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Lumilens

Photonic interconnects for AI infrastructure

Analog and Mixed Signal Layout Engineer

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeBengaluru, Karnataka, IndiaNo salary listedIn-person

About the Job

Requirements

  • A BE/B.Tech or MS/M.Tech in Electrical/Electronics Engineering, Microelectronics, or a related field, with 5–10 years of experience in analog, mixed-signal, RF, or custom layout development.
  • Hands-on experience with layouts for SerDes, data converters, clocking circuits, power management, transceiver building blocks, or related connectivity IPs.
  • Proven experience in full-custom layout and signoff, including RC extraction, DRC, LVS, ERC, DFM, and EMIR.
  • Experience with advanced semiconductor technologies, including CMOS, FinFET, BiCMOS, or SiGe.
  • Strong understanding of semiconductor process technologies, device physics, and layout-dependent effects.
  • Proficiency with Cadence Virtuoso and industry-standard EDA tools.
  • Experience leveraging automation, scripting, or AI-assisted methodologies to improve layout productivity and quality.
  • Solid understanding of layout techniques including matching, shielding, clock distribution, power planning, ESD protection, latch-up prevention, manufacturability, and reliability-aware design.
  • Demonstrated success delivering complex layouts through tapeout.
  • Ability to work effectively with globally distributed design, verification, CAD, and technology teams.
  • Experience supporting multiple projects in a fast-paced product development environment.

Responsibilities

  • Develop high-speed connectivity IPs using advanced semiconductor process technologies.
  • Design and implement complex analog, mixed-signal, and RF layouts for high-performance connectivity IPs, including floorplanning, device placement, and routing.
  • Work closely with circuit designers to translate schematics into robust physical implementations from floorplanning through tapeout.
  • Own physical verification and signoff closure, including DRC, LVS, ERC, antenna, DFM, and EMIR.
  • Optimize layouts using extraction results to meet performance, matching, noise, and reliability targets.
  • Contribute to layout reviews and help drive effective layout methodologies and best practices.
  • Improve layout productivity and quality through automation, scripting, and AI-assisted workflows.
  • Develop high-performance connectivity IPs used in AI, networking, and next-generation compute systems.

Desired Qualifications

  • Exposure to silicon photonics, co-packaged optics (CPO), near-package optics (NPO), optical transceivers, or high-bandwidth connectivity solutions.

About the Company

Lumilens

Photonic interconnects for AI infrastructure

Lumilens designs and manufactures optical interconnect products to accelerate AI infrastructure. It provides high-density photonic interconnects—such as high-density pluggable, near-packaged, and co-packaged optics—built with in-house silicon photonics to scale GPU clusters in AI data centers. Its products include 800G and 1.6T optical transceivers for AI networking, and it is pursuing broader integration like Electrical-Optical Interposers through a strategic partnership with POET Technologies. The company differentiates itself through vertical integration, custom robotics-driven manufacturing, and AI-optimized production processes that aim to improve yield and supply chain stability. Lumilens targets hyperscalers and large AI providers, seeking to move interconnect bottlenecks from compute to scalable, efficient data-center networks. Its goal is to enable faster, denser GPU connectivity to support growing AI workloads and models.

Company size
51-200
Company stage
Series C
Total funding
$839.5M
Headquarters
San Jose, CA
Founded
2024

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