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ASML

Manufactures photolithography systems for semiconductors

Quality Engineer - Factory

Full-TimeUpdated on 10/23/2026
$81.4k - $119k/yr
Junior
Bachelor's, Master's
Wilton, CT, USA
In PersonUp to 50% of time in the cleanroom; occasional campus movement and travel may be required.
Manufacturing Quality & TestQuality Engineering
Company Does Not Provide H1B Sponsorship

About the job

Requirements
  • A Bachelor of Science degree in Engineering with at least 2 years of experience in an engineering environment, or a Master of Science degree in Engineering with at least 0 years of experience in an engineering environment.
  • Experience in a production environment with high-tech products and complex production processes.
  • Experience in technical Production Engineering and quality methodologies such as statistical process control and failure mode and effects analysis.
  • Experience in Quality and Lean Six Sigma Manufacturing.
  • Experience applying an industrial and business mindset to engineering.
  • Ability to read optical, mechanical, and electrical drawings.
  • Strong Microsoft Excel data management and presentation skills.
  • Ability to interface with multidisciplinary groups, including senior leadership, take responsibility, and follow through.
  • Strong ownership characteristics and demonstrated commitment to achieving results on time.
  • Strong written and oral communication skills, including the ability to communicate effectively with the team and senior management.
  • Focus on quality and continuous improvement.
  • Ability to read and interpret data, information, and documents.
  • Ability to work under deadlines.
  • Ability to observe and respond to people and situations and interact with others encountered during work.
  • Ability to learn and apply new information or skills.
  • Ability to meet the physical demands of the role, including sitting, walking, talking, hearing, keyboarding, handling and feeling, stooping, kneeling, crouching, twisting, reaching, and stretching; occasional campus movement; and occasional lifting or moving of up to 20 pounds.
  • Specific vision abilities required include close vision, color vision, peripheral vision, depth perception, and ability to adjust focus.
  • Must be legally authorized to access United States controlled technology before beginning work.
  • Must be able to work in a cleanroom with full gowning, including full-body coveralls, hood, cleanroom safety shoes, face mask, nitrile gloves, and safety glasses, under ISO 9000/14000 standards.
  • Must be able to work around overhead cranes, fork trucks, motorized pallet movers, lasers, ladders, platforms, and chemicals; the workplace may also involve strong magnetic fields, high voltage, and currents.
Responsibilities
  • Provide detailed support for Statistical Process Control parameters and maintenance, including Critical to Quality and Critical to Customer target setting, monitoring, and offline reviews.
  • Facilitate ongoing and planned Process Failure Mode and Effects Analysis reviews and follow-up actions.
  • Facilitate Dead-On-Arrival investigations and the related process.
  • Spend up to 50% of working time in the cleanroom providing direct production support for quality improvements, data collection, and monitoring.
  • Use Statistical Process Control data and analysis reports to drive teams toward structural process improvements and trustworthy Statistical Process Control data targets.
  • Chair cross-sector Statistical Process Control review meetings to present and analyze data.
  • Generate and distribute weekly Statistical Process Control reports for multiple modules.
  • Work with Engineering and Assembly staff in Optical, Mechanical, Electrical, and Software disciplines to develop quality processes, execute process requirements, and implement Best Known Methods.
  • Provide input for and use quality templates, tools, and systems, focusing on streamlining and automation.
  • Provide input for and help implement process targets and goals.
  • Generate action plans for underperforming Key Process Indicators, working with teams on structural solutions as required.
  • Work with teams and Business Engineering to develop and improve reporting tools, aiming to automate data collection and input.
  • Support external and internal audits for International Organization for Standardization readiness and manufacturing quality.
  • Support Quality Management Meeting reviews and production preparation and planning 6P=P reviews.
  • Support in-production quality issues by assisting Production Assembly and Test Engineers and Technicians with cross-sector communications, historical data, and analysis.
  • Review customer and supplier failure analysis reports and help validate failure root causes.
  • Interface with internal and external customers regarding internal process quality.
  • Support the review and development of manufacturing procedures and technical work instructions from a quality perspective.
  • Support new product introduction in an existing concurrent engineering environment.
  • Guide requirements for equipment calibration, preventative maintenance, and new equipment specification and procurement for analytical instruments used in manufacturing.
  • Travel as required by company needs.
Desired Qualifications
  • Knowledge of MATLAB, LabVIEW, and Python.
  • Working knowledge of NX, Teamcenter, and SAP.

About the company

ASML designs and manufactures photolithography systems for semiconductor manufacturing. Its main products are deep ultraviolet (DUV) and extreme ultraviolet (EUV) lithography machines that print circuit patterns on silicon wafers, with EUV enabling smaller features. The company sells these systems to leading chipmakers and earns substantial revenue from installation, maintenance, and upgrades over the machines’ lifetimes. Its goal is to help continue scaling semiconductors by leading in high-end lithography and maintaining strong relationships with customers like TSMC, Samsung, and Intel.

