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nVent and AMD collaborate on cooling for AMD Helios rackscale solution. nVent will add liquid and air cooling solution to AMD rack-scale AI platform to create a fully integrated system for large AI workloads October 15, 2026 The companies will unveil a first look of the open-source solution at the OCP Global Summit. nVent and AMD today announced a collaboration to bring rack-level cooling to the AMD Helios Rackscale solution. The joint effort pairs nVent's data center cooling expertise with AMD Helios to help operators deploy AI capacity at scale. This will add nVent rear door heat exchanger (RDHx) as part of the fully integrated AMD Helios AI infrastructure platform that includes AMD Instinct graphical processing units (GPUs), EPYC central processing units (CPUs), Pensando networking technologies, and the AMD ROCm open software stack. nVent will unveil a first look at the OCP Global Summit in San Jose, CA, October 12 to 16, 2026. "This collaboration brings nVent's cooling expertise to one of the leading AI platforms in the industry," said Eric Osborn, vice president and general manager of Data Solutions, Cooling & Power at nVent. "We are designing for the platforms our customers are building on, and working closely with AMD is how we make sure the fit is right." nVent's DC-powered RDHx is an industry-first dual rear door, designed for the double-wide AMD Helios rack. It captures the heat that direct-to-chip liquid cooling leaves behind and returns cooled air to the space, keeping the rack effectively room-neutral. It is fully-integrated with the AMD Helios platform and offers intelligent cooling with no wasted watts, integrated air temperature, humidity sensors and differential pressure fan speed control. Additionally, its DC power matches how next-generation AI racks are powered. The result is a cooling solution that allows customers to start with a single rack and scale larger deployments over time. "The rack, not any single component within it, has now become the unit of deployment; and compute, networking, software, power and cooling must operate as one system," said Ravi Pendekanti, corporate vice president of the Data Center Solutions Business Group at AMD. "AMD Helios brings those elements together in an open, standards-based architecture designed to help customers scale from a single rack to large AI factories with long-term flexibility. He added: "Our collaboration with nVent expands the cooling options available for AMD Helios, helping operators bring high-density AI infrastructure online across a broader range of data center environments." At the OCP Global Summit, nVent and AMD will show the RDHx for the first time on an Open Rack Wide (ORW) rack alongside the manifolds, bus bars, and power shelves of a Helios deployment, giving operators a first look at how the companies' work comes together. Visit Booth #A9 at OCP for more information.

nVent and AMD collaborate on dual-door cooling for AMD Helios. The DC-powered exchanger is designed to span Helios's double-wide rack, capture heat left after direct-to-chip cooling and return cooled air. October 14, 2026 Key points * 01 nVent describes two rear doors working as one system across AMD Helios's double-wide rack. * 02 The DC-powered exchanger is designed to capture heat left by direct-to-chip liquid cooling and return cooled air to the room. * 03 nVent says its "room-neutral" approach means additional room or perimeter cooling is not needed. * 04 The cooling collaboration names AMD Helios; AMD Helion is a separate rack blueprint drawing on Helios's open-platform approach. nVent and AMD are collaborating on a dual rear-door heat exchanger for AMD Helios. See how the design handles residual heat and returns cooled air to the room. nVent and AMD are collaborating on a dual rear-door heat exchanger for AMD Helios, a rack-scale AI platform. The DC-powered design is made to span Helios's double-wide rack, capture heat left after direct-to-chip liquid cooling and return cooled air to the room, according to nVent's product description. A paired system for a double-wide rack. A conventional rear-door heat exchanger serves one rack, nVent says. For AMD Helios, the company describes two rear doors engineered to work together as one system across the double-wide rack. The distinction is architectural: this design spans the wider rack rather than treating each side as a separate, single-rack installation. nVent describes the cooling system as part of the Helios platform, alongside AMD Instinct GPUs, EPYC CPUs, Pensando networking and AMD ROCm software. MarketScreener reported on October 13, 2026, that nVent and AMD planned a preview of the exchanger at the Open Compute Project Global Summit in San Jose. How the exchanger handles residual heat. Direct-to-chip liquid cooling removes heat at the processors, while nVent says its rear-door exchanger captures heat left over and sends cooled air back into the room. The company's design description presents the two doors as a single cooling system across the rack. What nVent means by room-neutral cooling. nVent uses "room-neutral" to describe returning cooled air instead of releasing the rack's heat into the room. The company says this means additional room or perimeter cooling is not needed. AMD Helios and AMD Helion are separate rack designs. The nVent cooling collaboration is for AMD Helios. AMD Helion is a separate rack blueprint described as drawing on Helios's open-platform approach, as Investing.com reported. NeoTeo has also covered AMD Helion's two rack designs. Noticias tecnología ciencia Other Languages Read this article in another available language.