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ASM International

Semiconductor deposition equipment and ALD tech

Senior Engineer 1 - Process Engineering

Design EngineeringConfirmed live in the last 24 hours
Full-timeHwaseong-si, Gyeonggi-do, South KoreaNo salary listed

About the Job

Requirements

  • A PhD in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field, or an MS degree with 2+ years of relevant industry experience.
  • Hands-on experience with PEALD, ALD, PECVD, CVD, Epitaxy, or other thin film deposition technologies.
  • Strong understanding of thin film deposition principles and semiconductor process development.
  • Experience designing and characterizing deposition processes using first principles and experimental design techniques.
  • Ability to independently manage complex process development activities.
  • English and Korean communication skills sufficient to clearly explain complex technical concepts.

Responsibilities

  • Research, develop, and optimize thin film deposition processes, focusing on metal and dielectric films using PEALD and related technologies.
  • Design and execute complex experiments using Design of Experiments (DOE) and Response Surface Methodology (RSM), and interpret experimental results.
  • Develop new film materials and processes for emerging semiconductor applications using chemistry and materials science fundamentals.
  • Troubleshoot process and equipment issues through hands-on engagement.
  • Participate in and drive structured technical problem-solving using scientific methodologies and industry tools.
  • Collaborate with customers and central marketing to define requirements and execute customer demonstrations.
  • Support product transfer to customers by delivering demonstrations, training field service teams, creating technical documentation, and traveling to customer sites up to 10%.
  • Author technical papers and contribute to intellectual property generation related to process and technology development.

Desired Qualifications

  • Knowledge of electrical characterization techniques for CMOS devices.
  • Experience integrating metal and/or dielectric films into FEOL and BEOL process flows.
  • Hands-on experience with materials characterization techniques such as XPS, SIMS, AFM, XRD, TEM, SEM, Raman, or ellipsometry.
  • Experience authoring technical publications and/or patents in the semiconductor industry.
  • Collaboration skills with customers, field teams, and cross-functional stakeholders.

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Almere, Netherlands
Founded
1968

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