Senior Bonding Process Engineer

Summary:

We are seeking a highly skilled and motivated Senior Back-End Engineer with expertise in wafer bonding and high-precision alignment to join our MEMS fabrication team. This role focuses on developing and sustaining critical wafer-level bonding and alignment processes, such as anodic, fusion, direct, and adhesive bonding, with a strong emphasis on sub-micron to micron-level alignment accuracy required for MEMS device integration. The candidate will work closely with process engineering, integration, and R&D teams to enable reliable and scalable backend processes in a cleanroom manufacturing environment.

Key Responsibilities:

• Develop, optimize, and sustain wafer bonding processes including anodic, fusion, direct, eutectic, and adhesive bonding for MEMS devices.
• Lead development and control of wafer alignment processes prior to bonding using high-precision alignment tools (e.g., SUSS MA/BA tools).
• Ensure bonding alignment accuracy meets MEMS device requirements by evaluating alignment tolerances and bonding-induced shifts.
• Characterize bonding interface quality and alignment success using IR microscopy, acoustic microscopy, SEM, and other metrology tools.
• Perform root cause analysis and corrective actions for bonding and alignment failures or deviations.
• Design and execute DOEs for alignment and bonding process optimization.
• Work with equipment engineering on tool qualifications, recipe development, and preventive maintenance.
• Create and maintain process documentation including SOPs, specifications, control plans, and FMEAs.
• Support continuous improvement initiatives in yield, reliability, and throughput

Qualifications:

• Bachelor's or Master’s degree in Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related field.
• 3+ years of experience in wafer bonding and precision alignment in a MEMS, CMOS, or semiconductor FAB.
• Hands-on experience with bonding and alignment equipment (e.g., SUSS MicroTec, AML).
• Deep understanding of bonding interface mechanisms, alignment mark design, and wafer-level metrology.
• Strong data analysis skills with tools such as JMP, Minitab, Python, or Excel.
• Experience in MEMS process integration, wafer thinning, or through-silicon via (TSV) technologies.
• Familiarity with wafer-level packaging and backend-of-line (BEOL) process flows.
• US Person as defined by the International Traffic in Arms regulations
  • NOTE: The term "US person" refers to a U.S. citizen, U.S. permanent resident (green card holder), or a person granted refugee or asylum status in the United States.

Why work with us?   

Atomica is changing the world. Working at Atomica is truly a one-of-a-kind opportunity to impact groundbreaking technology while living in paradise. 

Your contributions to our MEMS technology will drive innovation, solve the great problems of our time and directly impact the lives of people across the globe.  

Life in Santa Barbara:   

Want to live in paradise? Life in Santa Barbara is just that. Atomica is sandwiched between the beautiful Santa Ynez mountains and the pristine Central California coastline. The weather? Absolutely gorgeous. No more shoveling snow or hiding from tornadoes!  

Within 5-minutes from the office, you will find rich local culture, world class schools, airport for convenient travel, festivals, and excellent options to wine and dine.   

We have had employees move from all over the country and say life has never been better!   

Compensation: 

$90,000-$140,000

*Atomica encourages applications from candidates at all levels where pay will be based on experience.*