Silicon Photonics Engineer - Co-Packaged Optics

Silicon Photonics Engineer (CPO) – Singapore

Singapore - On-Site

ABOUT LUMILENS

At Lumilens we are building the critical photonics infrastructure that powers tomorrow’s AI supercomputing. From chip-to-chip optical interconnects to scalable photonic engines, Lumilens is unlocking a new era of computing - faster, cooler, and massively more efficient.

We’re a well-funded startup backed by Mayfield and led by veterans who’ve built and scaled some of the most transformative technologies in the industry. At Lumilens, we’re developing high-speed photonics products purpose-built to power the future of AI infrastructure and high-performance computing.

This isn’t incremental innovation, it’s a ground-floor opportunity to rethink the optical layer from the silicon up. You’ll work alongside a team of world-class engineers solving some of the hardest challenges in scaling optical systems. Every line of code, every design decision, every breakthrough you help deliver will shape the infrastructure of tomorrow.

If you're looking for mission, momentum, and the chance to make an outsized impact, jump on the rocket ship. We’re just getting started.

About Lumilens

At Lumilens, we are building the critical photonics infrastructure powering the next generation of AI supercomputing. From chip-to-chip optical interconnects to scalable photonic engines, our technology enables faster, cooler, and dramatically more efficient systems. Backed by leading investors and built by industry veterans, we are scaling rapidly to bring cutting-edge silicon photonics into high-volume production.

About the Role

We are looking for a Silicon Photonics Engineer to help advance our next‑generation Co‑Packaged Optics (CPO) technologies. This role focuses on developing high‑performance photonic devices, maturing process integration platforms, and supporting the transition of new designs into scalable, high‑volume manufacturing. You will work at the intersection of device design, process engineering, and advanced packaging, contributing to a rapidly evolving photonics ecosystem.

Key Responsibilities

• Develop and optimize silicon photonic devices and building blocks for CPO‑focused platforms, ensuring strong performance and manufacturability.

• Contribute to the creation and refinement of process integration flows, including backend and advanced packaging steps essential for photonic assembly.

• Support the evolution of PDK components and design rules, enabling reliable, high‑volume production.

• Partner with cross‑functional teams—spanning R&D, fabrication, reliability, product engineering, and customer‑facing groups—to align technical requirements and deliverables.

• Guide products through the full lifecycle from early development and NPI through qualification and ramp‑to‑production.

• Investigate device or process issues through structured analysis, driving corrective actions and long‑term improvements.

• Participate in customer and partner engagements, offering technical insights that accelerate design cycles and improve manufacturability.

• Contribute to continuous improvement initiatives that enhance yield, streamline processes, and strengthen platform capability.

Qualifications

• Advanced degree (MS or PhD) in Electrical Engineering, Electrical & Computer Engineering, or a related field.

• Strong foundation in silicon photonics device design, optical interconnect concepts, and photonic integration.

• Experience with process integration, backend assembly techniques, or advanced packaging for photonic systems.

• Familiarity with transitioning photonic technologies from development into production environments.

• Hands‑on exposure to device design, cleanroom fabrication, and photonic device testing or characterization.

• Ability to collaborate effectively across multidisciplinary teams and communicate complex technical topics clearly.

• Strong analytical and problem‑solving skills, with a track record of delivering results in fast‑moving environments.

Preferred Experience

• Background in CPO architectures, high‑speed optical interconnects, or photonic packaging solutions.

• Experience contributing to or developing PDKs for silicon photonics platforms.

• Exposure to backend processes such as Cu bumping, laser diode attach, TSV, or fiber‑related assembly.

• Prior involvement in customer‑driven development programs or industry collaborations.

• Publications, patents, or recognized contributions in silicon photonics or related fields.

What We Offer

• Competitive salary commensurate with experience

• Comprehensive benefits package including health insurance

• Professional development opportunities and certification support

• Access to cutting-edge photonics technology and advanced packaging environments

• Collaborative work environment with cross-functional teams solving complex engineering challenges

*Lumilens is an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, gender, identity, orientation, veteran status, disability, or any other legally protected status.