A

ASML

Manufactures photolithography systems for semiconductors

Production Engineer - Production Engineering Group Leader

Full-TimeUpdated on 10/15/2026
No salary listed
Senior
Bachelor's, Master's
Linkou District, Taiwan
In Person
Engineering ManagementEngineering Leadership

About the job

Requirements
  • A bachelor's or master's degree in Engineering or a related field is required.
  • More than five years of leadership and management-related experience is required.
  • English fluency is required.
  • Familiarity with problem-solving methods such as Global 8 Discipline or relevant processes is required.
  • Experience in large-scale cross-sector project management and New Product Introduction is required.
  • The role requires the ability to provide business insights and take initiative accordingly.
  • The role requires mature presentation skills, including concise message delivery in conferences, elevator-pitch-style communication, public speaking, and slide preparation.
  • The role requires the ability to think beyond known boundaries and take calculated risks to drive success.
  • Candidates must be legally authorized to access controlled technology under the United States Export Administration Regulations before beginning work.
Responsibilities
  • Manage the Process Preparation and Improvement group of Engineering, supervising two Team Leaders, two Technical Leaders, and a scope of approximately 20–30 Production Engineers.
  • Determine and drive the long-term vision and mission for the organization under the role’s supervision.
  • Develop employees, technical leaders, and team leaders in leadership capability, hard competence, and soft skills.
  • Represent Linkou Factory in cross-sector Engineering activity meetings, including activities related to efficiency improvement, transferring new products to high volume, and Engineering Change.
  • Influence key stakeholders and provide prompt support in decision-making.
  • Plan and execute the tooling capital budget.
  • Manage critical tasks and projects, including content and volume expansion, performance-bottleneck breakthroughs, and urgent escalations.
  • Present to senior ASML leaders to bridge discussions and support required decisions.
  • Support Engineering activities at the Linkou Factory, including driving efficiency improvement, resolving urgent escalations, managing impactful technical projects, and providing technical input for critical tasks.
  • Occasional business travel is required, comprising less than 10% of annual workdays.
  • Attend conference calls outside working hours when business needs arise.

About the company

A

ASML

View
Website

ASML designs and manufactures photolithography systems for semiconductor manufacturing. Its main products are deep ultraviolet (DUV) and extreme ultraviolet (EUV) lithography machines that print circuit patterns on silicon wafers, with EUV enabling smaller features. The company sells these systems to leading chipmakers and earns substantial revenue from installation, maintenance, and upgrades over the machines’ lifetimes. Its goal is to help continue scaling semiconductors by leading in high-end lithography and maintaining strong relationships with customers like TSMC, Samsung, and Intel.

Company Size

10,001+

Company Stage

IPO

Headquarters

Veldhoven, Netherlands

Founded

1984

Get referred to ASML

See people who can refer or advise you

Simplify Jobs

Simplify's Take

What believers are saying

  • Q2 2026 sales hit €9.3 billion, and full-year guidance rose to €43-45 billion.
  • Management said 2028 EUV output could exceed 110 tools, unlocking AI wafer capacity.
  • India launched ASML operations with Tata Electronics support, opening a new customer frontier.

What critics are saying

  • Europe bought zero ASML lithography tools in 2026, exposing a dead domestic demand base.
  • Chinese DUV entrants in Shanghai threaten ASML's 29% 2025 China revenue by 2027.
  • ASML cut 1,700 jobs in 2026; continued restructuring signals execution strain and morale damage.

What makes ASML unique

  • ASML alone ships EUV systems; no advanced chip node exists without Veldhoven tools.
  • High-NA EUV expands into Nvidia-scale data-center chips, extending ASML's moat through 2033.
  • Installed Base Management generated €2.8 billion in Q2 2026, deepening recurring revenue.

Help us improve and share your feedback! Did you find this helpful?

Benefits

  • Flexible Work Hours
  • Remote Work Options

Growth & Insights and Company News

Headcount

6 month growth

0%

1 year growth

0%

2 year growth

0%
Yahoo Finance
Oct 20th, 2026
Apple vs ASML: $416.2B revenue against 15.6% growth and a 29.4% margin

Apple and ASML offer two ways to bet on tech: one sells devices to billions of users, the other makes the lithography machines that chipmakers need to produce advanced semiconductors. In fiscal 2025, Apple's revenue reached nearly $416.2 billion, up about 6.4%. Net income was close to $112 billion, a 26.9% margin, and free cash flow was roughly $98.8 billion. Its debt-to-equity ratio was about 1.5. ASML reported revenue of nearly $36.8 billion, up 15.6%. Net income was $10.8 billion, a margin of about 29.4%, with free cash flow of roughly $12.5 billion. ASML's debt-to-equity ratio was about 0.2, and its current ratio was nearly 1.3, against Apple's 0.9.

