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Micron Technology

Makes memory and storage chips for AI and PCs

Senior Assembly TD Engineer: Advance PKG stacking

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeTaichung City, TaiwanNo salary listedIn-person

About the Job

Requirements

  • Hands-on experience in flip chip, TCB, or hybrid bonding process development, process integration, or advanced packaging technologies, including wet processing, surface cleaning, plasma surface activation or treatment, or plasma-based dry etching processes.
  • More than three years of experience in assembly process.
  • A Master’s degree in engineering in material science, mechanical engineering, chemical engineering, physics, or chemistry.
  • Fluent English communication.
  • Strong technical problem-solving and data analysis skills.
  • An open mindset toward introducing new technology and process development.

Responsibilities

  • Explore new semiconductor technologies, including flip chip, TCB, and hybrid bonding process equipment and packaging materials.
  • Provide plans and resource requirements to enable new technology.
  • Set up and execute design of experiments (DOE) plans.
  • Build samples and perform data analysis.
  • Lead efficiency troubleshooting to improve processes.
  • Prepare documentation for process transfer from technology development (TD) to high-volume manufacturing (HVM).
  • Review process stability using FDC, SPC, and test results.
  • Work independently, identify opportunities proactively, and drive projects with minimal direction.
  • Manage multiple technical challenges, prioritize tasks, and deliver results in a fast-paced development environment.
  • Apply AI, data analytics, and automation tools to accelerate process development, yield improvement, failure analysis, and technical decision-making.

Desired Qualifications

  • Hands-on experience in flip chip, TCB, or hybrid bonding process development, process integration, or advanced packaging technologies, including wet processing, surface cleaning, plasma surface activation or treatment, or plasma-based dry etching processes.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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