Senior Thermal/Hardware Engineer

Senior Thermal/Hardware EngineerThis role has been designed as ‘’Onsite’ with an expectation that you will primarily work from an HPE office.

Job Description:

Job Family Definition:

Designs, analyzes, develops, and evaluates thermal systems, electronics packaging, heatsinks, and enclosures for high-density, high-power networking platforms. Conducts thermal feasibility studies, design margin analysis, CFD simulation, and empirical validation testing on new and modified designs. Leads system-level thermal architecture development and assessment, driving design decisions across NPI program phases. Evaluates thermal reliability of materials, components, designs, and manufacturing techniques used in production. Directs and guides junior engineers, support personnel, and external partner organizations in detailed thermal design, lab testing, prototype fabrication, and production tooling development.

Management Level Definition:

Contributions impact technical components of HPE products, solutions, or services regularly and sustainable. Applies advanced subject matter knowledge to solve complex business issues and is regarded as a subject matter expert. Provides expertise and partnership to functional and technical project teams and may participate in cross-functional initiatives. Exercises significant independent judgment to determine best method for achieving objectives. May provide team leadership and mentoring to others.

Responsibilities:

• Lead system-level thermal design, simulation, and validation for high-density, high-power networking platforms — from early concept through mass production — ensuring product performance, quality, and long-term reliability.
• Own the end-to-end thermal development lifecycle: heatsink design, CFD simulation, thermal mockup, in-lab testing, and data analysis.
• Design and validate thermal solutions for electronics enclosures, chassis, line cards.
• Define and execute thermal validation test plans (thermal margin, acoustics, shock/vibration, reliability, safety)
• Drive system-level design tradeoffs in collaboration with mechanical, electrical, power, firmware, and software engineering teams.
• Engage manufacturing partners, suppliers, and external development partners to deliver reliable, cost-effective, and production-ready thermal solutions.
• Represent the thermal team across all phases of large, complex development programs — influencing architecture decisions, managing risks, and driving issue resolution.
• Lead root-cause analysis and corrective actions during builds and qualification.
• Provide technical mentorship and guidance to less-experienced engineers, elevating team capability and design rigor across the organization.

Education and Experience Required:

• Bachelor's or Master's degree in Mechanical Engineering or a related field
• 10+ years of experience in thermal design and electronics packaging
• Demonstrated track record of leading thermal development on networking platforms.

Knowledge and Skills:

• Deep expertise in thermal design and electronics packaging for high-density, high-power systems (data center and networking applications).
• Strong proficiency in CFD simulation tools (FloTHERM), with demonstrated ability to correlate simulation models against lab measurements.
• Solid understanding of system thermal control, including fan selection and fan control methodologies.

• Hands-on experience with thermal test setups and instrumentation: thermocouples, DAQs, environmental/thermal chambers, and metered airflow/pressure benches.
• Ability to develop test automation and data analysis scripts using Python or equivalent scripting languages.

• Proficiency in designing heatsinks, sheet metal structures, plastic components, ducts, and baffles, with working knowledge of associated manufacturing processes and production tooling.
• Experience working closely with vendors and contract manufacturers on design-for-manufacturability and cost optimization.

• Proven technical leadership — independently drives complex, multi-disciplinary projects; manages competing priorities and system-level tradeoffs.
• Drives design innovation and elevates engineering standards across programs.
• Clear communicator — able to clearly present thermal strategies and design proposals to engineering peers and senior leadership.

Impact/Scope:

• Collaborates with peers, junior engineers, technicians and external design partners.
• Typically interacts with high- level Individual Contributors, Managers, Directors and Program Core Teams.
• Leads multiple projects requiring thermal development. Drives design innovation.

Complexity:

• Moderate - High.

#LI-Hybrid

Health & Wellbeing

We strive to provide our team members and their loved ones with a comprehensive suite of benefits that supports their physical, financial and emotional wellbeing.

Personal & Professional Development

We also invest in your career because the better you are, the better we all are. We have specific programs catered to helping you reach any career goals you have — whether you want to become a knowledge expert in your field or apply your skills to another division.

Unconditional Inclusion

We are unconditionally inclusive in the way we work and celebrate individual uniqueness. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good.

#singapore#aruba

Job:

Engineering

Job Level:

TCP_04

Hewlett Packard Enterprise is EEO Protected Veteran/ Individual with Disabilities.

HPE will comply with all applicable laws related to employer use of arrest and conviction records, including laws requiring employers to consider for employment qualified applicants with criminal histories.

Recruitment Fraud Alert

We have become aware of an increase in fraudulent recruitment activities in which individuals impersonate our company or authorized recruitment agencies to offer fake employment opportunities. These scams may occur through false websites, emails, social media, or chat-based applications and often aim to obtain personal information or money. Please note that Hewlett Packard Enterprise (HPE), its direct and indirect subsidiaries and affiliated companies, and its authorized recruitment agencies/vendors will never charge a candidate a registration fee, hiring fee, or any other fee in connection with its recruitment and hiring process. We also never request personal information such as back account details, Social Security numbers, or national IDs via social media or chat applications.

All legitimate job opportunities will come through official company channels, and candidates are responsible for verifying the credentials of any third party claiming to represent the company. Any reliance on fraudulent communication is at the individual’s own risk, and HPE disclaims legal liability for any resulting damages. If you suspect recruitment fraud, do not share personal information or make any payments and report the incident to your local authorities immediately.