Morse Micro is at the forefront of next-generation Wi-Fi technology, specializing in Wi-Fi HaLow solutions that offer extended range, lower power consumption, and enhanced penetration. Our innovative chipset applications are designed to revolutionize connectivity for a variety of applications, including IoT, smart home, and industrial automation.

Job Summary:

Morse Micro is seeking a Product Quality Engineer to join the Failure Analysis (FA) lab at the Irvine site and grow into serving as a point of contact between customers, Field Application Engineers (FAEs), and Sydney-based engineering teams (Design, Systems, Radio, DVT, Firmware). All customer-returned defective units are received, triaged, and investigated at Irvine. This is an early-career role: you'll be mentored by senior FA and quality engineers in Irvine and Sydney as you build toward full ownership of the lab and customer relationships. The candidate must be capable of hands-on module-level RF testing and failure triage, translate findings into clear FA reports, and collaborate with senior engineers to drive investigations to closure through disciplined cross-time zone coordination with remote engineering teams.

Early Career - New Grad or 2–3 Years Experience

Key Responsibilities

Hands-On FA Lab Execution

Receive, log, and maintain chain-of-custody for all customer-returned units (bare modules and end-devices); manage sample tracking from receipt through investigation completion. Units are retained at Morse Micro after FA.
Operate the Irvine production lab (LitePoint IQxel + FW) to run full Tx/Rx RF test suites on FA units measuring Tx power, EVM, SEM, PER, and frequency error across MCS/BW/frequency combinations, and flash firmware branches from the Systems/Radio teams to execute structured before/after corrective action verification.
Perform systematic multi-unit failure triage using the module test jig: power-on behavior assessment, chip serial logging, failure mode classification, and Jira ticket creation.
Conduct component-level fault isolation as needed to isolate whether failures originate at the chip or PCB level, with support from senior engineers on complex cases.

Customer Communication & FA Report Delivery

Support customer-facing communication for FA cases, acknowledging receipt, setting timelines, and providing data-backed status updates throughout the investigation lifecycle, growing into independent ownership of this over time.
Prepare and issue FA Reports (FARs) to customers (with senior review initially), technically accurate, clearly communicating root cause, corrective action, and verification evidence.
Respond to FAE and customer technical inquiries, translating ongoing lab findings into clear, timely communication appropriate for both technical and non-technical contacts.

Cross-Time Zone Coordination with Engineering Teams

Work alongside senior engineers as an Irvine-side technical liaison to Design, Systems, Radio, DVT, and Firmware teams, translating lab findings into structured technical briefs and working with FAEs to provide full customer application context that remote engineers can act on asynchronously.
Maintain Jira FA tickets with complete technical details, test configurations, firmware versions, BCF files, per-unit results, and failure evidence so remote teams can pick up full context without a live handoff.
Support firmware branch requests, root cause assignments, and corrective action commits; follow up proactively to prevent stalls, with increasing independence as you gain experience.
Facilitate cross-site FA review calls (initially alongside a senior engineer): preparing agendas, presenting lab findings, capturing action items, and tracking commitments to closure.

Investigation Documentation & Reporting

Document all lab test procedures, results, and configurations in Confluence, ensuring investigations are fully reproducible, auditable, and accessible to remote engineering teams.
Prepare internal FA summary reports covering failure pareto, repeat failure patterns, and corrective action verification results for engineering review and management visibility.

Qualifications Required

Hands-on RF production test experience (or equivalent academic/lab/thesis experience) operating LitePoint IQxel or equivalent, running Tx/Rx test suites, flashing firmware builds, configuring BCF/test region settings, and executing before/after comparisons for corrective action verification.
Understanding of or exposure to module-level failure triage concepts: power-on jig assessment, chip serial logging, multi-category failure classification, and Jira-based tracking with engineering team routing.
Willingness and aptitude to grow into owning customer FA investigations end-to-end, from unit receipt through root cause, corrective action verification, and FA Report delivery.
Strong technical writing skills: clear customer-facing FA reports and structured internal investigation documents.
Effective cross-time zone communication; interest in or experience working with distributed engineering teams, with a disciplined async-first, Jira/Confluence documentation approach.
Education: Bachelor’s degree in electrical engineering, RF/Microwave Engineering, or a related field with 2–3 years of relevant experience; OR a Master's degree in Electrical Engineering, RF/Microwave Engineering, Wireless Communications, or a related field with graduate coursework or research in RF circuit design, antenna theory, wireless systems, or analog IC design.

