ASM International

Semiconductor deposition equipment and ALD tech

Principal/Senior Process Engineer - Process Engineering, Advanced Packaging

Process EngineeringConfirmed live in the last 24 hours

Full-timeSingaporeNo salary listed

About the Job

Requirements

A Master's or PhD in Chemical Engineering, Materials Science, Electrical Engineering, or Physics is required.
At least 10 years of combined education, research, and work experience in thin-film deposition, including atomic layer deposition, chemical vapor deposition, and plasma-enhanced chemical vapor deposition, and advanced packaging processes is required.
Direct experience working on die-to-wafer or wafer-to-wafer hybrid bonding, including surface preparation steps, is required.
Proficiency in materials characterization techniques including X-ray photoelectron spectroscopy, secondary ion mass spectrometry, Rutherford backscattering spectrometry, atomic force microscopy, X-ray reflectometry, X-ray diffraction, transmission electron microscopy, scanning electron microscopy, and ellipsometry is required.
Knowledge of electrical characterization techniques for complementary metal-oxide-semiconductor devices is required.
Ability to manage complex process-development projects, including schedules, budgets, and personnel, is required.

Responsibilities

Research, develop, and optimize semiconductor processes for advanced packaging, including atomic layer deposition, plasma-enhanced chemical vapor deposition, physical vapor deposition, electrochemical plating, and surface preparation.
Design and conduct complex experiments using design of experiments and response surface methodology, and interpret and analyze experimental data.
Develop new films or processes for emerging packaging applications such as wafer-to-wafer and die-to-wafer hybrid bonding, and perform advanced materials characterization.
Provide mentorship to process engineers and lead technical problem-solving sessions using scientific methods and tools such as Ishikawa diagrams.
Collaborate with customers and marketing teams to define requirements and execute demonstrations.
Troubleshoot equipment issues through hands-on engagement and ensure successful product transfer to customers.
Draft technical papers, generate intellectual property, and present findings to professional audiences.
Travel up to 10% to support remote sites and customer engagements.
May supervise process engineering technicians and provide input on performance evaluations.

Desired Qualifications

Expertise in integrating advanced packaging process flows such as CoWoS, SoIC, and InFO.
Experience contributing process and equipment qualification data toward a full semiconductor equipment product life cycle process.
Experience with advanced metrology and inspection characterization techniques.

Step into a career with ASM, where cutting edge technology meets collaborative culture.

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.

Job's mission

As a Principal / Senior Process Engineer, you will play a key role in advancing ASM’s semiconductor process technologies. You’ll leverage your expertise in thin-film deposition and materials characterization to develop innovative solutions for next-generation devices. Your work will directly influence product performance and enable breakthroughs in logic, memory, and power applications.

What you will be working on

Research, develop, and optimize semiconductor processes focused on Advanced Packaging including depositions (ALD, PECVD, PVD, ECP) and surface preparation.
Design and conduct complex experiments using DOE and RSM methodologies; interpret and analyze experimental data.
Develop new films or processes for emerging packaging applications like W2W/D2W Hybrid bonding and perform advanced materials characterization.
Provide mentorship to Process Engineers and lead technical problem-solving sessions using scientific methods and tools such as Ishikawa diagrams.
Collaborate with customers and marketing teams to define requirements and execute demonstrations.
Troubleshoot equipment issues through hands-on engagement and ensure successful product transfer to customers.
Draft technical papers, generate Intellectual Property, and present findings to professional audiences.
Travel up to 10% to support remote sites and customer engagements.
May supervise process engineering technicians and provide input on performance evaluations.

What we are looking for

Minimum Master’s or PhD in Chemical Engineering, Materials Science, Electrical Engineering, or Physics.
Direct experience working on D2W/W2W Hybrid bonding including surface preparation steps
Minimum 10 years of combined education, research, and work experience in thin-film deposition (ALD, CVD, PECVD) and advanced packaging processes.
Proficiency in materials characterization techniques (XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM, ellipsometry).
Knowledge of electrical characterization techniques for CMOS devices.
Ability to manage complex process development projects, including schedules, budgets, and personnel.

What sets you apart

Expertise in integration advanced packaging process flows like CoWoS, SoIC, InFO.
Experience in contributing Process and equipment qualification data towards a full Semiconductor equipment PLC process
Experience with advanced metrology/Inspection characterization techniques
Strong communication skills to convey technical concepts clearly.

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size: 1,001-5,000
Company stage: IPO
Headquarters: Almere, Netherlands
Founded: 1968

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