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Micron Technology

Makes memory and storage chips for AI and PCs

HBM Equipment Engineer

Mechanical Maintenance and Reliability EngineeringConfirmed live in the last 24 hours
Full-timeTaichung City, TaiwanNo salary listedIn-person

About the Job

Requirements

  • Familiarity with TCB/DB process and at least 5 years of semiconductor equipment engineering experience.

Responsibilities

  • Leverage AI-enabled and AI-assisted work methods, including Microsoft Copilot, generative AI, and advanced analytics tools, to improve equipment utilization, yield performance, alarm code analysis, parts lifetime prediction, and manufacturing efficiency.
  • Use AI-powered data analysis to identify equipment performance gaps, predict equipment failures, optimize preventive maintenance strategies, and reduce unplanned downtime.
  • Apply AI-assisted troubleshooting techniques to accelerate root cause analysis of equipment alarms, process excursions, and yield loss mechanisms.
  • Identify, diagnose, and resolve assembly equipment-related issues using data-driven and AI-supported methodologies.
  • Coordinate and execute process, equipment, and material evaluations, using AI insights to optimize manufacturing performance and quality.
  • Lead and participate in utilization improvement, yield enhancement, cost reduction, and smart manufacturing initiatives through automation and AI technologies.
  • Validate and qualify new processes, equipment, materials, and manufacturing technologies for NPI deployment.
  • Support FDC/RMS/APC/SPC systems and use AI-driven analytics to identify trends, abnormalities, and improvement opportunities.
  • Drive site-to-site best practice transfer and digital transformation initiatives.
  • Manage supplier quality and risk mitigation activities through data analytics and predictive monitoring techniques.
  • Support internal and external audits while maintaining compliance with engineering and quality standards.
  • Adopt Microsoft Copilot and other AI technologies to enhance engineering productivity, knowledge management, documentation generation, decision making, and operational excellence.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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