Preferred

Familiarity with Wi-Fi HaLow (IEEE 802.11ah), Wi-Fi, or similar RF/wireless semiconductor products e.g., through coursework in RF/microwave circuits, antenna theory, wireless communications, analog IC design, electromagnetics, or digital signal processing sufficient to understand customer failure context and configure a basic test network for reproduction.
Experience with MFT (Manufacturing Firmware Test) or similar production test software for module-level test execution and data collection.
Experience in a fabless semiconductor company with OSAT-based manufacturing and a global customer base.

Who we are:

Morse Micro is Australia’s largest semiconductor company building Wi-Fi HaLow (802.11ah) chips for the Internet of Things (IoT). We are a team of wireless experts that love to work hard, innovate & invent. Together, we are building the world’s lowest power Wi-Fi technology that will enable billions of IoT devices to connect securely to the internet. We are a global team with offices in Sydney, Picton & Melbourne (Australia), Irvine & San Jose (USA), Bangalore (India), Cambridge (UK), Hangzhou & Shenzen (China), Taipei (Taiwan) and Tokyo (Japan).

About the company

Morse Micro designs and manufactures Wi-Fi HaLow (802.11ah) semiconductor chips for the IoT market. Its flagship MM6108 is a single-chip SoC that combines the radio, PHY, and MAC to provide long-range, low-power wireless connectivity for IoT devices. The company targets smart home, AMI 2.0, and grid-edge applications by selling these specialized chips to device manufacturers. By focusing on the Wi‑Fi HaLow standard and achieving Matter certification, Morse Micro aims to offer secure, scalable wireless connections where traditional Wi-Fi falls short, supported by partnerships and growth funding.

Company Size

51-200

Company Stage

Series C

Total Funding

$203.3M

Headquarters

Sydney, Australia

Founded

2016

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Simplify's Take

What believers are saying

September 9, 2026 USB adapters push HaLow onto laptops, PCs, and access points.
MM8108-M20 module offers FCC/IC-certified integration for US and Canadian OEMs.
Design partners Gateworks, VPI, CA Engineering, and Pace Wireless widen commercialization channels.

What critics are saying

Wi-Fi HaLow remains niche; ecosystem adoption still depends on partners like Byte Lab.
MegaChips-led Series C funding in September 2025 signals ongoing capital dependence before profitability.
If MM8108 volume stalls, Morse Micro becomes a long-duration single-standard semiconductor bet.

What makes Morse Micro unique

MM8108 and MM6108 target sub-GHz Wi-Fi HaLow, unlike crowded 2.4GHz chip rivals.
HaLowLink 2 ships globally with Wi-Fi Certified, easing enterprise and developer adoption.
Zephyr Project support on September 17, 2026 broadens embedded software compatibility.

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Benefits

Health Insurance
Stock Options
401(k) Retirement Plan
Performance Bonus
Income protection insurance

Growth & Insights and Company News

Headcount

6 month growth

1 year growth

2 year growth

Associated Press

Oct 15th, 2026

Vantron's Morse Micro-based Wi-Fi HaLow module wins CE, FCC and UL certification

Vantron's VT-MOB-AH-8108 Wi-Fi HaLow module has earned CE, FCC, and UL certification, Morse Micro announced on October 15, 2026. The module is built on Morse Micro's MM8108 system-on-chip and is now cleared for mass production. It measures 11 x 10 x 2.28mm and supports data rates of up to 43.3Mbps across 1, 2, 4, and 8MHz channel bandwidths. It also offers WPA3 security and supports station and access point modes. The module targets industrial IoT, smart infrastructure, and edge AI-enabled security applications. "With certification in North America and Europe completed, device makers can accelerate their product development activities with confidence," said Michael De Nil, co-founder and chief executive officer of Morse Micro.

