Full-Time
Lead DevOps Engineer
Delivery Pipeline DevOps
Posted on 8/23/2025
Applied Materials
10,001+ employees
Materials engineering equipment for semiconductors
No salary listed
Bengaluru, Karnataka, India
In Person
Travel: Yes, 10% of the Time; Relocation Eligible: Yes
 DevOps & Infrastructure (1) |
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- 5+ years of experience with Gradle & Jenkins.
- In-depth knowledge of Gradle build lifecycle, plugins, lazy configuration, lazy properties, and sharing data between projects.
- Proficiency in Groovy scripting for Gradle build customization.
- 5+ years of experience with Java, including solid mid-level programming skills and proficiency in Java 21 or later.
- Experience with Maven publication mechanisms and familiarity with artifact repositories such as Artifactory or Nexus.
- Hands-on experience with CI/CD systems (e.g., Azure DevOps, Jenkins, GitHub Actions).
- Basic knowledge of Docker and Kubernetes.
- Basic proficiency in Bash scripting.
- Basic proficiency in Python.
- At least 10+ years of experience in DevOps domain.
- Bachelor's/Master's Degree of Engineering in CS or IT or equivalent.
- Develop and maintain the next generation DevOps infrastructure.
- Ensure the reliability, support, and high availability of the operational environment.
- Enable the Research & Development group to use CI/CD tools, infrastructure, and automation.
- Handle on-prem initiatives, including support, planning, execution, and reporting.
- Collaborate with cross-functional teams to drive continuous improvement and innovation.
- Troubleshoot and resolve issues related to DevOps processes and systems.
- Implement best practices for DevOps and infrastructure management.
- Familiarity with Networking, Linux Administration, and Windows.
- Proficiency with virtualized and containerized environments.
- Exposure to Agile methodologies and respective tool chain.
- Familiarity with configuration management tools (e.g., Ansible).
- Familiarity with system monitoring and centralized logging platforms (e.g., Prometheus, Loki).
- Ability to design and present software architecture.
- Strong collaboration and communication skills as a team member.
- Ability to learn new technologies quickly.
- Self-motivated, adaptable, and able to prioritize in a fast-paced environment.
Applied Materials provides equipment, software, and services for materials engineering used in semiconductor and display manufacturing. Their systems modify materials at atomic scale to enable etching, deposition, inspection, and process control across chip and display fabrication. It differentiates itself by offering end-to-end hardware, software, and services that support customers from process development to high-volume production in both markets, backed by long-standing relationships with major tech firms. Its goal is to help customers turn scientific possibilities into mass-produced, advanced electronic devices.
Company Size
10,001+
Company Stage
IPO
Headquarters
Santa Clara, California
Founded
1967
Simplify's Take
What believers are saying
- EPIC Center operational in 2026 accelerates AI chip R&D commercialization with Advantest.
- NEXX acquisition expands panel-level packaging to 510x515mm for AI accelerators.
- DRAM segment grows 34% in 2027, driving fastest revenue expansion per Wolfe Research.
What critics are saying
- US export controls drop China revenue below 10%, causing $2B annual losses by 2027.
- ASML High-NA EUV locks out AMAT tools, slashing orders 20-30% in 12 months.
- Lam Research etch tools capture 25% GAA market share from Trillium ALD in 18 months.
What makes Applied Materials unique
- Applied Materials leads in atomic-level deposition for Gate-All-Around transistors at 2nm nodes.
- Precision Selective Nitride PECVD protects shallow trench isolation in angstrom-era chipmaking.
- Trillium ALD enables conformal metal gate stacks for AI chip power efficiency.
