Full-Time

Radio Frequency Engineer

DAS Technology Group

DAS Technology Group

No salary listed

No H1B Sponsorship

Sacramento, CA, USA

In Person

US Citizenship Required

Bachelor's, Master's

Category
Electrical Engineering (1)
Hardware Engineering (1)
Required Skills
Data Analysis
Requirements
  • A Bachelor's degree in Electrical Engineering or a related technical discipline is required.
  • U.S. citizenship is required for compliance.
  • Excellent written and oral communication skills are required.
  • For Engineer I, 0–2 years of RF design and test experience are required, along with familiarity with RF test equipment, including vector network analyzers and spectrum analyzers, and basic RF theory.
  • For Engineer II, 2–5 years of RF design and test experience are required, along with proficiency with Advanced Design System, High-Frequency Structure Simulator, Computer Simulation Technology, and RF laboratory equipment.
  • For Engineer II, a strong understanding of electromagnetic theory, impedance matching, and signal integrity is required.
  • For Engineer III, 5–10 years of RF design experience across amplifiers, converters, and thin-film circuits are required, along with expertise with Advanced Design System, High-Frequency Structure Simulator, Computer Simulation Technology, and RF testing methodologies.
  • For Engineer III, familiarity with RF manufacturing processes and strong compliance knowledge are required.
  • For Engineer IV, 10+ years of hands-on RF design experience with production delivery are required, along with expertise in simulation tools and advanced RF test methodologies.
  • For Engineer IV, deep expertise in electromagnetic theory, impedance matching, and signal integrity is required, along with fluency in RF manufacturing processes.
Responsibilities
  • Implement and test simple RF building blocks, including filters and couplers, from established schematics.
  • Run directed simulations using Advanced Design System, High-Frequency Structure Simulator, and Computer Simulation Technology; document results and perform basic parameter sweeps.
  • Execute bench measurements using vector network analyzers and spectrum analyzers; record first-order data.
  • Support bill of materials creation and end-of-life data gathering.
  • Collaborate with mechanical and software teams on interface details.
  • Collect and organize test data, perform basic trend analysis, and prepare charts and summary reports under guidance.
  • Iterate low-noise amplifier, power amplifier, and mixer front-end designs; address biasing, stability, and matching networks.
  • Perform simulations, correlate models to measurements, and refine designs to meet gain, noise figure, and linearity requirements.
  • Develop and execute test plans; interpret results to drive corrective actions.
  • Partner with manufacturing on thin-film, printed circuit board, and box-build considerations; incorporate design-for-manufacturability and design-for-test feedback.
  • Create accurate bills of materials with alternates and assist with end-of-life analysis.
  • Analyze RF performance data, including gain, noise figure, and linearity, and correlate results with simulation outputs.
  • Generate structured reports containing observations, root-cause hypotheses, and recommended corrective actions for review by senior engineers.
  • Architect and lead subsystem designs, including up/down-converters, mixers, and synthesizers, while balancing gain, noise figure, linearity, spurious performance, and thermal stability.
  • Own model-to-hardware correlation using electromagnetic/circuit co-simulation and statistical analyses.
  • Direct rigorous validation using vector network analyzers, spectrum analyzers, and custom fixtures; interpret complex data.
  • Lead manufacturability integration, manage new-product-introduction transitions, and evaluate reliability/yield tradeoffs.
  • Perform end-of-life analysis, select replacements, and manage compliance impacts.
  • Interpret complex RF test datasets and simulation results to validate subsystem performance.
  • Prepare comprehensive technical reports for internal design reviews and customer review meetings.
  • Mentor junior engineers and lead design reviews.
  • Define and oversee RF product architectures and integration into complete systems.
  • Lead advanced RF design efforts for converters, amplifiers, and complex thin-film circuits; resolve multiphysics/electromagnetic interactions.
  • Establish performance-optimization frameworks and acceptance criteria and mentor teams to those standards.
  • Innovate in simulation and modeling and codify best practices and tool flows.
  • Direct complex validation campaigns and adjudicate data for architecture-level decisions.
  • Drive manufacturability and reliability strategies across thin-film, printed circuit board, and box-build operations in partnership with Operations.
  • Own component lifecycle management and bill-of-materials standards and review high-impact bids.
  • Act as a technical liaison across mechanical and software teams and represent engineering in major customer and executive reviews.
  • Produce executive-ready and customer-facing technical reports and white papers articulating design trade-offs, risk assessments, and compliance impacts.
  • Set standards for data integrity and reporting practices across engineering teams.
  • Guide adherence to government contract flow-downs and export controls and help scope Technical Assistance Agreements.
Desired Qualifications
  • For Engineer II, a Master of Science in RF/Microwave is preferred.
  • For Engineer III, a Master of Science is strongly preferred.
  • For Engineer IV, a Master of Science is strongly preferred.

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