Company Size

10,001+

Company Stage

IPO

Headquarters

Veldhoven, Netherlands

Founded

1984

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Simplify's Take

What believers are saying

  • Q2 2026 sales hit €9.3 billion, and full-year guidance rose to €43-45 billion.
  • Management said 2028 EUV output could exceed 110 tools, unlocking AI wafer capacity.
  • India launched ASML operations with Tata Electronics support, opening a new customer frontier.

What critics are saying

  • Europe bought zero ASML lithography tools in 2026, exposing a dead domestic demand base.
  • Chinese DUV entrants in Shanghai threaten ASML's 29% 2025 China revenue by 2027.
  • ASML cut 1,700 jobs in 2026; continued restructuring signals execution strain and morale damage.

What makes ASML unique

  • ASML alone ships EUV systems; no advanced chip node exists without Veldhoven tools.
  • High-NA EUV expands into Nvidia-scale data-center chips, extending ASML's moat through 2033.
  • Installed Base Management generated €2.8 billion in Q2 2026, deepening recurring revenue.

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Benefits

  • Flexible Work Hours
  • Remote Work Options

Growth & Insights and Company News

6 month growth

0%

1 year growth

0%

2 year growth

0%
Business Insider
Oct 23rd, 2026
ASML's CEO ties his pay to employee satisfaction after engagement drops to 73.5%

ASML chief executive officer Christophe Fouquet will tie executive pay to employee satisfaction, according to a memo seen by Business Insider. The move follows a drop in the Dutch chip equipment maker's employee engagement index from 78% to 73.5%, as it reorganises. Fouquet called it a "disruptive and emotional year." The survey polled more than 38,000 of ASML's roughly 44,000 employees. A new Workplace Experience Index, built from six survey questions, will join the long-term incentive plan. "In the coming years, it will directly influence the remuneration of senior leaders, including the Board of Management," Fouquet wrote. ASML announced in January that it could cut 1,700 jobs to reduce management layers, though it later said it expected fewer cuts. Its shares are up 45% this year on AI-driven demand.

Yahoo Finance
Oct 20th, 2026
Apple vs ASML: $416.2B revenue against 15.6% growth and a 29.4% margin

Apple and ASML offer two ways to bet on tech: one sells devices to billions of users, the other makes the lithography machines that chipmakers need to produce advanced semiconductors. In fiscal 2025, Apple's revenue reached nearly $416.2 billion, up about 6.4%. Net income was close to $112 billion, a 26.9% margin, and free cash flow was roughly $98.8 billion. Its debt-to-equity ratio was about 1.5. ASML reported revenue of nearly $36.8 billion, up 15.6%. Net income was $10.8 billion, a margin of about 29.4%, with free cash flow of roughly $12.5 billion. ASML's debt-to-equity ratio was about 0.2, and its current ratio was nearly 1.3, against Apple's 0.9.

Neoteo
Oct 16th, 2026
SemiAnalysis says ASML may be developing a hybrid-bonding tool.

SemiAnalysis says ASML may be developing a hybrid-bonding tool. A patent-based analysis describes a possible die-to-wafer process; ASML had not announced a tool as of October 15, 2026. October 16, 2026 Key points * 01 SemiAnalysis inferred that ASML may be developing a die-to-wafer hybrid-bonding tool; ASML had not announced it as of October 15, 2026. * 02 SemiAnalysis counted 27 ASML bonding patent families filed from December 2022 through November 2024, mostly related to D2W bonding. * 03 The proposed track-based process and its potential technical advantages are SemiAnalysis's interpretation, not measured tool results. * 04 SemiAnalysis expects advanced logic could be the first application; it forecasts D2W adoption in HBM no earlier than 2029, if it happens at all. SemiAnalysis says ASML may be developing a die-to-wafer hybrid-bonding tool. Its proposed process and potential impact on Besi remain unconfirmed. SemiAnalysis said on October 15, 2026, that ASML may be developing a die-to-wafer (D2W) hybrid-bonding tool, drawing that inference from patent filings, roadmap material and earlier reporting. ASML had not announced the tool as of the analysis. Read SemiAnalysis's analysis. Reuters reported on October 16 that ASML did not confirm the development and declined to comment on the report. Read the Reuters report. What the reporting says about ASML. SemiAnalysis counted 27 ASML bonding patent families filed between December 2022 and November 2024, most related to D2W bonding. It also cited The Elec reporting that ASML had begun architecture design with Prodrive Technologies and VDL ETG. These reports inform SemiAnalysis's inference; they do not amount to an ASML product announcement. The proposed tool is specifically a die-to-wafer bonder: individual semiconductor dies would be bonded to a wafer. The central claim in the coverage traces to SemiAnalysis's analysis. Investing.com summarized that analysis, while Reuters reported on it; those accounts do not constitute separate technical confirmation. How SemiAnalysis describes the proposed process. In SemiAnalysis's interpretation of patent material, each die would travel on an individual holder along a track, passing through inspection, cleaning, plasma activation, metrology and alignment before bonding to a wafer. The analysis suggests that independent shuttles could let stations work concurrently, that adding stations could increase capacity, and that recipes could accommodate different die types. Those are proposed design possibilities, not measured results. SemiAnalysis identifies alignment accuracy and particle control as potential advantages, while also pointing to engineering challenges involving feed-forward metrology, die-to-wafer contact, adapting non-bonding tools to the track and keeping the process loop clean. Why a possible tool could matter to Besi. SemiAnalysis describes Besi as the only supplier with D2W tools in volume production and says its logic-bonding business is concentrated at TSMC and Intel. If ASML develops a competing tool, Besi could face a new rival in that segment. SemiAnalysis expects advanced logic to be the likeliest first application for a prospective ASML tool. Its forecast for D2W bonding in high-bandwidth memory (HBM) is no earlier than 2029, if adoption happens at all. Other Languages Read this article in another available language.