Benzinga

Oct 8th, 2026

Morse Micro expands Wi-Fi HaLow Design Partner Program to India with Zilogic Systems.

Morse Micro expands Wi-Fi HaLow Design Partner Program to India with Zilogic Systems. The Chennai-based embedded engineering company becomes Morse Micro's first Design Partner based in India Morse Micro, the global technology leader in Wi-Fi HaLow, today announced that Zilogic Systems has joined its Design Partner Program. The announcement marks the program's first partner based in India and gives customers further access to engineering, testing, automation, and technical consulting expertise for Wi-Fi HaLow products. The Design Partner Program connects design houses, system integrators, and developer groups with the silicon, tools, and support needed to bring Wi-Fi HaLow products to market quickly. Zilogic joins as an engineering services partner, providing customers with firmware, system software, and validation expertise built around Morse Micro silicon, from board bring-up through test automation. The partnership establishes Morse Micro's first Design Partner presence in India, a market central to global automotive and industrial electronics manufacturing. It also equips Zilogic's existing engineering practice with a new wireless technology to build around. Customers working with Zilogic on embedded and connected products can now design Wi-Fi HaLow support into those products from the outset. "Zilogic has been shipping products for some of the largest names in automotive and wireless," said Michael De Nil, co-founder and CEO of Morse Micro. "We're excited to welcome Zilogic to the program. That depth of engineering is exactly what customers need to bring Wi-Fi HaLow into the market." Founded in 2007 and headquartered in Chennai, India, Zilogic Systems is an embedded engineering firm with more than 200 engineers. For nearly two decades, Zilogic has helped automotive, wireless, and industrial customers adopt and extend open-source platforms, including Linux, OpenWrt, prplOS, and RDK-B. "We are excited to become Morse Micro's first design partner in India, for Wi-Fi HaLow, bringing our Wi-Fi and IoT engineering expertise to the global market. With our experience in solving complex challenges in this space, we see an exciting opportunity to extend Wi-Fi into the sub-1 GHz space and enable a broader range of IoT applications. We look forward to combining our strengths with Morse Micro to deliver next-generation Wi-Fi HaLow solutions to operators and other customers worldwide," said P. Ganesan, Managing Director, Zilogic Systems. Morse Micro continues to see strong interest from design houses globally since announcing the program at Embedded World in March 2026. Zilogic joins Gateworks, VPI Technology, CA Engineering, Vantron, Byte Lab, and Pace Wireless in the Design Partner Program, bringing long-range, low-power, and reliable wireless performance to industrial IoT, Edge AI applications, smart infrastructure, security, utilities, agriculture, and more. About Morse Micro Morse Micro is the global technology leader in Wi-Fi HaLow, advancing IoT and Edge AI connectivity with award-winning technology. Headquartered in Sydney, with offices in the United States, Taiwan, China, India, Japan, and the United Kingdom, Morse Micro is driving the adoption of next-generation long-range, low-power Wi-Fi HaLow solutions. Its first-generation MM6108 and second-generation MM8108 Wi-Fi HaLow chips are designed to enable faster, longer range and lower power Edge AI connectivity. Morse Micro's Wi-Fi HaLow technology is gaining global momentum as it enables connected devices to achieve ten times the range and cover 100 times the area of traditional Wi-Fi networks, while offering 1,000x the data rates of traditional LPWAN technologies. This advancement is applicable across a range of Edge AI and IoT applications, including smart homes, industrial automation, and smart cities. About Zilogic Systems Zilogic Systems is an embedded engineering company with nearly two decades of experience helping global product companies build reliable, connected, and future-ready embedded products. Zilogic partners with SoC manufacturers, Tier 1 suppliers, OEMs, and ODMs across automotive, wireless networking, and IoT to adopt, customize, and extend open-source embedded platforms, including Linux, Android, OpenWrt, prplOS, RDK-B, FreeRTOS, and Zephyr. Its engineering capabilities span the product lifecycle, from BSP and firmware development to connectivity, system integration, validation, and test automation. Zilogic engages with customers to accelerate time-to-market, reduce engineering complexity, and build the next generation of intelligent and connected embedded products. Media Contact: Jeremy Hyatt Green Flash Media 949.607.9000 [email protected] Posted In:

