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Soitec

Engineered substrates for silicon-on-insulator wafers

Rapid Thermal Process Engineer

Process EngineeringUpdated on Nov 10
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • A degree in Engineering and at least 2 years of relevant experience, or a diploma in Engineering and 5 years of relevant experience as a process engineer, process owner, or process integration engineer.
  • Foundational knowledge of semiconductor manufacturing process flows.
  • Knowledge of Statistical Process Control (SPC), Failure Mode and Effects Analysis (FMEA), Out of Control Action Plan (OCAP)/Reaction Mechanism (RM), and Fault Detection and Classification (FDC).
  • Strong critical-thinking and data-analytical skills to solve complex engineering problems.

Responsibilities

  • Set up and control new tools and processes, and sustain process performance to achieve quality/yield, cost, and capacity metrics.
  • Investigate process excursions, analyze and identify actionable root causes, and evaluate the effectiveness of corrective and preventive actions after implementation.
  • Write, review, and analyze reports to support cross-functional decision-making.
  • Create, modify, and regularly update controlled documents, including SOPs, OCAPs, and FMEA documents.
  • Propose technical solutions, execute Design of Experiments (DOEs), perform statistical analysis, and implement process changes through PCRB to improve quality/yield and operational efficiency.
  • Support new product and process transfers to accelerate industrialization for high-volume manufacturing (HVM).
  • Train and mentor new hires and technicians to elevate technical capabilities and operational efficiency.

Desired Qualifications

  • Experience in Rapid Thermal Processes (RTA, RTO, RTN, RTH).
  • Proficiency in SiView, Klarity, JMP, and E3.

About the Company

Soitec

Engineered substrates for silicon-on-insulator wafers

Soitec designs and manufactures high-performance semiconductor materials, specializing in engineered substrates used to make chips for smartphones, data centers, and automotive applications. Its main products are silicon-on-insulator (SOI) wafers, which enable better performance and lower power consumption compared with traditional silicon wafers. Soitec’s Smart Cut technology bonds and transfers ultra-thin silicon layers onto insulating substrates to produce high-quality wafers with high yield. The company differentiates itself through its leadership in engineered substrates and its proprietary manufacturing process, supplying wafers to leading chipmakers under long-term agreements. Soitec’s goal is to provide advanced substrates that help customers build more powerful and energy-efficient electronic devices across industries.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Bernin, France
Founded
1992

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