Neoteo
Oct 16th, 2026
SemiAnalysis says ASML may be developing a hybrid-bonding tool.

SemiAnalysis says ASML may be developing a hybrid-bonding tool. A patent-based analysis describes a possible die-to-wafer process; ASML had not announced a tool as of October 15, 2026. October 16, 2026 Key points * 01 SemiAnalysis inferred that ASML may be developing a die-to-wafer hybrid-bonding tool; ASML had not announced it as of October 15, 2026. * 02 SemiAnalysis counted 27 ASML bonding patent families filed from December 2022 through November 2024, mostly related to D2W bonding. * 03 The proposed track-based process and its potential technical advantages are SemiAnalysis's interpretation, not measured tool results. * 04 SemiAnalysis expects advanced logic could be the first application; it forecasts D2W adoption in HBM no earlier than 2029, if it happens at all. SemiAnalysis says ASML may be developing a die-to-wafer hybrid-bonding tool. Its proposed process and potential impact on Besi remain unconfirmed. SemiAnalysis said on October 15, 2026, that ASML may be developing a die-to-wafer (D2W) hybrid-bonding tool, drawing that inference from patent filings, roadmap material and earlier reporting. ASML had not announced the tool as of the analysis. Read SemiAnalysis's analysis. Reuters reported on October 16 that ASML did not confirm the development and declined to comment on the report. Read the Reuters report. What the reporting says about ASML. SemiAnalysis counted 27 ASML bonding patent families filed between December 2022 and November 2024, most related to D2W bonding. It also cited The Elec reporting that ASML had begun architecture design with Prodrive Technologies and VDL ETG. These reports inform SemiAnalysis's inference; they do not amount to an ASML product announcement. The proposed tool is specifically a die-to-wafer bonder: individual semiconductor dies would be bonded to a wafer. The central claim in the coverage traces to SemiAnalysis's analysis. Investing.com summarized that analysis, while Reuters reported on it; those accounts do not constitute separate technical confirmation. How SemiAnalysis describes the proposed process. In SemiAnalysis's interpretation of patent material, each die would travel on an individual holder along a track, passing through inspection, cleaning, plasma activation, metrology and alignment before bonding to a wafer. The analysis suggests that independent shuttles could let stations work concurrently, that adding stations could increase capacity, and that recipes could accommodate different die types. Those are proposed design possibilities, not measured results. SemiAnalysis identifies alignment accuracy and particle control as potential advantages, while also pointing to engineering challenges involving feed-forward metrology, die-to-wafer contact, adapting non-bonding tools to the track and keeping the process loop clean. Why a possible tool could matter to Besi. SemiAnalysis describes Besi as the only supplier with D2W tools in volume production and says its logic-bonding business is concentrated at TSMC and Intel. If ASML develops a competing tool, Besi could face a new rival in that segment. SemiAnalysis expects advanced logic to be the likeliest first application for a prospective ASML tool. Its forecast for D2W bonding in high-bandwidth memory (HBM) is no earlier than 2029, if adoption happens at all. Other Languages Read this article in another available language.

MarketScreener
Oct 16th, 2026
Besi shares fall on report ASML is working on rival hybrid bonding product.

Besi shares fall on report ASML is working on rival hybrid bonding product. Published on 10/16/2026 at 06:54 am EDT - Modified on 10/16/2026 at 06:55 am EDT AMSTERDAM, Oct 16 (Reuters) - Shares in computer chip packaging equipment maker BE Semiconductor Industries (Besi) fell 3% on Friday after influential semiconductor research firm SemiAnalysis reported that one of the company's main growth products will face competition from bigger rival ASML. The SemiAnalysis report analysed 27 patent filings by ASML, which it said indicated ASML was developing a hybrid bonding product. Besi is a fraction of the size of ASML, the biggest maker of equipment used to make semiconductors, but Besi is a leader in hybrid bonding, an advanced packaging technology being used to create a new generation of more powerful three-dimensional chips. ASML has not confirmed it is developing such a tool. Besi did not respond to requests for comment. Besi shares were down 3% at EUR158.50, while ASML was up 1.1% at EUR1,480 in midday Amsterdam trading. A spokesperson for ASML declined to comment on the SemiAnalysis report but pointed to the company's launch of its first advanced packaging tool last year. "We continue to look at which directions the 3D integration industry will evolve... and where ASML's expertise can be of additional value," the company said in a statement at that time. In March, Reuters reported that ASML was planning additional packaging tools, citing Chief Technical Officer Marco Pieters in an interview. "The semiconductor market has already signalled that packaging is one of those next frontiers where performance gains can be unlocked, and ASML seems to be building next-gen tools headed in the same direction," said Nick Rossolillo, co-founder of Chip Stock Investor. "We see the new batch of packaging tools, beyond an EUV pipeline, as critical to pulling off the growth needed to justify (ASML's) elevated valuation." (Reporting by Toby Sterling; Editing by Susan Fenton) (C) Reuters - 2026

