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Micron Technology

Makes memory and storage chips for AI and PCs

Electrical Failure Analysis Engineer

Process EngineeringConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • Bachelor’s or Master’s degree in Electronics, Microelectronics, Material Science, Physics, or Applied Science.
  • Knowledge of circuit analysis and layout tracing, yield analysis, and failure mechanisms.
  • Strong understanding of NAND memory operation and architecture, CMOS device physics, and wafer fabrication processes.
  • Hands-on experience in electrical failure analysis, bench characterization, probe testing, test flow understanding, data analysis, and design of experiments (DOE) methodology.
  • Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and achieving business outcomes.
  • Ability to communicate effectively in writing and verbally across all levels.
  • Ability to manage multiple complex projects and drive them to completion.
  • Strong teamwork skills and ability to build peer relationships.
  • Excellent problem-solving and analytical skills.

Responsibilities

  • Perform electrical failure analysis using bench characterization to identify failure mechanisms at die, circuit, and transistor levels.
  • Construct failure models and develop root-cause understanding for yield excursions, reliability issues, and customer return cases.
  • Design and execute bench design-of-experiments and probe-engineering experiments to validate hypotheses and drive yield and quality improvement.
  • Translate characterization results into test, process, or device optimization solutions to improve yield, reliability, and product quality.
  • Conduct circuit and layout tracing analysis to correlate electrical failure signatures with physical or process limitations.
  • Support new product introduction qualification and high-volume manufacturing issue resolution to ensure timely product release and manufacturing stability.
  • Drive data-driven yield improvement programs through collaboration with cross-functional teams, including PI, TD, PE, TSE, and YE.
  • Troubleshoot complex issues across test conditions, probe limitations, and device design interactions.
  • Develop custom test conditions, scripts, and methodologies for advanced failure validation and experiment execution.
  • Contribute to process capability improvement and cost-reduction initiatives by resolving abnormal manufacturing behaviors.
  • Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness while exercising sound judgment and complying with organizational standards and legal requirements.
  • Identify, test, and share AI-enabled enhancements within the scope of work to support continuous improvement.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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