Postdoctoral Researcher - Photonics Devices
About the job
- A PhD degree in Physics, Communications, Electrical/Electronic Engineering, or a related discipline.
- Significant knowledge of compound semiconductor devices and optical waveguides.
- More than 2 years of experience in processing or measurement of these materials for photonic devices.
- Strong knowledge of photonic device design, processing, integration, and characterisation.
- Proficiency in managing process flows and writing reports for research projects.
- A good publication record in IEEE and/or Optica journals and conference publications.
- Simulate photonic structures and devices.
- Design robust process flows for fabricating compound-semiconductor-based photonic devices, incorporating appropriate risk management.
- Design and lay out masks.
- Complete high-quality device fabrication with appropriate in-line testing and detailed evaluation of individual process steps.
- Characterise the electro-optic performance of the devices.
- Disseminate research achievements through publications in high-profile journals and at significant conferences.
- Participate in mentoring activities within the group.
- Participate in Education and Public Engagement activities.
- Support and comply with Tyndall’s Quality Management Systems, Health and Safety standards, and other regulations.
- Carry out additional duties reasonably required within the general scope and level of the post.
- Evidence of entrepreneurial experience and creative skills or creativity.
- Experience working on industry projects.
Postdoctoral Researcher - Photonics devices
About Tyndall
Tyndall National Institute is an international leader in semiconductors, photonics and deep-tech research and innovation. As a leading collaborative European research institute, Tyndall is a key actor and hosting partner in the delivery of the ‘Chips for Europe Initiative’ (EU Chips Act).
Tyndall is Ireland’s leading research and innovation organisation and it is the national focal point for excellence in deep-tech research, development and graduate training at the convergence of nanotechnology, microelectronics, photonics, electronics and AI. Tyndall is recognised as an international research leader in semiconductor, chip and digital technologies, particularly as applied to the fields of Information & Communications, Health & Life Sciences, Agritech & Food Security, Energy and Climate Mitigation, emerging fields such as quantum, and novel computing paradigms.
The Institute’s key objective is to see frontier research activities having a significant impact on economic development and societal challenges in Ireland, Europe and beyond. Central to Tyndall’s mission is delivering economic impact through research excellence in partnership with industry and academia. With an annual turnover of more than €50m, the Institute has a community of over 600 researchers, engineers, support staff, postgraduate students, interns and industry researchers-in-residence.
With significant committed Irish government support, Tyndall will grow to be 1,000 people by 2030, with approximately 750 researchers, including 250 PhD students. A new 17,000 m2 research building is under development adjacent to the Cork headquarters and there are developing plans to expand Tyndall’s existing Dublin research labs and to establish other research sites within Ireland.
Tyndall’s expansion is also supported by recent national and EU funding wins for significant (M€10’s) additional research equipment across a range of areas such as semiconductor processing, microscopy, quantum technologies, heterogeneous integration, ultra-high speed optical communications and RF through THz characterisation.
About the Team
Photonics at Tyndall has a vibrant and expanding world-class research ecosystem comprising more than 200 researchers with activities that include photonic theory, III-V and III-Nitride material epitaxy, photonic integration, hybrid integration and packaging together with applications in microelectronics, bio-photonics and communication systems. Tyndall is the project lead of the recently announced Rinn Semiconductors. Rinn Semiconductors is part of a constellation of seven major new centres which collectively represent an investment of €460M in advanced research by the Government of Ireland. Rinn Semiconductors aims to lead Ireland’s response to the end of Moore’s Law scaling, the point where traditional improvements in computer chips slows down or ends, by pioneering modular integrated circuit-based (chiplet-based) semiconductor design and integration. With deep expertise in the areas of Heterogeneous Integration and Advanced Packaging, the Rinn Semiconductors team propose to enable transformative advances in these technologies and to apply them in three main application areas: Future Internet, Sustainable Energy and Environment, and Digital Healthcare. A key objective of the Rinn is to foster deep collaboration across the seven universities and institutions involved, by leveraging the semiconductor fabrication facilities at Tyndall, ultimately creating a cohesive “atom to systems” value chain in Ireland, connecting everything from basic materials research through to complete technology solutions. The Rinn will operate in close collaboration with Ireland’s vibrant semiconductor industry sector which supports 20,000 high skilled jobs and includes world leading multinational companies, small and medium sized enterprises and start-ups.