工商時報

Sep 16th, 2026

Morse Micro announces Byte Lab as Europe's first Wi-Fi HaLow design partner

Morse Micro announces Byte Lab as Europe's first Wi-Fi HaLow design partner Croatian design and manufacturing company expands this partnership program to the European market, providing one-stop services from embedded design and certification to mass production * 2026.09.16 * 16:26 * Commercial Times, provided by the company The global leader in Wi-Fi HaLow chips, Morse Micro, announced that Byte Lab has officially joined the Design Partner Program. Byte Lab is headquartered in Zagreb, Croatia, and can complete electronic product design, certification, and manufacturing at the same site, providing European customers with one-stop services from product concept to mass production. Morse Micro's Design Partner Program aims to provide design companies, system integrators, and development teams with the chips, tools, and technical support they need to help bring Wi-Fi HaLow products to market quickly. After Byte Lab joins the program, customers developing products for the European market will have a partner that can complete the entire process from product design and certification to mass production within Europe. Michael De Nil, co-founder and CEO of Morse Micro, said he is very pleased that Byte Lab has become Morse Micro's first design partner in Europe. For European companies, completing product design, certification, and production locally will shorten the distance from product concept to successful launch of Wi-Fi HaLow products. Morse Micro chose Byte Lab to join the Design Partner Program mainly because of its extensive in-house technical capabilities and its track record of advancing products to large-scale mass production. Byte Lab was founded in 2011, and its business covers embedded hardware, embedded software, mechanical engineering, mobile and cloud development, and edge AI deployment. It can also manufacture using its own printed circuit board assembly (PCBA) and box build production lines. Matija Puškar, co-founder and CEO of Byte Lab, said customers want to achieve broad network coverage in large industrial or infrastructure sites without maintaining connectivity through a series of repeaters. Wi-Fi HaLow can directly solve this need. In addition, Byte Lab can handle product design, certification, and production all the way from the customer's initial requirements without handing the product over to other third-party manufacturers. Morse Micro continues to receive great attention from design companies worldwide. After Byte Lab joins, it will become a partner in the program alongside Gateworks, VPI Technology, CA Engineering, Pace Wireless, and Vantron, committed to providing long-range, low-power, and reliable wireless connectivity performance for diverse fields such as the industrial Internet of Things (IIoT), edge AI applications, smart infrastructure, security, utilities, and agriculture.

Wireless Broadband Alliance

Sep 10th, 2026

Morse Micro launches Wi-Fi HaLow USB Network Adapters for developers.

Morse Micro launches Wi-Fi HaLow USB Network Adapters for developers. New USB-A and USB-C network adapters extend long-range Wi-Fi HaLow connectivity for multiple platforms. Sydney, Australia - 09 September 2026 - Morse Micro, the world's leading Wi-Fi HaLow silicon provider, today announced a range of Wi-Fi HaLow USB Network Adapters, a direct path to Wi-Fi HaLow connectivity for computers, laptops, and access points across multiple platforms. The adapters are built on Morse Micro's USB Network Adapter Reference Design, the same design featured in the MM8108-EKH19 evaluation kit. Available in USB-A and USB-C form factors, they use the Morse Micro MM8108 Wi-Fi HaLow chipset to connect computers, laptops and access points to an existing Wi-Fi HaLow network across operating systems. The adapters and reference design are available to device makers and developers, giving them a proven path to simplify Wi-Fi HaLow integration into their own products and grow the ecosystem around it. The adapters open up Wi-Fi HaLow connectivity for everyday scenarios: * Connecting laptops and PCs across large properties, businesses and industries * Supporting remote work from outbuildings, garages, and sheds * Providing temporary, portable connectivity for events and field work "Getting Wi-Fi HaLow onto everyday devices is the natural next step for the ecosystem," said Michael De Nil, co-founder and CEO of Morse Micro. "The Wi-Fi HaLow Adapters put that connectivity directly into developers' hands, on a reference design they can build from to bring Wi-Fi HaLow into their own products." Availability. The Wi-Fi HaLow USB Network Adapters are available in USB-A and USB-C variants on Mouser here. About Morse Micro. Morse Micro is the leading Wi-Fi HaLow fabless semiconductor company, revolutionizing IoT connectivity with award-winning technology. Headquartered in Sydney, with global offices in the United States, Taiwan, China, India, Japan and the United Kingdom, Morse Micro is driving the adoption of next-generation long-range, low-power Wi-Fi HaLow solutions. Its first-generation MM6108 and newly launched MM8108 silicon deliver the fastest, smallest, lowest-power, and longest-range Wi-Fi HaLow connectivity on the market. Morse Micro's Wi-Fi HaLow technology is gaining significant momentum globally, enabling connected devices to achieve ten times the range, covering 100 times the area of traditional Wi-Fi networks. This advancement is transforming IoT connectivity across various sectors, including smart homes, industrial automation, and smart cities.

