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Black Semiconductor

Graphene photonics enable optical chip interconnects

Senior Automated Test Equipment Test Engineer

Hardware Validation & TestingConfirmed live in the last 24 hours
Full-timeAachen, GermanyHybrid

About the Job

Requirements

  • A Master's degree or Ph.D. in Engineering, Physics, or a related technical discipline is required.
  • At least five years of hands-on experience setting up and operating automated test equipment systems, including wafer probers and probe card specification, qualification, and integration.
  • Strong programming skills in Java and Python for test automation, instrument control, and automated data collection.
  • Hands-on experience performing electrical, optical, and electro-optical measurements on electronic integrated circuit and photonic integrated circuit devices.
  • A sound understanding of photonic integrated circuit and/or electronic integrated circuit device structures and operation, including electronic-integrated-circuit-to-photonic-integrated-circuit interface architectures.
  • Practical knowledge of design-for-test methodologies and their implementation in integrated circuits.
  • A proven track record of transferring laboratory test methods and device characterization into production environments.
  • Proficiency in data processing, statistical analysis, and visualization using Python, Java, or LabVIEW, with experience applying statistical process control and monitoring yield, process performance, and reliability.
  • Knowledge of supplier management, incoming material characterization, and vendor qualification processes.

Responsibilities

  • Set up, qualify, and calibrate automated test equipment test cells, ensuring readiness for high-volume wafer testing.
  • Develop and debug automated test programs for direct-current, radio-frequency, optical, and electro-optical device characterization, including new measurement methods.
  • Own probe card specifications, design, qualification, and integration, alongside associated interface hardware, in collaboration with vendors.
  • Collaborate across teams to define comprehensive measurement plans and contribute to design-for-test implementation.
  • Collect, analyze, and report wafer-level measurement data to determine pass/fail outcomes and support yield monitoring, reliability testing, and failure analysis.
  • Transfer laboratory characterization methods into production by developing automated test protocols and equipment specifications for manufacturing integration.
  • Optimize test throughput while maintaining measurement accuracy and reliability.
  • Work with manufacturing engineering to implement statistical process control, improve yield, and strengthen test efficiency and data analytics.
  • Support supplier qualification, vendor evaluation, and incoming material characterization.
  • Create test documentation and training materials, ensuring procedures meet industry standards and customer quality requirements.

Desired Qualifications

  • Experience in a fast-paced startup or semiconductor manufacturing environment is preferred.
  • Advanced knowledge of optoelectronic device physics, graphene-based devices, and semiconductor operating principles is an advantage.
  • Familiarity with photonic component qualification methodologies and industry reliability testing standards is a plus.
  • Experience characterizing and testing optoelectronic or semiconductor packaging is an advantage.
  • Radio-frequency or high-speed testing experience is a plus.

About the Company

Black Semiconductor

Graphene photonics enable optical chip interconnects

Black Semiconductor develops graphene-based photonics that integrate optical components into the outer layers of CMOS-like chips, enabling direct optical chip-to-chip communication. It works by using graphene as a translator to convert electronic signals to optical signals and back, so electrons on silicon can talk to photons through integrated photonic interconnects. This approach differs from traditional silicon photonics or pure electronic interconnects by being CMOS-compatible, wafer-scale, and capable of linking multiple chips as a single high-performance unit while reducing production steps by about 60%. The company aims to move from pilot production to mass manufacturing, building a 300mm wafer facility (FabONE) in Aachen, with pilot production by 2027 and mass production by 2031, backed by a large European funding round and investors.

Company size
51-200
Company stage
Series A
Total funding
$287.4M
Headquarters
Aachen, Germany
Founded
2020

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