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Micron Technology

Makes memory and storage chips for AI and PCs

Electrical Engineer Intern

Silicon & ASIC DesignConfirmed live in the last 24 hours
Internship · Winter 2026Boise, ID, USANo salary listedIn-person

About the Job

Requirements

  • Currently pursuing a Master of Science or Ph.D. in Electrical Engineering, Computer Engineering, or a related technical field.
  • Expected graduation date of Fall 2025 or later.
  • Demonstrated knowledge of very-large-scale integration design, semiconductor device physics, and complementary metal-oxide-semiconductor fundamentals.
  • Experience with artificial-intelligence-enabled tools, including Claude AI Agents, and data analysis methodologies.
  • Familiarity with circuit simulation tools such as HSPICE, FineSim, or equivalent electronic design automation platforms.
  • Strong analytical, problem-solving, and communication skills.

Responsibilities

  • Evaluate emerging DRAM technologies and analyze their impact on future product architectures and design tradeoffs.
  • Perform transistor-level simulations and circuit benchmarking using industry-standard electronic design automation tools such as HSPICE and FineSim.
  • Develop and utilize Claude AI-based automation workflows and data analysis processes to improve simulation efficiency and engineering productivity.
  • Analyze technical data and communicate insights through presentations and reports that support technology development decisions.
  • Collaborate with device engineering, modeling, process integration, and circuit design teams on multifunctional projects.

Desired Qualifications

  • Coursework in complementary metal-oxide-semiconductor modeling, advanced semiconductor devices, digital circuit design, or semiconductor process technology.
  • Experience with scripting languages and automation tools used for engineering workflows.
  • Experience applying artificial intelligence, agentic artificial intelligence, or AI-assisted solutions to improve data analysis, simulation, or engineering productivity.
  • Exposure to machine-learning-based data analysis techniques.
  • Experience presenting technical findings and collaborating in multifunctional engineering environments.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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