Full-Time
Junior Supplier Quality Engineer
For semiconductor industry
Updated on 8/21/2026
Applied Materials
10,001+ employees
Materials engineering equipment for semiconductors
Compensation Overview
€64k - €88k/yr
Kirchheim bei München-Heimstetten, Germany
Remote
Travel required 20% of the time. Relocation is not available.
Bachelor's, Master's
 QA & Testing (1) |
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- Bachelor's or Master's degree in Mechanical Engineering or a comparable field.
- 1-2 years of professional experience, preferably in special-purpose machinery or equipment manufacturing.
- Experience with supplier management and supplier qualification.
- Knowledge of manufacturing engineering practices, techniques, and methodologies.
- Confident handling of technical drawings and specifications.
- A customer- and goal-oriented working style with a strong sense of responsibility.
- Flexibility and willingness to work in interdisciplinary teams.
- Strong communication skills in German and English.
- Select, qualify, and audit new and existing suppliers.
- Support validation of suppliers' series production capabilities, including statistical process control, implementation of test methods, and spare parts management.
- Ensure reliable capacity and infrastructure for high-volume production at the supplier.
- Participate in operational and strategic procurement projects, including dual sourcing, change management, and capacity projects.
- Execute and provide technical leadership for the product qualification process for critical modules.
- Integrate supplier quality activities into the new product introduction development process in close collaboration with the engineering department.
- Support supplier quality control management to continuously improve product standards.
- Experience in special-purpose machinery or equipment manufacturing.
Applied Materials provides equipment, software, and services for materials engineering used in semiconductor and display manufacturing. Their systems modify materials at atomic scale to enable etching, deposition, inspection, and process control across chip and display fabrication. It differentiates itself by offering end-to-end hardware, software, and services that support customers from process development to high-volume production in both markets, backed by long-standing relationships with major tech firms. Its goal is to help customers turn scientific possibilities into mass-produced, advanced electronic devices.
Company Size
10,001+
Company Stage
IPO
Headquarters
Santa Clara, California
Founded
1967
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Simplify's Take
What believers are saying
- Fiscal Q3 2026 revenue hit $9.12 billion, up 25%, with record non-GAAP EPS.
- Management lifted Q4 2026 guidance to $10.25 billion on AI-driven DRAM and packaging demand.
- Applied opened a $500 million Singapore campus and added Broadcom, Berkeley, and SCREEN EPIC partners.
What critics are saying
- BIS fined Applied $252.5 million in February 2026 for China export violations.
- China still delivered 28% of fiscal Q3 2026 revenue; curbs keep pressuring growth.
- October 2025 layoffs of 1,400 workers signal export restrictions are forcing structural cost cuts.
What makes Applied Materials unique
- Applied’s EPIC Center links university research directly to manufacturing-scale chip equipment.
- Its broad materials-engineering stack spans deposition, etch, inspection, packaging, and services.
- Leading memory and advanced-packaging customers rely on Applied’s process control across multiple wafer steps.
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Benefits
Health Insurance
Dental Insurance
Vision Insurance
Life Insurance
Disability Insurance
Relocation Assistance
Performance Bonus
Stock Options
Flexible Work Hours
Growth & Insights and Company News
6 month growth
↓ -1%1 year growth
↓ -1%2 year growth
↓ -1%Manz forecasts growth alongside industry. Wed, aug 19, 2026 page9. * Manz forecasts growth alongside industry MANY MILLIMETERS: Manz' offerings in panel-level packaging continue to grow in demand in Taiwan's specialized industrial ecosystem, the company president said * By Lisa Wang / Staff Reporter * * Add TT as Preferred Source Manz Taiwan Ltd (亞智科技), which specializes in panel-level packaging equipment manufacturing, yesterday said the semiconductor ecosystem has developed rapidly in Taiwan, boosting its business outlook. The company supplies electrochemical deposition (ECD) equipment used in panel-level packaging, including chip-on-panel-on-substrate (CoPoS) and fan-out panel-level packaging (FOPLP) with square panel sizes ranging from 310x310mm and 510x510mm to 700x700mm. That places Manz as the third company in the world - after Applied Materials Inc and Lam Research Corp - capable of supplying such equipment used in panel-level packaging production. Manz Taiwan Ltd president Robert Lin speaks at a news conference in Taipei yesterday. Photo: CNA About half of the 50 ECD machines it has sold so far are for 700x700mm in panel size, but the 310x310mm equipment has been gaining popularity, the company said. "As