A

Amazon

Sells products online and rents cloud computing

Senior Manager - Physical Design Engineering

Engineering LeadershipConfirmed live in the last 24 hours
Full-timeIn-person

About the Job

Requirements

  • At least 5 years of people-management experience leading physical design teams of 8 or more engineers, including hiring, performance management, and organizational growth.
  • At least 10 years of hands-on ASIC/SoC physical design across multiple advanced technology nodes, including 7nm, 5nm, and 3nm, with multiple successful tapeouts.
  • Technical depth across the full RTL-to-GDSII process, including floorplanning, clock-tree synthesis, routing, timing closure, power delivery network design, IR-drop/electromigration signoff, physical verification, and tapeout.
  • Mastery of both Synopsys tools (Fusion Compiler/ICC2, PrimeTime, StarRC, RedHawk-SC) and Cadence tools (Innovus, Tempus, Quantus, Voltus), plus Siemens Calibre physical verification (DRC, LVS, PERC).
  • Deep expertise in advanced static timing analysis (MMMC, POCV/AOCV, SSTA, PBA, and IR-aware timing) and power integrity, including static/dynamic IR-drop, electromigration, rush current, Ldi/dt, and package-aware analysis.
  • Proven expertise in high-speed physical design, including multi-GHz datapaths, SerDes, DDR5, HBM, PCIe Gen5+, and UCIe, and low-power design, including UPF, power gating, DVFS, and retention.
  • Experience with hierarchical methodologies for very large SoCs exceeding 1 billion transistors.
  • Expert scripting skills in TCL, Python, and Perl.

Responsibilities

  • Build, hire, and develop a physical design team of 10–15 engineers; own headcount planning, performance management, career growth, and organizational scaling to support multiple concurrent tapeouts.
  • Own the physical design strategy and execution roadmap across Inferentia, Trainium, and future products, including implementation architecture, hierarchical methodology, PPA target-setting, and technology-node adoption.
  • Institutionalize continuous PPA improvement through benchmarking frameworks, regression tracking, design-quality dashboards, post-tapeout retrospectives, and structured improvement programs across product generations.
  • Provide hands-on technical leadership on multi-GHz timing closure, PDN architecture, high-speed I/O physical design, and 2.5D/3D cross-die integration.
  • Lead technology-node enablement for 2nm and beyond, including PDK evaluation, reference-flow development, PPA pathfinding, and adoption recommendations.
  • Define and deploy RTL2GDS methodologies and CAD flows, champion AI/ML-augmented design automation such as reinforcement-learning placement, ML-guided ECO, and predictive analytics, and optimize cloud infrastructure for physical-design compute.
  • Serve as a senior technical interface with foundry partners and EDA vendors on tool roadmaps, co-development, and technology co-optimization.
  • Own tapeout execution, including readiness reviews, foundry submission, mask-data coordination, and post-silicon yield learning; drive cross-functional alignment with RTL, DFT, STA, Package, and Validation teams.

Desired Qualifications

  • Experience leading physical design for AI/ML accelerators, GPUs, or high-performance data-center SoCs at leading semiconductor companies or hyperscalers.
  • Direct 3nm GAA/Nanosheet experience and 2nm or sub-2nm engagement; familiarity with CFET and backside power delivery (BSPDN).
  • A quantifiable track record of continuous PPA improvement and metric-driven flow development across multiple projects and technology nodes.
  • Strong program execution experience managing concurrent tapeouts, milestone tracking, risk identification, and executive communication.
  • Hands-on 2.5D/3D integration experience with CoWoS, EMIB, InFO, SoIC, or Foveros, and chiplet strategy with UCIe.
  • A track record deploying AI/ML-driven design methodologies in production flows.
  • Experience with CPO, HBM4, silicon photonics, or CXL physical design.
  • Multi-foundry technology assessment experience with TSMC, Samsung, or Intel Foundry Services.
  • Experience managing geographically distributed teams across the U.S., Israel, or globally.
  • Experience scaling physical-design organizations through 2x–3x growth; a patent portfolio or industry-standards contributions such as UCIe or IEEE.

About the Company

Amazon

Sells products online and rents cloud computing

Amazon runs the largest online store in the United States and rents cloud computing to businesses and governments through Amazon Web Services. AWS pioneered renting computing power over the internet, and Amazon built its own delivery network to get orders to customers quickly. Shoppers buy from Amazon and from independent sellers on its store, and Prime members pay a subscription for fast free shipping, streaming video and music, and other perks. AWS rents out computing power, storage, databases, and AI tools so companies can run software without owning servers, and Amazon also makes Kindle e-readers and Echo speakers with the Alexa assistant. Jeff Bezos founded Amazon in 1994, and it is based in Seattle, Washington.

Company size
10,001+
Company stage
IPO
Headquarters
Seattle, WA
Founded
1994

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