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Micron Technology

Makes memory and storage chips for AI and PCs

ASIC Design Engineer - Dmts/Smts/Mts

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeHyderabad, Telangana, IndiaNo salary listedIn-person

About the Job

Requirements

  • Bachelor's or Master's degree or equivalent experience in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent proven experience.
  • Strong knowledge of VLSI and CMOS fundamentals, semiconductor build methodologies, and tradeoffs involving power consumption, efficiency, size, dependability, and manufacturability.
  • Hands-on experience with industry-standard EDA environments for implementation, timing, test, simulation, extraction, layout, verification, and signoff, such as Cadence Innovus and Virtuoso, Synopsys ICC2 and PrimeTime, Siemens Tessent, Cadence Tempus and Modus, or equivalent platforms.
  • Proficiency in Unix/Linux environments and one or more engineering programming or scripting languages such as Python, Tcl, SKILL, Shell, Perl, C/C++, Java, or Lisp.
  • Demonstrated ability to develop maintainable automation, debug complex design and flow issues, analyze engineering data, and drive designs to closure.
  • Demonstrated ability to use AI-assisted coding techniques to improve efficiency or automate design and analysis methodologies.

Responsibilities

  • Own the development, deployment, and support of scalable CAD tools, automation frameworks, design flows, and methodologies for NAND, DRAM, HBM, SoC, mixed-signal, and other advanced semiconductor products.
  • Develop, improve, and maintain infrastructure for circuit build capture, layout, simulation, characterization, implementation, physical verification, and signoff workflows.
  • Create robust software and scripts using Python, Tcl, SKILL, Shell, Perl, C/C++, Java, Lisp, or related languages to automate engineering workflows, analytics, and quality checks.
  • Evaluate and integrate advanced EDA technologies, AI-assisted engineering solutions, and emerging methodologies to improve productivity, scalability, and silicon quality.
  • Leverage AI tools to automate tools and workflows and apply artificial intelligence in workflows to improve build efficiency.
  • Lead implementation and signoff activities across physical design, static timing analysis, and design for test for complex digital, memory, SoC, or mixed-signal products.
  • Drive floor planning, power planning, placement, clock tree synthesis, routing, optimization, timing closure, and physical verification to meet power, performance, area, reliability, and schedule targets.
  • Own multi-mode, multi-corner timing signoff, including constraints, setup and hold analysis, timing exceptions, signal integrity, engineering change orders, and closure across implementation achievements.
  • Develop and implement design-for-test strategies, including scan insertion, automatic test pattern generation, memory built-in self-test, logic built-in self-test, compression, verification, and silicon bring-up support to achieve manufacturing test coverage goals.
  • Analyze and resolve congestion, IR drop, electromigration, clocking, signal integrity, and implementation issues throughout the design cycle.
  • Contribute to next-generation products through the design, optimization, and physical implementation of memory, logic, and analog circuits.
  • Lead custom layout activities, including floor planning, device placement, routing, matching, parasitic-aware optimization, and layout quality reviews.
  • Perform parasitic extraction and modeling, and support circuit simulation, design validation, reticle experiments, tape-out revisions, and post-layout correlation.
  • Complete layout and circuit verification using industry-standard simulation, extraction, design rule checking, layout versus schematic, and reliability verification tools.
  • Partner with architecture, RTL, circuit design, verification, methodology, process technology, modeling, standards, product engineering, probe, assembly, test, and marketing teams to ensure design readiness and manufacturability.
  • Drive standardization, documentation, training, user support, best-practice adoption, and continuous methodology improvement across global engineering teams.
  • Provide technical leadership, mentorship, and subject-matter expertise; influence tool, flow, and methodology roadmaps while solving complex multifunctional challenges.
  • Support tape-out, first-pass silicon success, production ramp, and interpersonal learning through focused execution and effective collaboration.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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