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ASM International

Semiconductor deposition equipment and ALD tech

Senior Engineer - NPI Field Process

Process EngineeringConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • A Ph.D. in Chemistry, Materials Science, Physics, Electrical Engineering, or a related field.
  • Hands-on experience in semiconductor device fabrication, particularly thin-film deposition processes such as ALD, PEALD, Epitaxy, PECVD, or similar.
  • A solid understanding of semiconductor device physics and electrical characterization techniques.
  • Proficiency in statistical analysis tools such as JMP.
  • Ability to work in a fab environment, including wearing cleanroom garments and performing standby duties.
  • Willingness to support short-term overseas assignments.

Responsibilities

  • Partner closely with customer and product teams to understand technology roadmaps, process flows, inflection points, and business challenges, and identify opportunities where ASM can deliver added value.
  • Collaborate with customer and product teams to execute penetration and defense strategies, including product demonstrations.
  • Coordinate internally to plan and collect data, analyze results, and report on customer demonstrations for existing process applications.
  • Design and execute simple Design of Experiments evaluations to characterize process windows for new installations.
  • Conduct experiments and tests, analyze data, and prepare comprehensive reports for internal and external stakeholders.
  • Support tool installation and process qualification activities.

Desired Qualifications

  • Familiarity with 3D NAND flash memory processes and integration is a strong advantage.
  • Exceptional verbal and written communication skills, with the ability to convey complex technical concepts clearly and concisely.
  • Strong collaboration skills to work effectively with diverse teams and meet project milestones.

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Almere, Netherlands
Founded
1968

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