About the Role
The Photonic Devices group at Tyndall National Institute is now seeking Research Scientists to join our team in developing active (photonic, electronic and other functionality) components and their integration in compact photonic circuits. A key focus of the research will be the utilisation of one of the leading emerging technologies for large-scale photonic-electronic heterogeneous integration, namely Micro-Transfer Printing (MTP), which Tyndall has pioneered. Tyndall has outstanding fabrication, characterisation and test facilities to enable the research. You will join a dedicated team of highly skilled research staff where you will contribute to device design, fabrication, integration and characterisation. We seek a team of researchers with experience in semiconductor device physics, simulation, technology development and advanced characterization of materials and the devices.
Key Duties & Responsibilities
- Simulation of photonic structures and devices.
- Design robust process flows for fabrication of compound semiconductor based photonic devices incorporating with appropriate risk management.
- Mask design and layout.
- Complete high quality device fabrication with appropriate in-line testing and detailed evaluation of the individual process steps.
- Characterising the electro-optic performance of the devices
- Disseminate research achievements through publications in high profile journals and at significant conferences.
- Participate in mentoring activities within the group.
- Participate in Education and Public Engagement activities.
- Ensure support of and compliance with Tyndall’s Quality Management Systems, Health and Safety standards, and other regulations.
- To carry out any additional duties that may reasonably be required within the general scope and level of the post.
Essential Criteria
- PhD degree in Physics, Communications, Electrical/Electronic Engineering or a related discipline.
- Significant knowledge of compound semiconductor devices and optical waveguides
- More than 2 years of experience in processing or measurement of these materials for photonic devices.
- Evident strong knowledge of photonic device design, processing, integration and characterisation.
- Evident proficiency in managing process flows and in report writing for research projects.
- Good publication record in IEEE and/or Optica journals and conference publications.
Desirable Criteria
- Evidence of entrepreneurial experience and creative skills/creativity
- Excellent communication skills
- Experience working on industry projects
What We Offer
Apart from offering a position in a highly successful and positive research environment, with a collaborative ethos full of diverse competencies to boost your career, we offer the following:
- Impactful Work: Opportunities to contribute to ground-breaking research and innovation that shape Ireland’s economy and the society at large.
- Continuous Learning: Strong support for formal training, further study and professional development.
- Interdisciplinary Environment: Where academia, industry, and innovation intersect - supported by cutting-edge infrastructure and expert knowledge.
- Blended Working: Flexibility to work remotely and on-site, where the role allows.
- Comprehensive Benefits: Access to UCC pension, long-term illness benefit, life assurance, and more.
- Generous Leave: Competitive annual leave entitlements.
- Equity & Inclusion: Athena Swan Bronze award holder, with ongoing initiatives led by a dedicated People and Culture team to ensure equity for all.
- Core Values: A culture grounded in Ambition, Collaboration, Diversity, Excellence, and Integrity.
- Entrepreneurial Spirit: A proactive, innovation-driven environment that welcomes entrepreneurial and creative thinkers, including those with start-up experience.
- Supportive Onboarding: Structured induction and mentoring to help new hires integrate and thrive.
- Vibrant Culture: A collaborative, people-first workplace with a strong sense of community.
Terms of Employment
Contract Category: Full-Time
Contract Type: Fixed Term, 24 months with possibility for extension based on the availability of funding and progress.
Appointment may be made on either the Post-Doctoral Researcher Salary Scale €47,273- € 53,925,313 or Senior Postdoctoral Researcher Scale €55,399- €60,250 per annum, depending on experience. Salary placement on appointment will be in accordance with the public sector pay policy.
Informal enquiries can be made in confidence to Brian Corbett
Closing date for applications for this position is 23rd October 2026.
Application Instructions
Please make sure to attach an up-to-date CV/Resume AND a brief motivation letter outlining how you meet the ‘Essential Criteria’ for this role.
A full candidate information pack is available to download by clicking here.
Please note that Garda vetting and/or an international police clearance check may form part of the selection process. Please note that an appointment to posts advertised will be dependent on university approval, together with the terms of the employment control framework for the higher education sector. Tyndall National Institute does not require the assistance of recruitment agencies. Tyndall National Institute at University College, Cork is an Equal Opportunities Employer.
About the company
Tyndall National Institute is a research institute focused on deep technology. It conducts research in microelectronics, photonics, semiconductors, sensors, energy, communications, and related advanced technologies. The institute works with universities, public research programs, industry partners, and technology developers moving ideas from research toward application. Its environment combines fundamental and applied research with laboratories, fabrication, engineering, doctoral training, program management, technology transfer, and technical operations. Work spans scientific research, engineering, cleanroom work, fabrication, doctoral study, project management, and research support.
