proficiency for development and debugging of ONNX Runtime unit tests.
- Cross-platform testing experience across Linux, Android, and Windows on ARM64 or x86.
- Experience with JIRA defect tracking and Agile/Scrum development practices.
Qualcomm designs and licenses semiconductor technologies for wireless connectivity used in mobile devices, cars, and IoT. Its products include system-on-chips and RF components, plus a large portfolio of patents that it licenses to other companies. The company combines end-to-end semiconductor design with IP licensing to serve mobile, automotive, and IoT markets. Its goal is to expand wireless technology adoption by delivering standards-based silicon solutions and monetizing its intellectual property to support ongoing connectivity innovation.
Company Size
10,001+
Company Stage
IPO
Headquarters
San Diego, California
Founded
1985
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Simplify's Take
What believers are saying
- Qualcomm's automotive revenue hit $1.6 billion in fiscal Q3 2026, up 61%.
- Qualcomm won two hyperscaler data-center orders, with revenue starting December 2026.
- Qualcomm's September 22, 2026 Snapdragon Summit launches dual 8 Elite chips.
What critics are saying
- Apple's modem transition keeps shrinking Qualcomm's remaining iPhone business before March 2027.
- Qualcomm's £480 million UK royalty class action ended, yet antitrust attacks continue.
- Apple and Android OEM vertical integration can erase Qualcomm's handset moat by 2027.
What makes Qualcomm unique
- Qualcomm owns Snapdragon and RF stacks across phones, PCs, wearables, and XR.
- Qualcomm's patent licensing monetizes cellular standards across Apple, Samsung, and Android OEMs.
- Qualcomm integrated Modular in July 2026, pairing chips with AI software.
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Benefits
Premium-free health coverage
Onsite health & fitness centers
Retirement programs
Disability & life insurance programs
Tuition reimbursement
Product discounts
Flexible time off
Parental leave
Growth & Insights and Company News
6 month growth
↑ 1%1 year growth
↑ 0%2 year growth
↓ -1%Qualcomm has appointed Sergio Buniac as executive vice president and group general manager of Mobile, Compute and Personal AI. Buniac brings over 30 years of experience from Motorola to the role, which covers Qualcomm's mobile, computing, and personal AI product areas. The appointment reinforces Qualcomm's focus on AI-powered devices and emerging personal AI products. Buniac's background in product, sales, and operations aligns with the company's push into these areas whilst balancing its handset business with newer segments including automotive, industrial IoT, and AI data centre initiatives. Buniac will assume his new position on 2 September 2026. Investors will be watching subsequent quarterly reports for clearer disclosure on AI device traction and alignment with Qualcomm's longer-term non-handset revenue targets through 2029.
Modular held its ModCon 2026 developer conference in San Francisco, marking its first event since Qualcomm acquired the company for approximately $3.1 billion in stock in late July. The company announced five major updates. The Mojo programming language and compiler became fully open source under Apache 2.0. Modular Cloud, its AI inference service, reached general availability. Platform support expanded to include AWS Trainium, Google TPUs and Qualcomm datacentre accelerators, joining existing support for Nvidia, AMD and Apple Silicon. This brings six different chip vendors under one programming model. The MAX licence dropped device usage restrictions. Additionally, Mojo is coming to Windows with Microsoft's assistance. Modular CEO Chris Lattner, co-creator of LLVM compiler infrastructure and Apple's Swift language, now serves as Qualcomm executive vice president running advanced AI software and platforms.
Qualcomm's automotive revenue hit a quarterly record of $1.6 billion in fiscal Q3 2026, up 61% year over year, with the annualised exit run rate target rising to approximately $7 billion. The company secured purchase orders from two global hyperscalers for its data centre silicon, with wafers running and revenue starting in the December quarter. Management targets data centre revenue of $5 billion in fiscal 2027, rising to $15 billion by fiscal 2029. The company expects non-handset revenue growth to accelerate from 24% in fiscal 2026 to over 60% in fiscal 2027, enough to replace all fiscal 2026 Apple product revenue. The chip segment's pretax margin stood at 26% in fiscal Q3 2026, guided to 23% to 25% for fiscal Q4 2026. Qualcomm stock has fallen 21% over the trailing three months.
