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Micron Technology

Makes memory and storage chips for AI and PCs

Senior Advanced Packaging Technology Development Engineer - FILM process

Process EngineeringConfirmed live in the last 24 hours
Full-timeTaichung City, TaiwanNo salary listedIn-person

About the Job

Requirements

  • A Master’s degree or above in Chemistry, Physics, Material, or related engineering science fields; a PhD is a plus.
  • At least 3 years of FILM experience, including CVD or PVD, in a related industry.
  • Solid understanding of thin-film deposition principles.
  • Understanding of process characteristics including film uniformity, stress, adhesion, step coverage, and defect behavior.
  • Fluent communication in both English and Chinese.

Responsibilities

  • Drive HBM process development and yield improvement in the FILM process.
  • Assist with research and development of advanced package technology, including chip stacking, 2.5D, or 3D.
  • Support project on-site execution and make decisions as a technical consultant.
  • Troubleshoot complex problems, perform root cause analysis, and resolve process engineering issues.
  • Generate internal and external documentation for presentations and technical reports.
  • Align daily tasks with department and organizational goals and Technology Development needs.
  • Contribute expert input in materials characterization through cross-team project engagement.
  • Coordinate mechanical characterization for advanced packaging development globally, including sites in the United States, Japan, and Singapore.
  • Recommend test structure and test vehicle designs for material property evaluation.
  • Review, summarize, and present data with recommendations on materials, and lead discussions with packaging material suppliers to meet technology roadmaps.
  • Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness while exercising sound judgment and complying with organizational standards and legal requirements.
  • Identify, test, and share AI-enabled enhancements within the scope of work.
  • Use role-appropriate AI literacy and digital fluency responsibly for research, analysis, content creation, problem-solving, operational tasks, and business objectives.

Desired Qualifications

  • Hands-on experience with CVD/PVD production tools such as AMAT, LAM, or TEL.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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