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Micron Technology

Makes memory and storage chips for AI and PCs

HBM Equipment Engineer

Mechanical Maintenance and Reliability EngineeringConfirmed live in the last 24 hours
Full-timeTaichung City, TaiwanNo salary listedIn-person

About the Job

Requirements

  • Bachelor’s degree or above in Electrical, Mechanical, Materials, Electronics Engineering, or related fields.
  • At least 3 years of work experience with semiconductor equipment operation and maintenance procedures.
  • Strong analytical and problem-solving skills.
  • Good teamwork and communication abilities.
  • Ability to handle wafer-level molding, dicing, thinning, mount, and debond.
  • Ability to handle FDC/tool alarm analysis and improvement.
  • Understanding of tool signals such as SVID, CEID, and ECID.
  • Understanding of tool installation, setup, and buyoff procedures.
  • Ability to communicate in English for discussions with suppliers and the global team; TOEIC score of at least 600.

Responsibilities

  • Evaluate and improve assigned assembly manufacturing processes, materials, and/or equipment.
  • Maintain equipment knowledge as it relates to the process.
  • Improve utilization, capacity, and cost through machine upgrades, procedure optimization, or material selection.
  • Optimize and identify equipment variables.
  • Understand DOE, FMEA, OCAP, 8D, SPC, repair, and preventive maintenance techniques.
  • Perform containment and prevention actions for process and equipment deviations.
  • Prepare and update equipment operation manuals, maintenance logs, and incident reports.
  • Support the introduction of new equipment and technologies, including validation and evaluation.
  • Design equipment components and improve equipment capability by exploring new ideas or concepts and implementing them on equipment.
  • Coordinate with vendors on equipment upgrades, repairs, and technical support.
  • Conduct regular equipment performance analysis and propose improvements using AI.
  • Locate and research technical information on equipment, materials, and/or processes in journals, literature, and online sources.

Desired Qualifications

  • Ability to handle FDC/tool alarm analysis and improve is preferred.
  • Understanding tool signals such as SVID, CEID, and ECID is preferred.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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