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Benefits
Health Insurance
Dental Insurance
Vision Insurance
Life Insurance
Disability Insurance
Relocation Assistance
Performance Bonus
Stock Options
Flexible Work Hours
Growth & Insights and Company News
6 month growth
↑ 0%1 year growth
↑ 0%2 year growth
↑ 0%Applied Materials unveils advanced deposition tools for the angstrom era of chipmaking! Saturday 11 April 2026, 11:04:47 AM Applied Materials is advancing the future of semiconductor manufacturing with the introduction of two new deposition systems designed to support the transition to angstrom-scale chipmaking. These innovations are aimed at enabling the production of next-generation chips at 2nm-class nodes and beyond, where precision at the atomic level becomes critical to performance, power efficiency, and yield. As the semiconductor industry moves from FinFET architectures to Gate-All-Around transistors, the complexity of chip fabrication is increasing dramatically. Advanced logic processes can now exceed 500 steps, many of which involve highly controlled deposition of materials across intricate three-dimensional structures. This shift is being driven in large part by the demands of artificial intelligence, where next-generation processors are expected to integrate hundreds of billions of transistors within extremely compact footprints. To address these challenges, Applied Materials has introduced its Precision Selective Nitride PECVD system. This platform is designed to deposit silicon nitride films with high selectivity, helping protect shallow trench isolation structures that are essential for maintaining electrical separation between densely packed transistors. By improving isolation integrity, the system contributes to reduced parasitic capacitance and enhanced overall device performance, which are increasingly important as transistor density continues to rise. The second innovation, the Trillium ALD system, focuses on one of the most critical aspects of advanced transistor design: the formation of metal gate stacks in Gate-All-Around architectures. These structures require ultra-thin, conformal layers to be deposited with extreme precision over complex nanoscale geometries. The Trillium platform enables tighter control over these layers, directly influencing key parameters such as threshold voltage and device variability. At angstrom-scale dimensions, even the smallest inconsistencies can impact chip performance and manufacturing yield, making such precision indispensable. According to Prabu Raja, President of the Semiconductor Products Group at Applied Materials, the industry is entering a phase of rapid and non-linear change where traditional scaling approaches are no longer sufficient. He emphasized that materials engineering is becoming a defining factor in determining chip performance and power efficiency at advanced nodes. The newly introduced deposition systems are positioned as critical enablers for achieving the transistor-level breakthroughs required by the AI computing roadmap. Leading foundries and logic manufacturers are already adopting these systems for 2nm-class development, underscoring the growing importance of deposition control and material precision in next-generation chip production. As semiconductor devices continue to shrink, the margin for error narrows significantly, placing greater emphasis on technologies that can deliver consistent, atomic-level accuracy. Overall, Applied Materials' latest innovations highlight a broader industry shift where materials science and deposition technology are at the forefront of semiconductor advancement. By addressing key challenges in isolation and gate-stack formation, these new systems provide a practical pathway for managing variability, reducing power consumption, and sustaining performance gains in the angstrom era of chipmaking. Want to know more? Whether it's extra details on this article or information about MTD's services, fill in this form and we'll get back to you.
Applied Materials reported first-quarter revenue of $7.01 billion, down 2% due to falling China sales, but earnings per share surged 75% to $2.54 on improved margins. The semiconductor equipment maker expects industry sales to grow more than 20% this year, driven by AI computing demand. The company holds leading market positions in deposition and etching tools used for chip manufacturing. Its shares have risen over 175% in the past year and more than 35% year-to-date. Meanwhile, Caterpillar is benefiting from data centre growth through its dominance in backup generators. The industrial firm is experiencing strong sales growth and a large backlog for diesel and natural gas engines that provide emergency power for hyperscale data centres.
Applied Materials has introduced two chipmaking systems designed for atomic-scale precision in manufacturing advanced logic chips at 2nm and beyond. The technologies address the complexity of Gate-All-Around transistors, which require over 500 process steps. The Precision Selective Nitride PECVD system uses selective bottom-up deposition to preserve shallow trench isolation integrity, reducing parasitic capacitance and improving chip performance-per-watt. The Trillium ALD system deposits complex metal gate stacks around silicon nanosheets with angstrom-level thickness control, enabling chipmakers to optimise transistors for various AI computing applications. Both systems are being adopted by leading foundry-logic manufacturers. The innovations help address surging demand for AI compute by enabling faster, more power-efficient transistors in processors containing hundreds of billions of transistors.
Applied Materials, a semiconductor equipment supplier, was highlighted as a top contributor in RiverPark Large Growth Fund's fourth quarter 2025 investor letter. The stock rallied on improving wafer-fabrication spending visibility, with management reporting mid-teens growth in semiconductor systems revenue driven by AI-related capacity orders for advanced logic and high-bandwidth memory. Several major foundries raised their 2026 capital expenditure plans, signalling durable multi-year demand for Applied Materials' technologies. The company's installed base revenues grew at a high single-digit rate, with strength in services and spares continuing. As of 24 March 2026, Applied Materials shares traded at $373.99, with a market capitalisation of $296.8 billion. The stock gained 148.20% over the previous 52 weeks. Hedge fund ownership increased to 111 portfolios in Q4 2025 from 89 the previous quarter.
United Parcel Service has opened a $100 million logistics centre in Taiwan, its largest facility in the Asia Pacific region, to meet surging demand from technology companies. The site in Taoyuan, near Taiwan's largest international airport, will serve as an Asian distribution centre for Applied Materials, the largest US semiconductor equipment maker. Around 80% of the freight handled at the facility is high-tech related, according to UPS Asia Pacific president Lauren Zhao. The expansion capitalises on Taiwan's position as home to TSMC, the world's leading contract chipmaker and dominant supplier of advanced semiconductors powering AI technologies. UPS is also considering flights to Kaohsiung in southern Taiwan, where TSMC is building a large new factory.