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Micron Technology

Makes memory and storage chips for AI and PCs

HBM Signal Integrity/Power Integrity Senior Engineer

Board & Electronics DesignConfirmed live in the last 24 hours
Full-timeSeoul, South KoreaNo salary listedIn-person

About the Job

Requirements

  • At least 3 years of experience in signal integrity and power integrity modeling and analysis.
  • Deep understanding of signal integrity and power integrity, electromagnetic and transmission line theory, and input/output design.
  • Experience with circuit simulation tools such as Keysight ADS and Synopsys HFSS.
  • Experience using artificial intelligence, machine learning, or large language models for productivity or efficiency.

Responsibilities

  • Perform signal integrity channel analysis for 2.5D and 3D silicon interposers, including frequency-domain characterization such as insertion loss, return loss, PSXT, and insertion-loss-to-crosstalk ratio, and time-domain analysis such as eye diagrams, bit error rate, and jitter decomposition.
  • Conduct mask-based timing analysis using time-domain simulations such as SPICE and ADS.
  • Support power integrity and power delivery network analysis, including impedance modeling and transient response analysis.
  • Perform electromagnetic extraction and modeling of signal and power delivery channels, including printed circuit boards, packages, and interposers.
  • Automate sign-off processes and work with electronic design automation suppliers to improve tool accuracy and analysis flow.

Desired Qualifications

  • At least 5 years of experience in signal integrity and power delivery network modeling and analysis.
  • Experience in signal integrity and power integrity modeling and analysis for 2.5D/3D advanced packaging, including CoWoS, EMIB, and interposer-based designs, with time-domain analysis (eye diagrams, bit error rate, jitter decomposition, and power delivery network) and frequency-domain characterization (S-parameters and power delivery network impedance).
  • Experience with mask-based timing budget and jitter analysis using time-domain simulation such as SPICE or ADS.
  • Experience with high-speed interfaces such as DDR, HBM, UCIe, PCIe, and SERDES.
  • Proficiency in simulation and analysis using industry-standard electronic design automation tools, including ANSYS HFSS/SIwave, Keysight ADS, Synopsys HSPICE, and Cadence PowerSI/PowerDC.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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