Company Size
201-500
Company Stage
Grant
Total Funding
$15.2M
Headquarters
Cork, Ireland
Founded
2004
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Simplify's Take
What believers are saying
- On September 23, 2026, Tyndall helped advance a 6G-ready semiconductor chip.
- The July 1, 2026 optically powered micro-camera and FLIM endoscope expand medtech commercialization paths.
- Tyndall surpassed €83 million in European research funding and launched ASPIRE on April 14, 2026.
What critics are saying
- The €100m expansion approved July 3, 2026 still depends on contract finalization and 2028 delivery.
- Tyndall’s roadmap depends on public programs like INSPIRE, Chips JU, and Research Ireland.
- Imec, CEA-Leti, Fraunhofer, and VTT pressure Tyndall on talent, visibility, and pilot-line relevance.
What makes Tyndall National Institute unique
- Tyndall bridges lab-to-fab semiconductor research through NanoIC, PIXEurope, and INFRACHIP access.
- Its packaging depth spans photonics, chiplets, cryogenic devices, and 3D power delivery.
- Cork-based UCC affiliation gives Tyndall Ireland’s densest public semiconductor research infrastructure.
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Benefits
- Flexible Work Hours
- Remote Work Options
- Paid Vacation
- Professional Development Budget
- Life Insurance
- Disability Insurance
Company News
Tyndall Institute researchers contribute to development of advanced 6G communications chip. September 23, 2026 Researchers at Cork-based Tyndall National Institute have contributed to the development of a new semiconductor chip designed to enable next-generation 6G wireless communications, marking a significant step forward in radio frequency semiconductor technology. The research breakthrough was highlighted by Andrés Fontana, an expert at Tyndall National Institute, who described the study as representing an important advancement in RF semiconductor technology. The chip development is expected to play a crucial role in the rollout of 6G networks, which are anticipated to succeed current 5G infrastructure. Key facts. * Tyndall National Institute researchers contributed to the development of a new 6G-ready semiconductor chip * Andrés Fontana of Tyndall described the work as an important advancement in RF semiconductor technology * The chip is designed to support future 6G wireless communications networks * Tyndall is Ireland's leading research centre for ICT hardware and systems Significance for next-generation wireless networks. The development of this new chip arrives as the telecommunications industry begins laying the groundwork for 6G technology, which is expected to deliver substantially faster data speeds and lower latency than current 5G networks. Radio frequency semiconductors form the essential building blocks of wireless communication systems, converting electrical signals into radio waves and vice versa. Tyndall National Institute, based in Cork, is Ireland's premier integrated ICT research centre and operates under the umbrella of University College Cork. The institute has established itself as a significant player in the development of semiconductors and photonics technologies, with particular expertise in communications and sensing applications. Ireland's semiconductor research landscape. The contribution from Tyndall researchers underscores Ireland's growing role in the global semiconductor ecosystem. The country has attracted substantial investment from major chip manufacturers and maintains a strong research base in semiconductor design and manufacturing technologies. This latest research aligns with broader European and Irish government initiatives to strengthen domestic semiconductor capabilities amid global supply chain challenges. The development of 6G-ready chips positions Irish researchers at the forefront of technologies that will underpin future wireless infrastructure across Europe and beyond. As telecommunications operators worldwide begin planning for 6G deployment - expected sometime in the 2030s - the advancement of underlying semiconductor technologies remains critical to meeting the ambitious performance targets set for next-generation wireless systems.
