Physical Design Engineer
Mirafra Technology
Physical Design Engineer
Mirafra Technology
Turnkey ASIC design and semiconductor engineering
Job Overview:
The Graphics team is looking for Experienced Physical Design Engineers to work on Adreno Graphics cores in the area of Physical Implementation.
Responsibilities:
The Physical Implementation Engineer will work in Qualcomms Adreno GPU team and will be responsible for all the P&R experiments targeted at validating new flows/methodologies.
Minimum Qualifications:
Able to deal with MSM Top level complexity from FP, Placement, CTS, Routing and timing closure Must be
able to take the Hardmacro through P&R from Netlist to GDS including timing closure, formal and Physical verification.
Tools: EDA Physical design tools experience ( Examples: Cadence Innovas, Synopsys ICC2, PrimetimeSi/Calibre/ etc)
Skills:
Physical design implementation expertize in latest technology nodes in one of the below domains or all of these.
1.Floor planning at Full chip level or Macro or Block Level
a.Macro placement, power grid implementation, power routing, special routing like analog signals etc
b.Power collapse/Low power implementation flow
2.P&R:
Place and route at chip level or block level, perform placement, timing closure in P&R mode, perform clock tree synthesis , routing etc
3.Timing closure/STA
a.Perform STA using primetime Si or Tempus or any industry standard STA engine, timing closure, ECO generation, timing correlation
b.Deep understanding of timing skills to perform correlation, timing fixes , corner/voltage definetions etc
4.Clock Tree Synthesis:
a.Perform custom or regular clock tree implementation at block level or top level.
b.Clock tree balance of complicated tree, clock power reduction techniques etc
5.Low Power Implementation
a.Power collapse/power gaing techniques/implementation
b.UPF/CPF flow knowledge
c.CLP/FV
6. Physical Verification Using Calibre a.Running all the PV checks (DRc/LVS/ERC/Softcheck ) and deep understanding of all the rules and fixes
7. Perl/Python/Shell script experience is also preferred to help with automation
All your information will be kept confidential according to EEO guidelines.
Turnkey ASIC design and semiconductor engineering
Mirafra Technologies delivers end-to-end turnkey ASIC design and semiconductor engineering services to help global tech companies move from concept to silicon to system. It covers the full lifecycle: architecture, design, verification, physical implementation, package/board design, embedded software, post-silicon validation, test and product engineering, and system solutions. With 2,200+ engineers and delivery centers worldwide, Mirafra has completed 650+ tape-outs for over 50 semiconductor customers, from startups to established firms. Its edge comes from a one-stop engineering partner model that combines deep domain expertise with scalable AI, cloud, data engineering, and software capabilities to speed time-to-market and reduce engineering complexity.
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