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Micron Technology

Makes memory and storage chips for AI and PCs

Principal/Staff Process Integration Engineer

Process EngineeringConfirmed live in the last 24 hours
Full-timeHiroshima, JapanNo salary listed

About the Job

Requirements

  • A master's or doctoral degree in electrical engineering, microelectronics, physics, or materials science, or a bachelor's degree plus at least five years of industry experience.
  • Knowledge of semiconductor device physics and electrical characterization.
  • Knowledge of materials science and semiconductor process fundamentals.
  • Data analysis skills using JMP, Python, or other data analysis or data engineering software.
  • Interpersonal, oral, and written communication skills in English.

Responsibilities

  • Define structural specifications based on electrical characteristics, inline metrics, unit processes, and design rules.
  • Design, execute, and analyze experiments to meet engineering specifications based on structure-electrical characteristic correlations.
  • Use model-based problem solving and drive innovation through process improvements, patents, and technical papers.
  • Develop, maintain, and improve one or more process modules, including design rules and structural and electrical specifications, including alternative flows.
  • Optimize existing process flows and develop solutions to meet product requirements.
  • Design and execute experiments and analyze results using statistical analysis software such as JMP.
  • Feed results back to product teams and contribute to yield improvement.
  • Extract, monitor, and analyze inline, defect, parameter, and probe data to resolve yield issues, improve performance and reliability, expand process margins, and reduce costs.
  • Work cross-functionally with design, product engineering, modeling, yield improvement, electrical and physical failure analysis, defect analysis, parameter, and quality teams to understand issues, goals, and priorities.
  • Summarize complex problems, derive and explain countermeasures, and lead team execution.
  • Define sub-milestones within the assigned module.
  • Maintain effective communication among process integration, process development, and pilot fab teams.
  • Ensure timely documentation of research and development activities for manufacturing transfer.

Desired Qualifications

  • At least five years of industry experience in process integration or a closely related role.
  • At least two years of hands-on experience in DRAM manufacturing fabs and/or DRAM transfer teams.
  • Experience with front-end, middle-of-line, and interconnect DRAM modules.
  • A background in device physics, electronics, or electrical engineering is particularly welcome.
  • Fluency in Japanese.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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