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ASM International

Semiconductor deposition equipment and ALD tech

Engineer 1 & 2, Field Service

Equipment Field ServiceConfirmed live in the last 24 hours
Full-timeChandler, AZ, USANo salary listed

About the Job

Requirements

  • Engineer I requires a bachelor's degree in Electromechanical Engineering or a related field.
  • Engineer I requires 1–3 years of technical experience in field service or manufacturing of original equipment manufacturer capital equipment.
  • Engineer I must be able to read and interpret electronic and electromechanical schematics.
  • Engineer I needs basic knowledge of safety protocols and cleanroom guidelines.
  • Engineer I must be able to apply rules and procedures in their own activities.
  • Engineer I must understand tool architecture and control algorithms and explain operating principles to peers.
  • Engineer I must be able to work independently and as part of a team.
  • Engineer I must be willing to travel domestically and internationally as required.
  • Engineer I must be proficient with Microsoft Office.
  • Engineer II requires a bachelor's degree in Electrical, Mechanical, or Electromechanical Engineering with 4+ years of experience, or a master's degree in one of those fields with 0 years of experience.
  • Engineer II must have experience in field service or semiconductor capital equipment.
  • Engineer II must be able to interpret electronic and electromechanical schematics.
  • Engineer II must have experience with structured troubleshooting methodologies.
  • Engineer II needs knowledge of cleanroom and semiconductor safety protocols.
  • Engineer II must be able to work independently and as part of a team.
  • Engineer II must be willing to travel domestically and internationally.
  • Engineer II must be proficient with Microsoft Office.

Responsibilities

  • Install, maintain, and repair ASM semiconductor equipment at customer sites.
  • Troubleshoot tool and process issues using diagnostic tools, schematics, and structured methods.
  • Deliver timely customer support while following a safety-first approach.
  • Document work performed and support updates to service procedures.
  • Support process improvements and contribute ideas to enhance tool performance.
  • Assist with customer escalations.
  • Install, maintain, and repair ASM semiconductor equipment with limited supervision.
  • Lead troubleshooting of complex tool and process issues using structured diagnostic methods.
  • Perform in-depth root-cause analysis and recommend data-driven corrective actions.
  • Analyze tool performance data to anticipate issues and propose targeted improvements.
  • Provide training and on-the-job guidance to newcomers on routine service tasks.
  • Identify operational risks and recommend minor process or procedure enhancements.
  • Document service activities and contribute updates to procedures and best practices.
  • Provide detailed field feedback to engineering and design teams and support beta testing.
  • Manage day-to-day customer engagements with a proactive, customer-first approach.
  • Support escalations and collaborate with cross-functional experts to drive resolution.

Desired Qualifications

  • Engineer I: Semiconductor field service or capital equipment experience.
  • Engineer I: Knowledge of wafer fab operations, robotics, vacuum systems, plasma, or gas handling.
  • Engineer I: Experience writing procedures or process documentation.
  • Engineer I: Familiarity with structured problem-solving methods.
  • Engineer I: Experience supporting escalations or beta-site activities.
  • Engineer II: Hands-on semiconductor field service experience.
  • Engineer II: Working knowledge of wafer fab operations, robotics, vacuum systems, plasma, radio frequency, or gas handling.
  • Engineer II: Experience leading structured root-cause analysis.
  • Engineer II: Experience providing field data to engineering or design teams.
  • Engineer II: Background supporting beta-stage or early-option tools.
  • Engineer II: Familiarity with structured problem-solving techniques.

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Almere, Netherlands
Founded
1968

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