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AMD

Designs chips for computers and AI systems

Graduate Trainee - Product Development Engineer Signal Integrity

Board & Electronics DesignConfirmed live in the last 24 hours
Full-timeBayan Lepas, Penang, MalaysiaNo salary listedIn-person

About the Job

Requirements

  • A bachelor's or master's degree in electrical engineering, computer engineering, or a comparable discipline.

Responsibilities

  • Work with cross-functional teams and internal working groups on current and next-generation server platforms to meet signal-integrity requirements in high-volume manufacturing solution spaces.
  • Perform electromagnetic modeling of three-dimensional structures, including vias, connectors, and sockets.
  • Verify and correlate post-silicon measurements against specifications and collaborate on fixes for feedback into the next silicon derivation.
  • Collaborate with working group leads on signal-measurement test plans and review measurement results.
  • Deliver channel optimization for board and package, create and verify models, simulate overall performance to meet channel requirements, and document reports and best-known methods for future reference.
  • Contribute to developing next-generation products and methodologies.
  • Perform board- and system-level power delivery network AC and DC simulations for low-voltage, high-current supplies.
  • Work with external and internal intellectual property providers to ensure intellectual property performance and proper functionality in products.
  • Perform system-level signal-integrity simulations of future DDR5 memory buses, including silicon I/O, package, and board.
  • Perform system-level signal-integrity simulations of future high-speed SERDES links, including USB-4, PCIe 5, xGMI/CXL, silicon I/O, package, and board.
  • Resolve challenges in high-speed board design, power, and analog.

Desired Qualifications

  • Knowledge of transmission-line theory and microwave-engineering concepts, including S-parameters.
  • Experience with low-voltage swing signaling technologies.
  • Experience with system-level timing analysis considering effects from silicon I/O, package, and board.
  • Experience with I/O driver and receiver modeling for state-of-the-art high-speed digital logic.
  • In-depth knowledge of I/O buffer modeling, specifically behavioral (IBIS-like) modeling for high-speed digital logic.
  • Deep expertise in at least one of the following: PCIe physical layer, LPDDR4/5, power delivery design, or 100+ gigabit interfaces.
  • Hands-on experience in silicon design or board design.
  • Expertise in analog simulation using Seasim, S2eye, Hspice, ADS, ANSYS, or other toolsets.
  • Expertise in three-dimensional modeling with ANSYS HFSS/Q3D and 2.5-dimensional modeling with ANSYS SIWAVE.
  • Expertise with DSO, TDR, VNA, or ParBERT measurement tools and techniques.
  • Motivation to continuously learn and resolve new challenges.
  • People skills and team spirit.

About the Company

AMD

Designs chips for computers and AI systems

AMD designs processors, graphics chips and AI accelerators for computer makers, cloud operators and businesses that build electronic devices. Its Ryzen processors power personal computers, while EPYC processors handle work in data centers and Radeon chips render graphics. Instinct accelerators run AI models, paired with software that developers use to train models and put them into production. AMD sells chips and related computing systems through equipment makers, distributors and retail channels, and contracts with outside foundries to fabricate its semiconductor designs. It was founded in 1969 and has its headquarters in Santa Clara, California.

Company size
10,001+
Company stage
IPO
Headquarters
Santa Clara, CA
Founded
1969

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