Kulicke & Soffa designs, manufactures, and sells capital equipment and tools for assembling semiconductor devices. Its products include ball bonders that use ultrasonic energy to attach fine wires to a die, thermo-compression bonding systems for high-density interconnects, and SMT/die-attach equipment for electronic assembly. The company differentiates itself with a long history since 1951, a broad portfolio, a strong Asia-Pacific footprint, and a steady after-market parts and service business. Its goal is to enable mass production of semiconductors by delivering reliable, high-precision packaging and assembly solutions that help customers scale manufacturing and maintain uptime.
Company Size
1,001-5,000
Company Stage
IPO
Headquarters
Singapore, Singapore
Founded
1951
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