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Micron Technology

Makes memory and storage chips for AI and PCs

Principal Engineer - RET Design

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeBoise, ID, USANo salary listedIn-person

About the Job

Requirements

  • A bachelor's degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or a related technical field, plus 6 or more years of experience in RET, OPC, lithography, or mask development.
  • Experience developing and applying RET and OPC methodologies for semiconductor patterning challenges.
  • A strong understanding of EUV lithography, optics, diffraction, resist behavior, and advanced patterning techniques.
  • Experience with lithography simulation tools such as Sentaurus Litho, ProLith, or similar platforms.
  • Demonstrated ability to solve complex technical problems and collaborate effectively across multidisciplinary teams.

Responsibilities

  • Develop and implement RET and OPC solutions to improve pattern fidelity, manufacturability, and yield.
  • Optimize lithography methodologies, software capabilities, and tapeout processes to improve performance and efficiency.
  • Analyze patterning issues, identify root causes, and drive corrective actions across R&D and manufacturing environments.
  • Lead complex mask development and lithography optimization projects while collaborating across engineering teams.
  • Mentor engineers and promote technical best practices, knowledge sharing, and AI-enabled engineering approaches.

Desired Qualifications

  • A master's degree or PhD in Electrical Engineering, Materials Science, or a related field.
  • Experience with EDA tools such as Synopsys, Siemens, Cadence, Brion, or similar platforms for OPC modeling and lithography simulation.
  • Programming or scripting experience with Python, Perl, TCL, C, or C++.
  • Semiconductor process development or manufacturing experience.
  • Experience mentoring engineers and supporting technical growth and development of team members.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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