Tyndall Researchers showcase advanced packaging innovation through three published papers at ESTC 2026. Home news Tyndall Researchers showcase advanced packaging innovation through three published papers at ESTC 2026. Date Posted: 16 September 2026 Researchers from Tyndall National Institute presented and published three papers at the European Semiconductor Technology Conference (ESTC) 2026, showcasing advances in photonic packaging, co-packaged optics and chiplet integration technologies. The contributions highlight Tyndall's continued leadership in advanced packaging and heterogeneous integration, with the work also supporting activities within the PIXEurope Pilot Line. Showcasing Advances in Photonic Packaging Dr Sharon Butler, Senior Researcher, presented a paper titled "Co-packaged Bio-imaging System on a Glass Interposer by Hybrid Laser Integration Using an Expanded Beam Approach." The work, carried out as part of the PhotonicLEAP project, demonstrates a compact bio-imaging system that integrates photonic and electronic components on a glass interposer. By combining advanced optical alignment techniques with glass-based packaging technologies, the research shows how highly integrated photonic systems can be manufactured with the scalability required for future healthcare and sensing applications. In addition to presenting her paper, Dr Butler participated in an expert panel discussion on "Emerging Substrate Technologies - Innovating for AI Driven Applications." The session brought together industry and research leaders to discuss how substrate technologies are evolving to meet the increasing performance, power and thermal management requirements of next-generation AI systems. Silicon Interposer Technology for Chiplet Integration Dr Arun Kumar Malik, Senior Engineer, presented a paper titled "Silicon Interposer Technology for Advanced Chiplet-Based Packaging," which explores a standardised 2.5D chiplet integration framework. This work is part of the Europractice chiplet integration service. The proposed approach enables high-density electrical interconnections while facilitating rapid prototyping and cost-effective, modular system development. These characteristics make the proposed technology well suited to research applications and to small and medium-sized enterprises (SMEs), where flexibility, scalability, and reduced development costs are important considerations. Advancing Photonic Packaging for Cryogenic Applications Robert Bernson, PhD Student, presented "Cryogenic Edge-Coupling Packaging Method of Photonic Chips Using Annealed Adhesive." The research investigates a photonic packaging approach designed for cryogenic environments, using annealed adhesive materials to improve the reliability and performance of optical chip coupling at low temperatures. The work supports the development of advanced photonic systems for emerging quantum and cryogenic computing applications. Professor Peter O'Brien, Director of Advanced Semiconductor Packaging Research, Tyndall, commented: The future performance of electronic and photonic systems will increasingly depend on advances in packaging and integration. The research presented by its team at ESTC 2026 demonstrates Tyndall's commitment to developing scalable packaging technologies that bridge the gap between research, manufacturing, industry and innovation. Its strong presence at this year's conference reflects Tyndall's growing international profile and its position as a leading European research centre in advanced semiconductor packaging and heterogeneous integration, reinforced by its leading role in major European pilot lines and initiatives focused on accelerating the transition of advanced technologies from research to industrial manufacturing.
Tyndall and CEA-Leti reach major milestone in 3D integrated Power Conversion through the FAMES Pilot Line. Home news Tyndall and CEA-Leti reach major milestone in 3D integrated Power Conversion through the FAMES Pilot Line. Date Posted: 11 August 2026 Tyndall National Institute and CEA-Leti have announced a major milestone in advanced power delivery technologies with the tape-out of a Power Management Integrated Circuit (PMIC) in advanced FD-SOI technology. The PMIC will form the core of a 3D integrated DC-DC converter that combines embedded stripline inductors on a high-density capacitive interposer, designed to meet the power delivery demands of future artificial intelligence (AI), high-performance computing (HPC), and edge computing systems. Delivered through the FAMES pilot line, with Tyndall as a partner and CEA-Leti as coordinator, this achievement marks an important step forward in the development of advanced semiconductor solutions for future computing systems. The Challenge: Bringing Power Conversion Closer to the Point-of-Load (PoL) with High Efficiency As semiconductor devices continue to require higher current levels at increasingly lower voltages, interleaved interconnect paths between voltage regulators and processors generate parasitic resistance and inductance, resulting in power losses, voltage droop, and degraded transient performance. In this context, vertical power delivery has emerged as a key architectural requirement. Heterogeneous integration technologies provide a major enabling solution by bringing power conversion functions closer to the point-of-load. To address these challenges, Tyndall and CEA-Leti are collaborating on a 3D integrated DC-DC converter designed to bring power conversion directly inside advanced semiconductor packages. By placing the power conversion stage in close proximity to the ASIC load, the approach significantly shortens current paths, reduces power distribution losses and enables substantially higher power density delivery. The demonstrator combines three key