H

Hewlett Packard Enterprise

Builds servers, networking and private cloud

Principal Signal Integrity Engineer - R&D Networking Platforms

Board & Electronics DesignConfirmed live in the last 24 hours
Full-timeRoseville, CA, USA$158k - $321k /yr

About the Job

Requirements

  • A Bachelor's, Master's, or PhD degree in Electrical Engineering, Computer Engineering, or a related field is required.
  • At least 15 years of experience in signal integrity, power integrity, package design, PCB design, and high-speed system architecture is required.
  • Recognized expertise in high-speed digital system design, including electromagnetic theory, transmission-line behavior, crosstalk, loss mechanisms, jitter, equalization, and channel optimization, is required.
  • Extensive experience architecting and validating high-speed systems using advanced SerDes technologies and complex networking platforms is required.
  • Demonstrated success leading signal and power integrity strategies across multiple large-scale product developments from concept through production is required.
  • Expert knowledge of signal and power integrity simulation methodologies, including time-domain, frequency-domain, statistical, bit error rate, and electromagnetic analysis, is required.
  • Deep expertise with industry-standard tools such as Synopsys HSPICE, Keysight ADS, Ansys HFSS, SIwave, PowerSI, and Cadence design environments is required.
  • Extensive experience defining PCB stackups, design constraints, routing architectures, power distribution networks, and signal integrity requirements for high-volume products is required.
  • Hands-on expertise using advanced laboratory instrumentation, including vector network analyzers, time-domain reflectometers, high-bandwidth oscilloscopes, spectrum analyzers, and compliance test equipment, is required.
  • The candidate must be able to correlate simulation results with laboratory measurements and improve modelling accuracy and design predictability.
  • Strong understanding of system-level interactions between signal integrity, power integrity, thermal performance, electromagnetic compatibility, and manufacturability is required.

Responsibilities

  • Define and drive signal and power integrity technical strategy, methodologies, design standards, and engineering best practices across networking hardware platforms.
  • Lead signal and power integrity architecture for next-generation networking systems, influencing platform design from concept through production.
  • Provide technical leadership for high-speed interfaces, including next-generation SerDes technologies operating at leading-edge data rates.
  • Establish company-wide signal and power integrity design guidelines, PCB stackup strategies, routing methodologies, and validation approaches to ensure scalable and repeatable success.
  • Lead cross-functional technical reviews and drive resolution of complex signal and power integrity challenges spanning multiple products and engineering disciplines.
  • Develop advanced simulation methodologies, modelling approaches, and automation techniques to improve engineering productivity and design quality.
  • Drive signal and power integrity technology readiness for future generations of networking products by evaluating emerging technologies and enabling adoption of new architectures and materials.
  • Lead root-cause investigations of complex field, validation, and manufacturing issues involving signal integrity, power integrity, timing, and electromagnetic interactions.
  • Partner with ASIC, package, PCB, mechanical, thermal, and system architects to optimize end-to-end electrical performance.
  • Champion technical innovation through patents, industry engagement, publications, and contributions to next-generation technology development.
  • Mentor and develop engineers across multiple sites, helping build organizational signal integrity expertise and long-term technical capability.
  • Serve as the final escalation point for critical signal and power integrity technical decisions, balancing performance, risk, schedule, and product cost.

Desired Qualifications

  • Demonstrated technical leadership across geographically distributed engineering teams.
  • Ability to influence architecture and engineering decisions across organizations without direct authority.
  • Proven track record of mentoring engineers and developing technical capabilities within an organization.
  • History of innovation through patents, publications, industry collaboration, or significant technical contributions.
  • Ability to explain complex technical concepts to engineers, architects, executives, and customers through effective communication and presentations.
  • Strong business and engineering judgment, balancing technical excellence with schedule, product cost, risk, and scalability considerations.
  • Ability to define technical direction in highly ambiguous environments.

About the Company

Hewlett Packard Enterprise

Builds servers, networking and private cloud

Hewlett Packard Enterprise sells servers, storage, networking and hybrid cloud software to large companies, governments and service providers. Its GreenLake platform lets customers run on-premises hardware as a metered cloud service, and its Cray supercomputers run national lab and AI training workloads. The networking business, built on Aruba and Juniper Networks, supplies campus, data-center and routing equipment. Revenue comes from hardware sales, multiyear support contracts, financing and subscriptions. The company traces its roots to Hewlett-Packard, founded in 1939, became a separate public company in 2015 and is headquartered in Houston, Texas.

Company size
10,001+
Company stage
IPO
Headquarters
Houston, TX
Founded
1939

Recently Posted Jobs

Explore more opportunities at Hewlett Packard Enterprise

See more jobs