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Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Senior Staff Product Engineer - Power / Analog

Hardware Validation & TestingConfirmed live in the last 24 hours
Full-timeBengaluru, Karnataka, IndiaNo salary listedIn-person

About the Job

Requirements

  • A bachelor's degree in electronics, electrical, materials, or physics engineering is required.
  • At least 10 years of semiconductor experience spanning product engineering, NPI, manufacturing, and test is required, or at least 8 years with an advanced degree; concept-to-mass-production ownership of at least one product is essential.
  • Power or analog product experience with high-voltage or high-current devices, drivers, regulators, power management, or similar products is required.
  • A strong grasp of analog and power device behavior, including driver stages, regulators, references, and protection circuits, and how they vary across process, voltage, and temperature is required.
  • Practical understanding of wafer fabrication, assembly, test, qualification, and production-release flows is required.
  • Experience managing engineering wafer starts, prototype builds, customer samples, inventory, and product bills of materials is required.
  • Familiarity with JEDEC and AEC-Q100 qualification standards, qualification hardware and software, and failure-analysis methods is required.
  • Experience working with external foundries, OSATs, and globally distributed teams is required.
  • Fluency with data and statistical methods for managing yield, quality, cycle time, and operational priorities is required.
  • Clear written and verbal communication, planning and coordination skills, and the ability to work under schedule pressure are required.

Responsibilities

  • Represent product, test, and package requirements in design reviews, including test access to analog nodes, trim and OTP strategy, diagnostic and self-test coverage, and multi-variant bond-out plans where one die serves several products.
  • Own package and thermal selection and the package development and qualification plan with the package team and OSAT, including power dissipation, junction-to-ambient and junction-to-case targets, exposed-pad considerations, and board-level reliability considerations.
  • Own the NPI schedule, milestone gates, and cross-functional risk register from concept through production release.
  • Own product cost, including die size and yield entitlement, test time, package, and the unit-cost roadmap across the product life.
  • Own qualification planning and execution in accordance with applicable JEDEC and AEC-Q100 requirements, including the appropriate stress set for power devices: HTOL, power/temperature cycling, and package-level reliability.
  • Prepare product-release documentation, datasheet parameter tables, and compliance evidence, including PPAP evidence where applicable.
  • Support functional-safety work products by ensuring production screens and characterization data substantiate FMEDA and safety-manual claims.
  • Monitor production data and apply statistical analysis to identify and correct yield, quality, and test-time deficiencies, and drive yield improvement.
  • Optimize PAT, SYL, SBL, SPC, and disposition limits to protect outgoing quality.
  • Work with planning, manufacturing, subcontractors, and operations to remove material-flow obstacles and recover schedule gaps.
  • Create and maintain product BOMs and lifecycle data in PLM systems such as Agile, and support fab transfer, process change, and BOM change activities.
  • Support customer-return and RMA investigations by reproducing failures and assessing production test coverage, including electrical overstress and field-stress modes typical of power devices.
  • Own the product through end of life, including last-time-buy and discontinuation planning.
  • Provide technical direction and sign off reviews across design, product engineering, operations, suppliers, and OSAT teams, including DFX topics.
  • Act as the escalation point for product-level technical decisions and drive risk resolution to closure.
  • Influence cross-functional teams without direct authority and communicate with stakeholders at every level.
  • Mentor product and test engineers and raise the standard of product engineering practice across programs.

Desired Qualifications

  • An advanced degree is welcome.
  • Automotive power/analog experience, including AEC-Q100 Grade 1 or 0, tri-temperature production test, IATF 16949, and PPAP environments.
  • ISO 26262 exposure, including production screens and characterization traced to FMEDA claims and safety-related release evidence.
  • Experience with a multi-variant die, including bond-out or package derivatives sharing one base silicon.
  • Thermal modeling and SOA analysis experience for power devices.
  • PLM and yield-management tooling such as Agile, PDF Exensio, JMP, or equivalent.
  • Experience with a product from first silicon through a fab or OSAT transfer.

About the Company

Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Renesas manufactures and sells MCUs, SoCs, and analog/power semiconductor devices to OEMs, focusing on automotive, industrial, infrastructure, and IoT markets. Its chips are building blocks that run embedded software and manage power and signals, and its Winning Combinations offer pre-tested system architectures to speed up design. It differentiates itself by growing through acquisitions to offer a broad, integrated portfolio and by moving toward a unified digital design platform to reduce integration work. Its goal is to become a leading supplier of these components and provide a single platform for electronics design that speeds time-to-market.

Company size
10,001+
Company stage
IPO
Headquarters
Tokyo, Japan
Founded
2002

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