Qualcomm teases two new Snapdragon 8 Elite chips ahead of September launch. Qualcomm has started teasing its next generation of flagship smartphone processors. The company has confirmed that two new Snapdragon 8 Elite chips are coming next month, although it has not yet revealed their official names or full specifications. Qualcomm is expected to introduce the new processors during its Snapdragon Summit on September 22, 2026. The company is promoting the upcoming chips as offering improved connectivity, stronger graphics performance, and better gaming experiences. In a social media teaser, Qualcomm hinted at the arrival of "Dual 8 Elites" and promoted the idea of having "twice the options." The company also highlighted the latest connectivity features and what it describes as powerful GPU performance. Qualcomm has not shared detailed specifications yet. However, previous leaks strongly suggest that the two processors will be called the Snapdragon 8 Elite Gen 6 and Snapdragon 8 Elite Gen 6 Pro. Ad powered by advergic.com The two chips are expected to target different levels of flagship smartphones, giving manufacturers more flexibility when choosing hardware for their devices. Snapdragon 8 Elite Gen 6 Pro could be more powerful. Leaks suggest that the Snapdragon 8 Elite Gen 6 Pro could be the more advanced processor of the two. It is reportedly being developed using TSMC's 2nm process. The Pro version is also expected to feature an octa-core Oryon CPU arranged in a 2+3+3 configuration. Graphics performance could come from an Adreno 850 GPU, reportedly paired with 18MB of dedicated memory. Another major upgrade could be support for LPDDR6 RAM, which should offer improvements in memory performance and efficiency compared with previous generations. Standard Snapdragon 8 Elite Gen 6 could use 3nm technology. The standard Snapdragon 8 Elite Gen 6 is expected to take a slightly different approach. Rumors point to a 3nm manufacturing process and another octa-core Oryon CPU with a 2+3+3 configuration. The standard model could use an Adreno 845 GPU with 12MB of dedicated memory. It is also expected to support LPDDR5X RAM rather than the newer LPDDR6 standard. This difference could help Qualcomm separate the two processors in terms of performance and cost. Higher prices could affect flagship phones. One concern surrounding the Snapdragon 8 Elite Gen 6 Pro is its rumored price. Reports suggest that Qualcomm could significantly increase the cost of its top-end chipset compared with the current Snapdragon 8 Elite Gen 5. If the price increase becomes reality, smartphone manufacturers could face higher component costs. That could eventually push up the prices of some premium Android phones. Some manufacturers may instead choose the standard Snapdragon 8 Elite Gen 6 for their base flagship models to keep prices under control. Official details are coming soon. Qualcomm has now confirmed that two new Snapdragon 8 Elite chips are on the way. But most of the technical details remain unconfirmed. The company is expected to reveal the full specifications at Snapdragon Summit on September 22. Until then, the leaked information should be treated as unofficial. The new processors could become an important part of the 2027 Android flagship lineup, particularly if Qualcomm delivers major improvements in CPU, GPU, connectivity, and memory performance. Mobile Phone Taxes Portal Find the PTA Taxes on All Phones on a Single Page using its Taxes Portal. Note: Mobile phone tax rates and calculations fall under the jurisdiction of the Federal Board of Revenue (FBR), not the Pakistan Telecommunication Authority (PTA).
RedMagic 12 Pro series rumored for October debut with next-gen Snapdragon chip. The next generation of RedMagic gaming phones could arrive sooner than expected. A new leak claims RedMagic 12 Pro series is scheduled to launch in October and may be one of the first smartphones to feature Qualcomm's upcoming Snapdragon 8 Elite Gen 6 Pro platform. Discover more tablet computer The information comes from Chinese tipster WHYLAB, who says the RedMagic 12 Pro lineup is currently expected to make its debut in October. The rumor also lines up with recent comments from Jiang Chao, general manager of RedMagic gaming phones. When asked why there had been little information about the RedMagic 12 series, Jiang reportedly confirmed that a new model is coming but said the company has not yet entered its official pre-launch phase. Snapdragon 8 Elite Gen 6 Pro could be the main attraction. Qualcomm is expected to unveil its next-generation flagship mobile chips during the Snapdragon Summit from September 23 to 25. Discover more Technology News Cell Phones The new family is rumored to include two versions: the Snapdragon 8 Elite Gen 6 and the more powerful Snapdragon 8 Elite Gen 6 Pro. According to the leak, the Pro model could feature Qualcomm's third-generation Oryon CPU architecture with an eight-core 2+3+3 configuration and 16MB of shared L2 cache. The performance-focused core is reportedly capable of approaching 5GHz, while graphics duties could be handled by a new Adreno 850 GPU. If these specifications prove accurate, the chipset could deliver a substantial performance boost for demanding applications and high-end mobile gaming. However, Qualcomm has yet to officially confirm these details. RedMagic may keep its punch-hole-free display. The RedMagic 12 series is also expected to continue the brand's distinctive true full-screen design. Rather than using a punch-hole camera, the upcoming phones are rumored to retain an under-display front camera. This would allow the display to remain free of visible cutouts, which is particularly appealing for gamers who want an uninterrupted view while playing. Discover more RedMagic could reportedly improve the underlying display technology as well, potentially using a new generation of under-display materials to enhance image quality without sacrificing the full-screen appearance. AI features could get a major upgrade. AI is expected to become another part of the RedMagic 12 experience. The company's virtual gaming assistant, MORA, could receive new capabilities alongside the phone's broader AI features. The upgraded assistant is reportedly being developed for applications such as gaming assistance, interaction, and other intelligent functions. Details remain scarce, so it is unclear how extensively these AI features will be integrated into everyday use or gameplay. Liquid and active air cooling could work together. Thermal management is especially important for a gaming phone equipped with a next-generation flagship processor. To address this, the RedMagic 12 series is rumored to adopt a combined liquid-and-air cooling system. The approach would pair liquid cooling with active airflow to move heat away from the internal components more effectively. The main objective is to keep temperatures under control during extended gaming sessions and reduce performance throttling caused by excessive heat. This could prove particularly valuable if the RedMagic 12 Pro does indeed use a chipset with a high-performance core approaching 5GHz. A strong focus on sustained gaming performance. Taken together, the rumored specifications suggest that RedMagic is continuing to focus heavily on sustained gaming performance rather than simply chasing headline benchmark numbers. The combination of a next-generation Snapdragon platform, a full-screen display, upgraded AI functions, and an enhanced cooling system could make the RedMagic 12 Pro an interesting contender in the next wave of flagship gaming smartphones. For now, though, the October launch date, Snapdragon 8 Elite Gen 6 Pro configuration, and other hardware details remain unconfirmed. RedMagic has indicated that a new generation is coming, but the company has not yet formally announced the RedMagic 12 Pro series. With Qualcomm's Snapdragon Summit reportedly scheduled for late September, more information could emerge as the event approaches.