technological building blocks: * High-frequency integrated stripline inductors developed by Tyndall; * A high-density capacitive silicon interposer developed by CEA-Leti; * A 3-level two-phase hybrid DC-DC converter architecture designed by CEA-Leti and fabricated in a 22nm FD-SOI CMOS technology. Together, these technologies form a compact heterogeneous power delivery platform designed for next-generation integrated systems. By integrating power conversion functions directly within the semiconductor package, the approach reduces power distribution losses, improves efficiency, and enables higher power density delivery in a significantly smaller footprint. The converter is designed to deliver output currents of up to 2 A at a regulated output voltage of 0.8 V from a 1.8 V input supply, while occupying a PMIC area of just 2.5 mm^2. Testing has demonstrated efficiency exceeding 85% across an output power range of 600 mW to 1.5 W, with peak efficiency above 86.5%. This milestone demonstrates the potential of ultra-compact power delivery systems enabled by two key FAMES technologies: high-performance integrated power inductors and high-density integrated capacitors. Together, these innovations open the door to a new generation of compact, energy-efficient power delivery solutions for advanced computing applications. Commenting on this milestone, Dr Sambuddha Khan, FAMES Programme Manager, Tyndall, said: This achievement underscores Tyndall's research leadership and innovation strengths, while further enhancing its international positioning in advanced semiconductor technologies. It also highlights the value of collaborative research and innovation within the FAMES Pilot Line. Tyndall look forward to continuing its work with CEA-Leti and its partners to advance next-generation power delivery solutions. Scientific Contributors: * Tyndall National Institute: Rayan Bajwa, Yi Dou, Rajkumar Modak, Sambuddha Khan, Cian O'Mathuna * CEA-Leti: Frederic Rothan, Aude Lefevre, Lilian Masarotto
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Tyndall achieves two world-firsts in miniature photonics integration. Optically-powered devices offer new technologies for use in the human body. 01 July 2026 A chip-on-tip microcamera developed at the Tyndall National Institute. Credit: Tyndall National Institute. Researchers at Ireland's Tyndall National Institute have announced a breakthrough in optically powered miniature devices, and predict that it will be put to use in biomedical and diagnostic applications. As described in Optics Letters, the project explored how optical power delivery can enable devices to operate in remote or hard-to-access biological environments, where traditional electrical power sources are impractical and conventional photovoltaic methods are unreliable. As proof of concept, Tyndall has developed a fully optically powered, chip-on-tip micro-camera endoscope with a 3.0 millimeter outer-diameter catheter, designed for minimally invasive surgical guidance and in vivo diagnosis. The device exploits the power-over-fiber (PoF) principle, in which power is delivered optically through a multimode optical fiber and converted to electrical energy at the receiver by custom PV cells. This architecture improves biocompatibility by eliminating distal electrical conductors, and enables a new class of optically powered miniaturized biomedical devices. In the Tyndall case a 808-nanometer source coupled into a 250-micron optical fiber was packaged into two 3D-printed modules, a back-end photovoltaic power module and a front-end micro-camera module, to create an optically powered micro-camera probe. "Although PoF requires precise alignment between the optical fiber and PV cell to minimize optical losses, it benefits from the lightweight nature of optical fibers and their ability to support high-speed data transmission without electromagnetic interference," wrote the Tyndall team. "These characteristics make PoF particularly well-suited for power-intensive, miniaturized applications." New areas of exploration for intraoperative diagnostics Building on this integration breakthrough, Tyndall has also developed the first chip-on-tip fluorescence lifetime imaging (FLIM) micro-camera at an endoscopic scale, described in a further Optics Letters paper. This micro-camera has an external diameter of 4 millimeters and comprises a miniaturized 1-square-millimeter 128 x 120 SPAD array detector, integrated imaging optics and an optical fiber for excitation light delivery. Three different light sources were trialled with the device: 375 and 405 nanometer pulsed laser diodes and a pulsed supercontinuum laser. "This addresses key challenges in photonics packaging, stray light suppression, electrical interfacing and compact optical design to enable time-resolved fluorescence imaging at clinically relevant scales," wrote the team. In trials on unlabelled ex vivo sheep tissues, the new device recorded a distinct contrast in FLIM data from intestine and lung samples, with a mean lifetime of 2.7 nanoseconds for the former and 3.5 nanoseconds for the latter. Features below 30 microns in size were resolved. Bringing FLIM systems to the tip of an endoscope will open new areas of exploration for intraoperative diagnostics and surgical guidance, commented Tyndall, and this research represents a significant step in translating semiconductor and photonics research into clinically relevant technologies. "Having demonstrated fully optically powered operation in controlled environments, we are now focused on progressing towards pre-clinical and in vivo validation," commented Sanathana Konugolu Venkata Sekar, head of the FAST-BioPhotonics research group at Tyndall. "This transition is essential to proving real-world viability in complex biological environments."