Volantis Semiconductor

Designs photonic AI compute hardware

Signal and Power Integrity Engineer

Board & Electronics DesignConfirmed live in the last 24 hours

Full-timeNo salary listedHybrid

About the Job

Requirements

Experience with large-die, high-TDP chip power delivery network analysis and design.
Experience with advanced-node (7 nm and below) chip power delivery network analysis and design.
Ability to work with package architects to determine the best passive-component design within given constraints.
Ability to work with ASIC and microarchitecture teams to meet power integrity goals within manufacturing design constraints.

Responsibilities

Ensure power is delivered and stable at the rack/tray, package, die, and core levels.

Desired Qualifications

Experience with wafer-scale integration systems.
Experience with board- and system-level power delivery network analysis and design.
Experience with low-voltage die power delivery network analysis and design.
Experience with many-voltage-domain power delivery network design and analysis.
Experience with IVR-based design.

We’re looking for power integrity engineers to ensure that power is delivered and stable at all levels: rack/tray, package, die, core.

Ideal Background:

Experience with large die, high TDP chip PDN analysis and design
Experience with advanced node (7nm and lower) chip PDN analysis and design
Ability to work with package architects to determine best passives design within a given set of constraints
Ability to work with ASIC and microarchitecture team to hit power integrity goals given manufacturing design constraints

Nice to Have:

Experience with WSI (wafer-scale integration) systems
Board and system-level power delivery network analysis and design
Low voltage die power delivery network analysis and design
Many voltage domain power delivery network design and analysis
IVR based design experience

About the Company

Volantis Semiconductor

Designs photonic AI compute hardware

Volantis Semiconductor designs photonic computing hardware for AI workloads, centered on the Volantis Photonic Motherboard. Its technology directly modulates low-cost VCSELs and densely parallel optical waveguides directly on the chip to replace electrical interconnects, enabling a chip-scale package with massive bandwidth and energy efficiency. This approach differs from traditional silicon photonics by wafer-scale integration and laser-based optics, focusing on scalable interconnect bandwidth and compute efficiency rather than simply adding more silicon cores. The company aims to deliver faster, cheaper AI compute with reduced energy use, with pre-orders expected in early 2026 as it engages early customers.

Company size: 11-50
Company stage: Series A
Total funding: $97M
Headquarters: San Mateo, CA
Founded: 2022

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