Channel NewsAsia
Oct 16th, 2026
Besi shares fall on report ASML is working on rival hybrid bonding product.

Besi shares fall on report ASML is working on rival hybrid bonding product. 16 Oct 2026 06:51PM (Updated: 16 Oct 2026 06:54PM) Add CNA as a trusted source to help Google better understand and surface our content in search results. AMSTERDAM, Oct 16: Shares in computer chip packaging equipment maker BE Semiconductor Industries (Besi) fell 3 per cent on Friday after influential semiconductor research firm SemiAnalysis reported that one of the company's main growth products will face competition from bigger rival ASML. The SemiAnalysis report analysed 27 patent filings by ASML, which it said indicated ASML was developing a hybrid bonding product. Besi is a fraction of the size of ASML, the biggest maker of equipment used to make semiconductors, but Besi is a leader in hybrid bonding, an advanced packaging technology being used to create a new generation of more powerful three-dimensional chips. ASML has not confirmed it is developing such a tool. Besi did not respond to requests for comment. Besi shares were down 3 per cent at €158.50, while ASML was up 1.1 per cent at €1,480 in midday Amsterdam trading. A spokesperson for ASML declined to comment on the SemiAnalysis report but pointed to the company's launch of its first advanced packaging tool last year. "We continue to look at which directions the 3D integration industry will evolve... and where ASML's expertise can be of additional value," the company said in a statement at that time. In March, Reuters reported that ASML was planning additional packaging tools, citing Chief Technical Officer Marco Pieters in an interview. "The semiconductor market has already signalled that packaging is one of those next frontiers where performance gains can be unlocked, and ASML seems to be building next-gen tools headed in the same direction," said Nick Rossolillo, co-founder of Chip Stock Investor. "We see the new batch of packaging tools, beyond an EUV pipeline, as critical to pulling off the growth needed to justify (ASML's) elevated valuation."

WZUU
Oct 16th, 2026
Besi shares fall on report ASML is working on rival hybrid bonding product.

Besi shares fall on report ASML is working on rival hybrid bonding product. By Thomson Reuters Oct 16, 2026 | 6:51 AM AMSTERDAM, Oct 16 (Reuters) - Shares in computer chip packaging equipment maker BE Semiconductor Industries (Besi) fell 3% on Friday after influential semiconductor research firm SemiAnalysis reported that one of the company's main growth products will face competition from bigger rival ASML. The SemiAnalysis report analysed 27 patent filings by ASML, which it said indicated ASML was developing a hybrid bonding product. Besi is a fraction of the size of ASML, the biggest maker of equipment used to make semiconductors, but Besi is a leader in hybrid bonding, an advanced packaging technology being used to create a new generation of more powerful three-dimensional chips. ASML has not confirmed it is developing such a tool. Besi did not respond to requests for comment. Besi shares were down 3% at €158.50, while ASML was up 1.1% at €1,480 in midday Amsterdam trading. A spokesperson for ASML declined to comment on the SemiAnalysis report but pointed to the company's launch of its first advanced packaging tool last year. "We continue to look at which directions the 3D integration industry will evolve... and where ASML's expertise can be of additional value," the company said in a statement at that time. In March, Reuters reported that ASML was planning additional packaging tools, citing Chief Technical Officer Marco Pieters in an interview. "The semiconductor market has already signalled that packaging is one of those next frontiers where performance gains can be unlocked, and ASML seems to be building next-gen tools headed in the same direction," said Nick Rossolillo, co-founder of Chip Stock Investor. "We see the new batch of packaging tools, beyond an EUV pipeline, as critical to pulling off the growth needed to justify (ASML's) elevated valuation." (Reporting by Toby Sterling; Editing by Susan Fenton) Now Playing WZUU 92.5 - Kalamazoo's Music Authority Fri Oct 16 Kalamazoo, MI, USA Wind/Dir: 30 MPH-NW Humidity: 94%