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Teledyne

Manufactures sensors, imaging systems, and avionics

Hybridization Technician

Product AssemblyConfirmed live in the last 24 hours
Full-timeCamarillo, CA, USAIn-person

About the Job

Requirements

  • Strong attention to detail and the ability to accurately follow procedures, specifications, and diagrams.
  • Ability to operate technical manufacturing and inspection equipment.
  • Good communication and observation skills.
  • Proficiency with Microsoft Office applications, particularly Excel and Word.
  • Understanding of metric and imperial measurement systems.
  • A High School Diploma with 5–10 years of relevant experience, or an Associate's Degree with 3–7 years of relevant experience.
  • Must be a U.S. citizen.

Responsibilities

  • Perform hybridization bonding and related assembly operations on sensor chip and integrated circuit components.
  • Prepare, inspect, clean, measure, and evaluate parts before and after hybridization processes.
  • Operate specialized equipment such as microscopes, optical inspection systems, measuring equipment, and bonding tools.
  • Document production activities, inspection results, and quality observations.
  • Identify and report product defects, damage, and safety concerns.
  • Support root cause investigations and corrective actions.
  • Collaborate with engineering teams on testing, experimentation, and process improvements.
  • Maintain compliance with cleanroom protocols and electrostatic discharge requirements.
  • Use enterprise resource planning systems to track production and reporting data.

Desired Qualifications

  • Experience in cleanroom manufacturing or electronic assembly environments.
  • Experience with hybridization bonding processes.

About the Company

Teledyne

Manufactures sensors, imaging systems, and avionics

Teledyne Technologies designs and makes sensors, cameras, and electronics used in aerospace, environmental monitoring, medical imaging, and defense. Its products include digital imaging sensors, high-reliability cameras, instrumentation, aerospace and defense electronics, and engineered systems that provide integrated sensing solutions for demanding environments. The company grows by acquiring specialized high-tech firms, building a diversified portfolio that serves markets with high barriers to entry. Its goal is to expand capabilities and market reach through targeted acquisitions while delivering reliable sensing and imaging technology for critical industries.

Company size
11-50
Company stage
IPO
Headquarters
Thousand Oaks, CA
Founded
1960

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