WiFi NOW

Aug 21st, 2026

News update: LitePoint validates ST's UWB chip, Morse Micro's USB designs, AFC for UK, Cambium passes 50k 6 GHz PtMP radios.

News update: LitePoint validates ST's UWB chip, Morse Micro's USB designs, AFC for UK, Cambium passes 50k 6 GHz PtMP radios. August 21, 2026 | WEEKLY NEWS BRIEF | by Claus Hetting, Wi-Fi NOW CEO & Chairman By Claus Hetting, WiFi NOW CEO & Chairman Next-gen UWB gets real as LitePoint validates ST's first IEEE 802.15.4ab silicon. This week test and measurement leader (and WiFi NOW Partner) LitePoint says it has successfully validated physical layer (PHY) performance for STMicroelectronics' ST64UWB chip family using LitePoint's next-generation UWB test system, IQgig-UWB+(TM). The successful test confirms that ST's silicon meets the requirements of the IEEE 802.15.4ab draft specification, giving UWB developers and ecosystem partners "confidence to accelerate development of their next-generation UWB products," LitePoint says. The new IEEE 802.15.4ab amendment introduces extended range and precision through multi-millisecond ranging (MMS) and narrowband assistance (NBA). It also strengthens radar-based sensing, LitePoint says. Read more here. Morse Micro announces two Wi-Fi HaLow USB Dongle Reference Designs. Wi-Fi HaLow leader Morse Micro this week announced two Wi-Fi HaLow USB Dongle Reference Designs that bring long-range Wi-Fi HaLow connectivity to existing devices via a simple USB connection. Morse Micro says the MM8108-RD09 Reference Design provides native Wi-Fi HaLow connectivity to a range of devices including access points (AP) and station (STA) products. OpenWrt drivers are available to enable Wi-Fi HaLow functionality on existing routers and APs with a USB interface. The MM8108-RD17 Reference Design allows for Wi-Fi HaLow integration into a wider range of client products without the need for drivers to be installed on the host. Read more here. WInnForum launches Ofcom AFC task group. The Wireless Innovation Forum (WInnForum) has announced the formation of its Ofcom AFC Task Group, a collaborative industry initiative dedicated to supporting the implementation of Automated Frequency Coordination (AFC) systems for standard-power operation in the United Kingdom's 6 GHz band, WInnForum said in a press release here. "The newly established task group brings together AFC providers, device manufacturers, network operators, technology suppliers, regulators, and industry experts to develop a common framework that supports Ofcom's recently published AFC requirements," the organisation said. Cambium Networks passes 50,000 6 ghz-capable ePMP radios in North america. Cambium says it has now shipped more than 220,000 ePMP 4000 radios globally, including more than 50,000 6 GHz radios to North American service providers. The 50,000 figure is particularly important in that it should put any claim that AFC-enabled standard-power 6 GHz would never produce meaningful commercial deployments to rest. Cambium Networks has delivered the hard evidence that fixed wireless operators are actually deploying the 6 GHz band at scale. Cambium's new ePMP(TM) Software Release 5.12 also adds performance gains and a lower-cost path to expand coverage by turning subscriber modules into access points, the company says. Read more here.

Morse Micro

Product Quality Engineer 1

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