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ASM International

Semiconductor deposition equipment and ALD tech

Senior Field Process Engineer - Field Process

Process EngineeringConfirmed live in the last 24 hours
Full-timeBoise, ID, USANo salary listed

About the Job

Requirements

  • PhD with relevant academic, research, or internship experience in materials science, chemical engineering, or physics or MS degree with relevant industry experience
  • Hands-on experience processing, developing, or characterizing thin films using thermalALD, plasmaALD, plasmaCVD, or epitaxy reactors through internships, research, or academic projects
  • Demonstrated troubleshooting and structured problem‑analysis skills (e.g., KT, FMEA, Ishikawa, 7‑step methodologies)
  • Experience designing, running, and interpreting DOEs or statistical experiments in academic, research, or internship settings
  • Familiarity with semiconductor device applications, vacuum techniques, metrology, and thin‑film characterization
  • Willingness and ability to travel for training and customer engagement; flexibility to support extended hours or weekends during qualifications or escalations
  • Strong written and verbal communication skills with the ability to clearly explain technical concepts
  • Ability to maintain confidentiality and uphold IP boundaries

Responsibilities

  • Support New Product Introduction (NPI) by training with the Business Unit to gain deep expertise in new deposition processes and hardware
  • Lead the introduction, qualification, and transfer of new processes to the customer site
  • Partner closely with field hardware engineers and Business Unit teams to troubleshoot new products and develop process or hardware improvement proposals
  • Design and execute on-site experiments with customers to support development, integration, and continuous improvement projects
  • Escalate technical issues in a timely manner to maintain scope, timelines, and customer alignment
  • Document key learnings during NPI and ensure effective knowledge transfer to local service and manufacturing teams
  • Analyze baseline system and process performance against technology‑node requirements to identify gaps
  • Perform structured problem solving and root‑cause analysis on process or system nonconformances
  • Collaborate with customer teams to identify and grow opportunities for ASM hardware and process adoption
  • Support process transfer to high‑volume manufacturing (HVM) fabs, creating and maintaining best‑known methods (BKMs) and documentation
  • Maintain strong discipline around IP boundaries, customer communication, and escalation leadership

Desired Qualifications

  • Industry, internship, research, or academic experience with ASM ALD, PEALD, PECVD, or Epitaxy equipment
  • Demonstrated success optimizing deposition processes in research, pilot, or HVM‑adjacent environments
  • Exposure to customer‑facing technical discussions, presentations, or reviews
  • Experience supporting process transfer, scale‑up, or qualification activities
  • Proven ability to collaborate cross‑functionally and contribute to structured action plans during technical challenges or escalations

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Almere, Netherlands
Founded
1968

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