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Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Staff Test Operations Engineer

Full-TimeUpdated on 10/14/2026
No salary listed
Senior
Bachelor's
Kulim, Kedah, Malaysia
In Person
Manufacturing & Process EngineeringManufacturing Engineering

About the job

Requirements
  • A bachelor's degree in Electrical, Electronic, Computing, or a related engineering discipline is required.
  • More than seven years of experience in a high-volume semiconductor test manufacturing environment or test product engineering roles is preferred.
  • Strong understanding of product knowledge and test methodology for analog, digital, or power products, failure analysis, and reliability testing.
  • Experience with a major automated test equipment (ATE) tester platform such as Teradyne ETS364, Flex, or ETS800; Advantest 93k; SPEA; or Cohu, and mainstream test handler/prober platforms.
  • Ability to perform 8D and Why-Why analysis to address process and manufacturing challenges.
  • Strong project management skills.
Responsibilities
  • Serve as the test operations interface to Renesas Product Groups and functional teams, including Supply Chain, Quality, Packaging, Foundry, and PMO, across the United States, Japan, India, Malaysia, and China throughout all phases of the product lifecycle.
  • Execute daily test operations with internal factories and test outsourced semiconductor assembly and test (OSAT) providers to ensure customer delivery fulfillment, including lot tracking and dispositions, test program releases, hardware troubleshooting and repairs, equipment uptime, tester utilization and OEE tracking, and continuous improvement processes.
  • Coordinate probe/final test transfer from New Product Introduction to High Volume Manufacturing from Renesas Product Groups.
  • Execute new test capacity expansions involving testers, handlers, and hardware to ensure sufficient capacity and meet production demand.
  • Deploy new tester/handler technology and test solutions to test manufacturing sites from test development.
  • Implement best-known practices and processes within test manufacturing sites.
  • Drive gross margin improvement initiatives in OEE, yield, and retest.
Desired Qualifications
  • Experience with power module testing.
  • Experience with Visual Basic or C++ programming.
  • Proficiency in statistical data analysis tools such as JMP or Spotfire.

About the company

Renesas Electronics designs and manufactures semiconductor components, including microcontrollers, system-on-a-chip solutions, and analog and power devices for automotive, industrial, infrastructure, and IoT markets. Its chips serve as building blocks inside customers’ electronic products, and it offers Winning Combinations—pre-tested system architectures that combine Renesas parts with technologies from its acquisitions to speed development. The company differentiates itself through a broad, integrated portfolio built via acquisitions and a planned unified digital design platform that streamlines integration with hardware and software. Its goal is to be a leading supplier of MCUs, SoCs, and analog/power devices while providing a single, connected design ecosystem that shortens customers’ development cycles.

Company Size

10,001+

Company Stage

IPO

Headquarters

Tokyo, Japan

Founded

2002

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Simplify's Take

What believers are saying

  • Renesas launched 650V dual-side-cooled GaN on September 30, 2026 for megawatt AI data centers.
  • Renesas completed Altium on May 29, 2026 and Pictorus on June 18, 2026.
  • TIER IV collaboration on August 20, 2026 expands Renesas into open autonomous-driving platforms.

What critics are saying

  • Renesas sued Navitas on July 22, 2026, and Navitas countersued August 10, 2026.
  • Takasaki factory production ends within two to three years, signaling legacy manufacturing strain.
  • GaN and autonomous-driving bets face execution risk if AI-data-center and SDV wins slip.

What makes Renesas Electronics unique

  • Altium plus Pictorus unify Renesas 365, spanning design, simulation, and deployment.
  • R-Car Gen 5 anchors open Autoware partnerships across Level 2+ to Level 4 autonomy.
  • Renesas leads automotive MCU, analog, and power silicon for high-reliability embedded systems.

