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Micron Technology

Makes memory and storage chips for AI and PCs

HBM SoC Register-Transfer Level Design Engineer

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeFolsom, CA, USAIn-person

About the Job

Requirements

  • A bachelor's or master's degree in electrical engineering, computer engineering, or a related field, with a minimum of 3 years of experience in a related field.
  • Proficiency in SystemVerilog and Verilog, and familiarity with SoC integration methodologies.
  • Experience with the RTL-to-GDS flow, including synthesis, static timing analysis, and design sign-off considerations.
  • Familiarity with EDA tools from Cadence, Synopsys, and/or Siemens.
  • Programming or scripting experience with Python, TCL, Perl, or shell scripting.

Responsibilities

  • Design and implement RTL for SoC-level blocks and subsystems used in HBM logic die.
  • Integrate internal and third-party IP, including controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, and PHY-adjacent logic.
  • Collaborate with SoC architects to translate architectural and micro-architectural specifications into high-quality RTL implementations.
  • Participate in SoC-level integration activities, including clocking, reset, power intent, and configuration infrastructure.
  • Assist with pre-silicon validation and post-silicon bring-up, including root-cause analysis of silicon issues.
  • Contribute to design documentation, block specifications, and design reviews.
  • Collaborate with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure robust and manufacturable builds.
  • Enable and integrate AI-driven tools and AI-enabled workflows into the team's methodologies.

Desired Qualifications

  • Experience with HBM, DRAM, or memory-centric SoC designs.
  • Familiarity with high-speed interfaces, clocking strategies, reset architectures, and power management concepts.
  • Exposure to DFT concepts, including scan, MBIST, BIRA/BISR, and debug.
  • Experience with hardware emulation or acceleration platforms such as Palladium, Veloce, or Zebu.
  • Good understanding of Agentic AI or willingness to learn Agentic AI to help develop efficient workflows.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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