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Micron Technology

Makes memory and storage chips for AI and PCs

CMOS Device Integration and Modeling Lead - MTS

Hardware EngineeringPosted on Nov 12
Full-timeBoise, ID, USANo salary listedIn-person

About the Job

Requirements

  • M.S. or Ph.D. in Electrical Engineering, Physics, Materials Science, or a related semiconductor field.
  • Strong knowledge of advanced CMOS device physics and process integration, including FEOL, MOL, BEOL, and their impact on performance, power, reliability, variability, and design margins.
  • Experience with electrical characterization and interpretation of parameters such as Vt, Idlin/Idsat, Ioff, subthreshold slope, mobility/effective drive, leakage, and parasitic resistance/capacitance.
  • Experience with silicon test structures, test-chip planning, design of experiments, statistical analysis, process variability characterization, and manufacturing control methodologies.
  • Familiarity with CMOS compact modeling, model-to-silicon correlation, MOL/BEOL parasitic extraction, and collaboration across device, integration, modeling, characterization, manufacturing, DTCO, and circuit-design teams.

Responsibilities

  • Lead CMOS device and process-integration development, optimization, and characterization across advanced nodes, including FEOL, MOL, and BEOL interactions.
  • Define technology targets, electrical acceptance criteria, characterization strategies, and silicon-to-model correlation requirements across technology maturity levels.
  • Develop test structures, design-of-experiments and sampling strategies, and electrical monitors to quantify variability, detect process excursions, and improve process control.
  • Partner with modeling, manufacturing, DTCO, and circuit-design teams to connect silicon capability, compact/interconnect models, design assumptions, and technology specifications.
  • Apply statistical analysis, automation, and AI/ML methods to large electrical and process datasets to identify performance limiters, root causes, variability drivers, and opportunities for technology optimization.

Desired Qualifications

  • Experience defining technology targets, silicon characterization strategies, electrical control limits, and line-monitoring methodologies through multiple stages of technology maturity.
  • Demonstrated ability to translate complex silicon behavior, process distributions, and physical mechanisms into actionable technology specifications and design guidance.
  • Experience developing statistically meaningful test structures and measurement strategies for device, MOL, BEOL, variability, reliability, or process-sensitive characterization.
  • Experience using AI-assisted analytics to enhance data interpretation, anomaly detection, and yield improvement initiatives.
  • Proficiency with AI/ML, data analytics, automation, and generative AI tools to accelerate silicon characterization, root-cause analysis, engineering documentation, and silicon-to-model-to-design learning.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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