AI [artificial intelligence] chips become larger in terms of reticle size, production and cost efficiency become increasingly vital, pushing the shift to panel-level packaging," Manz president Robert Lin (林峻生) said at a news conference in Taipei. CoPoS is considered a successor to chip-on-wafer-on-substrate technology, which is used in packaging for Nvidia Corp's AI chips produced by Taiwan Semiconductor Manufacturing Co (台積電), as a larger square panel offers better cost efficiency versus a 12-inch circular wafer. A 310x310mm rectangular panel can boost production by 50 percent compared with a 12-inch circular one in advanced packaging, Lin said. The CoPoS technology is mainly used to produce AI chips, while FOPLP is for the production of power management chips, radio frequency chips, microcontrollers or chips used in low orbit satellites, Manz said. As localization is a growing trend for Taiwan's advanced packaging industry, half of the company's customers are from Taiwan, Lin said. The company also exported equipment to the US, Japan, China and Malaysia, he said. Manz, which previously focused on plastic circuit board and flat panel equipment manufacturing, entered the semiconductor industry 12 years ago by collaborating with chip packager and tester Siliconware Precision Industries Co (矽品精密). The company aims to debut on the Taipei Exchange's Emerging Stock Board in June next year and list its shares on the Taiwan Stock Exchange in 2028. Employees hold a 30 percent stake in the company after it signed an agreement with German parent company Manz AG and became an independent entity through management buyout last year. * Most Popular * 1 McDonald's halts shrimp burger sales over banned antibiotic * 2 China wants to block drone bill: source * 3 'Economist' warns of democracy dangers in Taiwan * 4 German writer tells of Chinese spy in Taiwan * 5 Lai announces NT$10,000 cash handout
Bank of America has cut Applied Materials' price target to $650 from $720 while maintaining a Buy rating. The adjustment follows the semiconductor equipment maker's record fiscal third quarter, which saw revenue rise 25% year-over-year to $9.12 billion and non-GAAP EPS jump 41% to $3.50. BofA reduced its valuation multiple to 27 times estimated 2028 earnings from 36 times previously, citing slower sequential growth relative to competitor Lam Research and flat margin guidance. Applied's quarterly guidance implies roughly 13% sequential growth versus about 20% for Lam. Despite the lower target, BofA raised its EPS estimates for 2026, 2027, and 2028 by 8%, 15%, and 22%, respectively. The bank highlighted strong AI-driven demand in DRAM and advanced packaging as key growth drivers.
Applied Materials reported record third-quarter revenue of $9.12 billion, up 25% year over year, exceeding analyst expectations of $8.995 billion. Non-GAAP diluted earnings reached $3.50 per share, beating the $3.40 consensus. Despite the strong results, shares fell in premarket trading. Semiconductor Systems revenue rose to $7.04 billion from $5.56 billion a year earlier. Non-GAAP gross margin hit 50.4%, marking the 13th consecutive quarter of year-over-year expansion. Geographically, China's revenue share dropped to 28% from 35%, whilst US revenue doubled to 15% from 9%. The company forecasts fourth-quarter revenue of $10.25 billion, plus or minus $500 million, with non-GAAP earnings per share of $4.02, plus or minus $0.20.
Reddit shares surged 12.6% in premarket trading after S&P Dow Jones Indices announced the social media company will join the S&P 500, replacing AvalonBay Communities. JPMorgan analysts estimate index funds may need to purchase about 16.7 million Reddit shares, nearly three times its average daily trading volume of around 5.98 million shares since its March 2024 debut. Applied Materials shares fell approximately 5% despite issuing an upbeat outlook, as investors remained concerned about its competitive position against rivals such as ASML and Lam Research. Summit Insights Group noted Applied Materials' topline performance has lagged peers, raising concerns after the stock had already more than doubled this year. Fox Corp Class A shares rose 4.1% after JPMorgan upgraded the stock to Overweight from Neutral.
Applied Materials shares fell 5.4% in pre-market trading despite reporting record fiscal third-quarter results that exceeded analyst expectations. The semiconductor equipment maker posted revenue of $9.12 billion, up 25% year-over-year, surpassing the $8.99 billion consensus estimate. Non-GAAP earnings per share reached a record $3.50, beating expectations of $3.40. Investors focused on China-related concerns, as revenue from the region declined to approximately 28% of total sales from 35% a year earlier. The drop highlights the impact of US export restrictions on sales of advanced semiconductor manufacturing equipment. The stock's substantial year-to-date rally, including a 4% gain on Thursday alone, raised the bar for results. The subsequent decline reflected profit-taking as the stronger-than-expected figures failed to justify elevated valuations priced in ahead of the announcement.