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Efficient Computer

Energy-efficient processors for edge IoT computing

Hardware Technical Program Manager

Program ManagementConfirmed live in the last 24 hours
Full-timeIn-person

About the Job

Requirements

  • A B.S. in Electrical Engineering, Computer Engineering, Computer Science, or equivalent is required.
  • At least 7 years of experience in semiconductor/hardware engineering or program management, including at least two full SoC/ASIC programs taken from concept through tapeout and silicon bring-up.
  • Working fluency in the chip design flow, including RTL, functional verification and coverage closure, DFT, synthesis, place-and-route, static timing analysis, physical signoff (DRC/LVS/IR/EM), GDSII handoff, and post-silicon validation.
  • Ability to build and defend a bottoms-up schedule with critical-path analysis and dependency mapping.
  • Track record of influencing without authority and earning technical credibility to push senior engineers on commitments and dates.
  • Strong written and verbal communication, with the ability to run a room of principal engineers and an executive review effectively.
  • Hands-on experience with Jira, Confluence, and MS Project or Smartsheet, and familiarity with the Synopsys/Cadence/Siemens EDA ecosystem.

Responsibilities

  • Own the silicon schedule from architecture freeze through tapeout, bring-up, and production, informed by customer requirements and internal functional leads.
  • Drive the weekly execution cadence, including program reviews, design reviews, and tapeout readiness, and maintain a single source of truth for status, dependencies, and decisions.
  • Coordinate handoffs across architecture, RTL, DV/emulation, DFT, physical design, IP, package, and software.
  • Manage hardware program dependencies, including IP delivery, PDK/library releases, EDA versions, and emulation capacity.
  • Run the tapeout checklist and signoff matrix for timing, power, IR/EM, DRC/LVS, DFT coverage, ECO closure, and GDS handoff, holding owners to closure criteria.
  • Work with supply chain and logistics on IP acquisition, silicon arrival, ATE/loadboard readiness, lab scheduling, bug triage, and ECO/respin decision support.
  • Surface risks early with mitigation options and quantified schedule impact, including late IP, coverage shortfalls, convergence misses, and foundry slot changes.
  • Facilitate PPA, schedule, and scope tradeoffs, and document what was decided, by whom, and why.
  • Interface with foundry, OSAT, IP, and EDA partners on deliverables, technology file releases, mask slots, and escalations; support export control/ECCN compliance with legal and operations.
  • Deliver executive reporting on program status, risks, and decisions needed and by when across distributed teams and time zones.
  • Track resource allocation and NRE/mask/license/prototype budgets against program needs.

Desired Qualifications

  • Prior hands-on engineering experience in design, DV, or physical design before moving to program management.
  • Experience on advanced or FinFET nodes (16/12/7nm or more advanced) and direct foundry engagement; TSMC is preferred.
  • Familiarity with AI/ML accelerators, dataflow, or novel compute architectures.
  • Experience managing emulation/FPGA prototyping programs and pre-silicon software enablement timelines.
  • Exposure to package/board co-design programs (FC-BGA, WLCSP) and OSAT coordination.
  • Experience with EVK/reference board programs and customer/FAE enablement schedules.
  • Familiarity with quality and compliance frameworks relevant to automotive, industrial, or security certifications.
  • An M.S. or MBA.

About the Company

Efficient Computer

Energy-efficient processors for edge IoT computing

Efficient Computer makes energy-efficient programmable processors for IoT edge devices and sells a compatible software toolchain that fits existing embedded languages and AI/ML workflows. These processors run local computations at the edge, reducing the need to send data over wireless links, which saves power and enables real-time processing and data compression. Its strength comes from combining hardware with a developer-friendly ecosystem rather than relying on general-purpose chips, helping deployments last longer in places without wired power. Its goal is to enable widespread, cost-effective edge deployments by dramatically lowering energy use and total cost of ownership for IoT networks.

Company size
51-200
Company stage
Series B
Total funding
$173M
Headquarters
Pittsburgh, PA
Founded
2022

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