Packaging Design Integration Engineer

About GlobalFoundries

GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

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We offer many full-time employment paths for recent graduates, which provide accelerated training in a fast-paced work environment, cross-functional working opportunities, and talent mobility. New college graduates are provided with mentorship, networking, and leadership opportunities, which give our new team members life-long connections and skills.

Summary of Role

GlobalFoundries isseekinga highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Design Integration Engineer. In this role, you will collaborate with experienced engineers and cross-functional teams to support chip package co-design activities for electro-optical transceivers using GF’sPhotonixplatform and advanced 2.5D/3D packaging technologies.

The engineer will contribute to thermal, mechanical, electrical, and optical design integration activities, including design rule development, simulation/modeling support, manufacturability assessments, and reliability-focused designcharacterization. This role offers hands-on exposure to next-generation packaging solutions while building technical depth in silicon photonics, advanced packaging design, and engineering analysis.

Essential Responsibilities include:

• Support packaging design integration activities for silicon photonics and advanced packaging products.

• Assistwith thermal, mechanical, electrical, and optical chip package co-design analysis under the guidance of experienced engineers.

• Contribute to design rule development, manufacturability assessments, and design review preparation for new package technologies.

• Use engineering data, simulations, and characterization results to help evaluate design options andidentifyimprovement opportunities.

• Participate in cross-functional problem-solving efforts related to technical, yield, quality, and reliability concerns.

• Support development and documentation of design guidelines, technical reports, and presentation materials.

• Collaborate with design, product, process integration, manufacturing, quality, and supplier teams to support new customer products.

• Participate in continuous improvement initiatives focused on design quality, manufacturability, cost, and reliability.

Other Responsibilities

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Securityrequirementsand programs.

• Travelup to 10% to other GlobalFoundries facilities may be necessary. HM to confirm whether this should remain in posting.

Required Qualifications

• Education – Graduating with a Bachelor’s, Master’s, or PhD degree in Mechanical Engineering, Electrical Engineering, Materials Science Engineering, Chemical Engineering, Physics, Optical Engineering, or a related STEM discipline from an accredited degree program. HM to confirm final education level and majors.

• Must have at least an overall 3.0 GPA and proven good academic standing.

• Basic understanding of semiconductor packaging, silicon photonics, chip package co-design, modeling/simulation, materials science, reliability, or manufacturing processes gained through coursework, research, internships, co-ops, or academic projects.

• Demonstrated analytical and problem-solving skills.

• Experience analyzing experimental, simulation, or engineering data.

• Ability to work effectively within cross-functional teams.

• Language Fluency - English (Written & Verbal).

• Travel - Up to 10%. HM to confirm or remove.

Preferred Qualifications

• Priorrelated internship, co-op, research, or academic project experience in advanced packaging, silicon photonics, chip package interaction, thermal/mechanical/electrical/optical design, reliability engineering, or process integration.

• Familiarity with design or modeling tools such as HFSS,Zemax/Zmax,FloTHERM, finite element analysis, electrical simulation, optical simulation, or related engineering software. HM to confirm final tool names and whether these should berequiredor preferred.

• Knowledge of advanced packaging technologies including flip-chip, chiplets, 2.5D, or 3D integration.

• Familiarity with Design of Experiments (DOE), engineering statistics, or data analysis methods.

• Demonstrated prior leadership experience in the workplace, school projects, competitions, research groups, or student organizations.

• Project management skills,i.e.the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.

• Strong written and verbal communication skills.

• Strong planning and organizational skills.

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If you need a reasonable accommodation for any part of the employment process, please contact us by email at [email protected] and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.

An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.

GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.

All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law