Simulation Engineer - Mechanical & Thermal Systems

At Microsoft Quantum, we aim to empower science and scientists to solve the world’s biggest problems by realizing advanced computing platforms at the intersection of high-performance computing, artificial intelligence, and quantum information technology. Microsoft Quantum will change the world of computing and help solve some of humankind’s currently unsolvable problems. For more information about our team, visit https://www.microsoft.com/en-us/quantum.

The Cryomechanical team enables Microsoft Quantum’s hardware roadmap by designing, integrating, and sustaining cryogenic mechanical systems, packaging solutions, and laboratory infrastructure that support reliable experimentation, scalable system integration, and disciplined transition from research concepts to producible hardware.

As a Simulation Engineer – Mechanical & Thermal Systems, you will lead mechanical, structural, thermal, and coupled multiphysics analysis for cryogenic hardware and laboratory systems using COMSOL Multiphysics and ANSYS. You will translate system requirements and design concepts into verified computational models, quantify margins and sensitivities, correlate predictions with test data, and deliver clear engineering recommendations that guide architecture, detailed design, manufacturing, integration, and root-cause investigations throughout the product lifecycle.

Microsoft’s culture is grounded in a growth mindset, customer obsession, diversity and inclusion, one Microsoft collaboration, and making a difference through technology. In this role, you will be expected to model these values by learning continuously, partnering across disciplines, communicating clearly, and creating an inclusive environment where rigorous engineering and shared accountability help the team deliver meaningful impact.

• Own end-to-end mechanical and thermal analysis for cryogenic subassemblies and top-level integrations, including millikelvin (mK), 4 kelvin (4 K), and ambient-temperature structures, radiation shields, vacuum interfaces, thermal straps, supports, and cable or harness routing hardware.
• Develop and maintain high-fidelity finite element and multiphysics models in COMSOL Multiphysics and ANSYS Mechanical, including defensible geometry idealization, material models, contacts, interfaces, meshing strategies, loads, boundary conditions, solver controls, and post-processing methods.
• Perform structural, thermal, and coupled thermo-mechanical analyses, including linear and nonlinear stress, stiffness, deflection, buckling, modal and vibration response, steady-state and transient heat transfer, thermal contact resistance, radiation, and thermal stress caused by coefficient of thermal expansion (CTE) mismatch.
• Translate system and subsystem requirements into analysis plans and acceptance criteria for heat-load budgets, temperature stability, thermal anchoring, structural margins, alignment, vacuum loading, vibration isolation, interface loads, and performance across temperature stages.
• Verify, validate, and correlate simulation results through mesh-convergence studies, sensitivity and uncertainty analyses, hand calculations, analytical benchmarks, and comparison with instrumentation, prototype, and system-level test data.
• Drive design decisions through clear technical communication by presenting assumptions, methods, limitations, margins, risks, and recommendations at design reviews; partner with mechanical designers, thermal engineers, physicists, electrical engineers, manufacturing teams, and suppliers to close issues and improve designs.
• Build reusable simulation capability and engineering discipline by creating model templates, material-property libraries, documented workflows, review checklists, and automation for parametric studies and results processing; support root-cause investigations
• Other:
  • Embody our Culture and Values.

Required Qualifications:

• Doctorate in Physics, Engineering, or related field AND 1+ year(s) experience in industry or in a research and development environment, could include completion of a post doctoral research position
  • OR Master's Degree in Physics, Engineering, or related field AND 4+ years experience in industry or in a research and development environment
  • OR Bachelor's Degree in Physics, Engineering, or related field AND 6+ years experience in industry or in a research and development environment
  • OR equivalent experience.

Other Requirements:

Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to the following specialized security screenings:

• Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
• Citizenship & Citizenship Verification: This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their U.S. permanent residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate’s citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.

Additional or Preferred Qualifications

• Doctorate in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 3+ years technical engineering experience
  • OR Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 6+ years technical engineering experience
  • OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 8+ years technical engineering experience
  • OR equivalent experience
• 3+ years of experience performing mechanical, structural, thermal, or coupled multiphysics simulation for complex hardware systems, ideally spanning cryogenic through ambient-temperature operation.
• 3+ years of advanced experience using ANSYS Mechanical and COMSOL Multiphysics for steady-state and transient thermal analysis, nonlinear structural analysis, contact, modal response, vibration, and coupled thermo-mechanical simulation.
• Experience modeling cryogenic systems and low-temperature hardware, including temperature-dependent material properties, thermal contraction, thermal contact conductance, conductive and radiative heat transfer, heat-load budgets, and thermal anchoring.
• Experience correlating simulation predictions with test data using temperature sensors, strain or displacement measurements, vibration data, or other instrumentation; ability to identify discrepancies and improve model fidelity.
• Experience with parametric studies, design optimization, uncertainty quantification, surrogate modeling, or automation using MATLAB, Python, APDL, Java, or comparable scripting and application interfaces.
• Experience working with CAD and product-development toolchains, including geometry preparation, defeaturing, material and configuration control, and collaboration with design, manufacturing, test, and supplier teams.
• Experience contributing to inclusive, cross-disciplinary engineering teams by communicating decisions clearly, inviting diverse perspectives, mentoring others in simulation practices, and helping create an environment where team members can contribute effectively and succeed.
• Advanced experience with COMSOL Multiphysics and/or ANSYS Mechanical, including independent model setup, solution, convergence assessment, results interpretation, and technical documentation for mechanical and thermal systems.
• Deep foundation in finite element analysis and engineering mechanics, including solid mechanics, heat transfer, materials behavior, numerical methods, contact, and coupled thermal-structural response.
• Demonstrated model-verification discipline, including mesh-independence studies, sensitivity analysis, analytical checks, appropriate simplification, and transparent documentation of assumptions and limitations.
• Design review leadership and technical communication with the ability to convert complex simulation results into actionable recommendations, requirements, risk assessments, and decisions for cross-disciplinary engineering teams.
• Ability to leverage artificial intelligence (AI) tools to drive innovation and efficiency, including simulation workflow automation, reduced-order modeling, optimization, research synthesis, results analysis, and day-to-day task automation.
• Ability to work in an artificial intelligence (AI)-first environment using modern artificial intelligence (AI) tools to accelerate model development, engineering insight, and hardware design iteration.

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