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Micron Technology

Makes memory and storage chips for AI and PCs

Principal Design Automation Engineer

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeSan Jose, CA, USAIn-person

About the Job

Requirements

  • A Master of Science in electrical engineering is required; a PhD is preferred.
  • At least 8 years of relevant NAND design experience and proficient knowledge of NAND Flash memory read, program, and erase algorithms are required.
  • Proficiency in analog and mixed-signal circuit design, including page buffers, block selectors, X and Y decoders, bias tables and waveforms, power distribution networks, level shifters, charge pumps, operational amplifiers, digital-to-analog converters, analog-to-digital converters, linear regulators, oscillators, bandgap circuits, input/output buffers, register-transfer-level design, and Verilog.
  • Proficiency in analog and mixed-signal circuit layout, including page buffers, block selectors, X and Y decoders, bias tables and waveforms, power distribution networks, level shifters, charge pumps, operational amplifiers, digital-to-analog converters, analog-to-digital converters, linear regulators, oscillators, bandgap circuits, input/output buffers, register-transfer-level design, and Verilog.
  • Proficiency in semiconductor and device physics fundamentals and analog/mixed-signal circuit design, plus understanding of semiconductor reliability issues including channel hot-carrier effects, negative-bias temperature instability, stress, snapback, electromigration, and IR analysis.
  • Proficiency in circuit verification and optimization, layout planning, parasitic extraction, and guiding layout; strong understanding of block-, subsystem-, and full-chip simulation flows, corner management, process-voltage-temperature and mismatch analysis, results qualification, and analog and digital simulators such as HSPICE, Fast SPICE, and Verilog.
  • Proven proficiency in Python engineering automation, including maintainable scripts, libraries, or frameworks that work with electronic design automation tools for simulation control, data extraction, regression management, or reporting.
  • Proficiency with Cadence design tools, layout-versus-schematic and design-rule-checking tools, and UNIX.

Responsibilities

  • Implement core X-path, Y-path, and array design during project execution and work with project teams to integrate core schematics into full-chip schematics, validating design performance and functionality with block- and chip-level simulations using industry-standard simulators.
  • Implement analog and mixed-signal circuit designs, including charge pumps, operational amplifiers, digital-to-analog converters, analog-to-digital converters, linear regulators, oscillators, bandgap circuits, low-dropout regulators, thermometers, page buffers, power distribution networks, level shifters, input/output buffers, register-transfer-level design, and Verilog; validate performance and functionality through block- and chip-level simulations.
  • Serve as a technical authority across analog and core teams, solving complex technical problems involving circuit behavior, modeling, simulation methodology, and automation reliability.
  • Develop and productize agentic enablement for circuit design, including AI- and large-language-model-assisted flows for environment setup and self-healing configuration; guided simulation and debugging; intelligent corner planning and coverage closure; automated schematic/layout checks and review assistance; documentation synthesis and knowledge retrieval from internal sources; and analog/mixed-signal block, subsystem, and full-chip verification with reproducible run recipes, golden-reference management, and regression-gating criteria.
  • Integrate automation with project execution by partnering with circuit designers, firmware, validation, and architecture teams to align tooling with project needs and deliver measurable cycle-time reductions.
  • Collaborate with Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing to ensure automation and environment choices support manufacturability, testability, reliability, time to market, and customer outcomes.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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