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Benefits

Health Insurance

Life Insurance

Mental Health Support

Professional Development Budget

Meal Benefits

Growth & Insights and Company News

Headcount

6 month growth

-21%

1 year growth

-30%

2 year growth

-30%
Business Wire
Oct 6th, 2026
Renesas launches 100V GaN FETs for AI data centres with 63% lower soft-switching losses

Renesas Electronics has launched its first 100V gallium nitride (GaN) power transistors for low-voltage applications. The new family of GaN FETs targets AI data centres, humanoid robotics, factory automation, industrial motor drives, power tools, and solar microinverters. The devices deliver up to 35% lower hard-switching figure-of-merit and up to 63% lower soft-switching figure-of-merit compared to comparable GaN products. They maintain silicon-compatible footprints for easy integration into existing designs. The transistors support the transition to 800V direct current power distribution and 48V bus architectures in AI servers and industrial infrastructure. They enable megahertz-class switching speeds whilst reducing passive component size, switching losses, and cooling requirements. The GaN FETs are available now in FCLGA and FCLGA-DSC packages, with corresponding evaluation boards.

Yahoo Finance
Sep 30th, 2026
Renesas launches industry's first 650V GaN chip with dual-side cooling for megawatt-scale AI data centres

Renesas Electronics has launched the industry's first 650V gallium nitride device with dual-side cooling for AI data centres. The TP65H020G4PLSGBD delivers 20 milliohms on-resistance in an 8x8mm package, 57% smaller than existing alternatives. The device targets 800V DC/DC intermediate bus converters in megawatt-scale data centres, addressing space and thermal constraints as rack power approaches megawatt levels. Dual-side cooling reduces top-side thermal impedance by 10% whilst maintaining compatibility with standard silicon gate drivers. Renesas is currently sampling the device to major data centre manufacturers. A 6kW reference design achieved 2.6 kW/in³ power density with 0.21% higher efficiency than equivalent alternatives. Mass production is planned for mid-2027. The device will be showcased at OCP Global Summit in San Jose, California, from 12-15 October.

PR Newswire
Sep 1st, 2026
Autoware Foundation partners with Renesas to deliver open-source end-to-end AI for ADAS and autonomous driving

The Autoware Foundation has partnered with Renesas Electronics to deliver open-source AI software for advanced driver assistance systems and autonomous driving. Renesas has joined the foundation at its highest membership tier. The collaboration integrates Autoware's end-to-end AI stack with Renesas R-Car system-on-chip platforms. This enables automotive manufacturers and Tier-1 suppliers to develop scalable solutions ranging from entry-level L2 driver assistance to L2++ hands-free autopilot and L4 robotaxis. The partnership allows OEMs to customise the Apache 2.0-licensed software for specific vehicles and use cases, offering a flexible alternative to in-house development or commercial solutions. The companies describe this as a watershed moment for the industry, comparing it to Linux's impact on computing. "This is the Linux moment for the ADAS and autonomous driving industry," said Christian John, board director at the Autoware Foundation.

Business Wire
Aug 27th, 2026
Renesas opens Physical AI & Robotics Lab in Beijing to advance humanoid robot development

Renesas Electronics has opened a Physical AI & Robotics Lab in Beijing to help customers develop and validate next-generation robotic systems. The facility will support the company's physical AI strategy, focusing on systems that perceive, decide and act in real time in physical environments. Physical AI represents AI's evolution beyond digital applications into robotics and other real-world systems. The lab will integrate hardware, software, AI modelling, control, power supply and sensing to support complete solution development. Renesas currently addresses roughly 30% of the humanoid robot bill of materials and aims to expand that to 70%. The company established a Physical AI Division on 1 July 2026 to focus on this growth area. The Beijing lab will serve as a platform connecting customers, ecosystem partners, universities and startups to accelerate robotics innovation in China's thriving robotics market.

Renesas Electronics Corporation
Aug 25th, 2026
Renesas Completes Acquisition of Integrated Device Technology

TOKYO, Japan, March 30, 2019 JST | San Jose, California, U.S.A., March 29, 2019 PST― Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.