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Micron Technology

Makes memory and storage chips for AI and PCs

Director Die Level Technology Process Development - APTD

Process EngineeringConfirmed live in the last 24 hours
Full-timeBoise, ID, USANo salary listedIn-person

About the Job

Requirements

  • A master's degree in Chemistry, Chemical Engineering, Materials Science, or a related field, or equivalent experience.
  • At least 15 years of experience in semiconductor process development, manufacturing, or advanced packaging.
  • Deep expertise in wafer-level or die-level processes such as chemical mechanical planarization (CMP), etch, cleans, thin films, lithography, hybrid bonding, thermocompression bonding (TCB), dicing, or molding.
  • Strong understanding of semiconductor process integration and materials interactions.
  • Proven experience leading complex cross-functional technical programs.

Responsibilities

  • Own advanced packaging process technologies across wafer-level and die-level modules from pathfinding through manufacturing readiness.
  • Develop and mature novel process flows, materials, and integration schemes that meet electrical, mechanical, thermal, cost, and reliability needs.
  • Lead first-of-a-kind (FOAK) development, supplier engagement, and ecosystem collaboration to close capability gaps and accelerate learning.
  • Drive structured problem solving for multi-domain technical challenges and guide strategic decisions across programs.
  • Lead technology transfer to manufacturing and influence packaging and integration decisions across product teams.
  • Leverage AI-enabled tools, automation, data analytics, and advanced modeling methods to accelerate process development, strengthen decision-making, and improve technical outcomes across advanced packaging programs.

Desired Qualifications

  • A PhD in a relevant technical field.
  • Extensive experience with advanced memory technologies or 3D packaging architectures.
  • Experience mentoring other engineers and driving technical methodology improvements.
  • Familiarity with materials characterization and thermal, mechanical, or electrical simulation.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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