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Micron Technology

Makes memory and storage chips for AI and PCs

Staff Engineer - HIG-HBM Product Engineering, Media Health Manufacturing

Hardware Validation & TestingConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listed

About the Job

Requirements

  • A bachelor's or master's degree in Electrical and Electronics Engineering and at least 7 years of experience in the semiconductor industry.
  • Strong leadership and technical skills, especially problem-solving, root-cause analysis, and solution development through in-depth circuit analysis.
  • Knowledge of statistics, data analysis tools, and scripting.
  • Ability to adapt to different roles in a dynamic working environment, from leading the team to leading technical programs.
  • A proven track record of collaborative work within and across teams to address sophisticated business and engineering problems.
  • A strong sense of responsibility and accountability toward assigned work, with a professional work ethic.
  • Excellent communication and presentation skills.
  • A passion for people leadership and ongoing learning and development in this area.

Responsibilities

  • Ensure optimized test coverage across current and future HIG HBM design architectures and process nodes for high-volume manufacturing.
  • Develop, validate, characterize, and qualify next-generation HBM products to ensure reliability and compliance with required standards.
  • Support design verification and in-depth circuit analysis of new products using computer-aided design tools and Verilog simulations.
  • Improve manufacturing test yields for DRAM, interface, and stacked-die issues; reduce test time; and resolve yield-related issues to reduce costs and meet yield targets.
  • Identify root causes and resolve manufacturing test flow issues, qualification issues, and return-material-authorization device issues.
  • Promote innovation and drive changes that provide a technical advantage.
  • Develop and mentor team members.
  • Develop project management skills within the team to support efficient project execution and timely delivery of technological solutions.
  • Make final decisions on risk analysis and project prioritization.
  • Improve productivity and efficiency by leveraging artificial intelligence tools.
  • Collaborate with Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams to develop and ship end products.
  • Work on site in Singapore and travel internationally to the United States, Taiwan, and Japan.

Desired Qualifications

  • Product Engineering experience.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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