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Soitec

Engineered substrates for silicon-on-insulator wafers

Equipment Leader

Engineering LeadershipUpdated on Nov 10
Full-timeBernin, FranceNo salary listed

About the Job

Requirements

  • Hold a Bac +5 qualification in industrial engineering, electronics, mechanics, or a related field.
  • Have at least five years of experience in an environment close to production; experience in the microelectronics sector is ideal.
  • Be curious, autonomous, creative, and interested in challenges and helping others develop.
  • Be comfortable working flexibly in a technically demanding environment with high quality requirements.

Responsibilities

  • Ensure equipment operates correctly and adapt industrial tools to meet the needs of cleaning and bonding equipment.
  • Functionally lead the equipment team, support team members’ skill development, and ensure operational results are achieved.
  • Define, deploy, and animate the technical strategy to ensure its success.
  • Provide operational support to production to meet equipment availability, efficiency, and performance commitments.
  • Contribute with other departments to industrializing new products throughout their lifecycle and launching new production units.
  • Participate in defining and designing future equipment.
  • Define and lead the roadmap for reducing the environmental footprint of equipment with engineering and HSE teams.

Desired Qualifications

  • Experience in the microelectronics sector.

About the Company

Soitec

Engineered substrates for silicon-on-insulator wafers

Soitec designs and manufactures high-performance semiconductor materials, specializing in engineered substrates used to make chips for smartphones, data centers, and automotive applications. Its main products are silicon-on-insulator (SOI) wafers, which enable better performance and lower power consumption compared with traditional silicon wafers. Soitec’s Smart Cut technology bonds and transfers ultra-thin silicon layers onto insulating substrates to produce high-quality wafers with high yield. The company differentiates itself through its leadership in engineered substrates and its proprietary manufacturing process, supplying wafers to leading chipmakers under long-term agreements. Soitec’s goal is to provide advanced substrates that help customers build more powerful and energy-efficient electronic devices across industries.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Bernin, France
Founded
1992

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