MarketScreener
Oct 16th, 2026
Besi shares fall on report ASML is working on rival hybrid bonding product.

Besi shares fall on report ASML is working on rival hybrid bonding product. Published on 10/16/2026 at 06:54 am EDT - Modified on 10/16/2026 at 06:55 am EDT AMSTERDAM, Oct 16 (Reuters) - Shares in computer chip packaging equipment maker BE Semiconductor Industries (Besi) fell 3% on Friday after influential semiconductor research firm SemiAnalysis reported that one of the company's main growth products will face competition from bigger rival ASML. The SemiAnalysis report analysed 27 patent filings by ASML, which it said indicated ASML was developing a hybrid bonding product. Besi is a fraction of the size of ASML, the biggest maker of equipment used to make semiconductors, but Besi is a leader in hybrid bonding, an advanced packaging technology being used to create a new generation of more powerful three-dimensional chips. ASML has not confirmed it is developing such a tool. Besi did not respond to requests for comment. Besi shares were down 3% at EUR158.50, while ASML was up 1.1% at EUR1,480 in midday Amsterdam trading. A spokesperson for ASML declined to comment on the SemiAnalysis report but pointed to the company's launch of its first advanced packaging tool last year. "We continue to look at which directions the 3D integration industry will evolve... and where ASML's expertise can be of additional value," the company said in a statement at that time. In March, Reuters reported that ASML was planning additional packaging tools, citing Chief Technical Officer Marco Pieters in an interview. "The semiconductor market has already signalled that packaging is one of those next frontiers where performance gains can be unlocked, and ASML seems to be building next-gen tools headed in the same direction," said Nick Rossolillo, co-founder of Chip Stock Investor. "We see the new batch of packaging tools, beyond an EUV pipeline, as critical to pulling off the growth needed to justify (ASML's) elevated valuation." (Reporting by Toby Sterling; Editing by Susan Fenton) (C) Reuters - 2026

Channel NewsAsia
Oct 16th, 2026
Besi shares fall on report ASML is working on rival hybrid bonding product.

Besi shares fall on report ASML is working on rival hybrid bonding product. 16 Oct 2026 06:51PM (Updated: 16 Oct 2026 06:54PM) Add CNA as a trusted source to help Google better understand and surface our content in search results. AMSTERDAM, Oct 16: Shares in computer chip packaging equipment maker BE Semiconductor Industries (Besi) fell 3 per cent on Friday after influential semiconductor research firm SemiAnalysis reported that one of the company's main growth products will face competition from bigger rival ASML. The SemiAnalysis report analysed 27 patent filings by ASML, which it said indicated ASML was developing a hybrid bonding product. Besi is a fraction of the size of ASML, the biggest maker of equipment used to make semiconductors, but Besi is a leader in hybrid bonding, an advanced packaging technology being used to create a new generation of more powerful three-dimensional chips. ASML has not confirmed it is developing such a tool. Besi did not respond to requests for comment. Besi shares were down 3 per cent at €158.50, while ASML was up 1.1 per cent at €1,480 in midday Amsterdam trading. A spokesperson for ASML declined to comment on the SemiAnalysis report but pointed to the company's launch of its first advanced packaging tool last year. "We continue to look at which directions the 3D integration industry will evolve... and where ASML's expertise can be of additional value," the company said in a statement at that time. In March, Reuters reported that ASML was planning additional packaging tools, citing Chief Technical Officer Marco Pieters in an interview. "The semiconductor market has already signalled that packaging is one of those next frontiers where performance gains can be unlocked, and ASML seems to be building next-gen tools headed in the same direction," said Nick Rossolillo, co-founder of Chip Stock Investor. "We see the new batch of packaging tools, beyond an EUV pipeline, as critical to pulling off the growth needed to justify (ASML's) elevated valuation."