Multimedia Engineer
Mirafra Technology
Multimedia Engineer
Mirafra Technology
Turnkey ASIC design and semiconductor engineering
Title : IoT Multimedia Engineer
Type : Full Time
Location : San Diego,CA
The team working on product like STB, Connected Camera,VR/AR, Drones and
is looking for experienced engineer
with rich Multimedia experience focusing on Audio/video/graphics/BSP on
Linux and Android. This role will involve
working on multiple layers of the software stack on Android /Linux and
interfacing with internal SW and HW developers.
Required Qualifications:
3 to 4 years of professional experience required in the following areas:
Programming skills in C and C+ Embedded software development Device driver
programming Experience with Object Oriented Programming Experience with
media frameworks and applications, with a focus on real time audio and
video.
Preferred Qualifications:
Architecture, design, implementation, and testing of embedded software
modules and Linux device drivers (Linux,C, MIPS, ARM) Android bring up on
ARM based platforms Camera bring up, DSI display bring up Debugging
software and solving complex problems across a wide range of technologies
(Linux, Video, Audio, OpenGL graphics, display)
Educational Qualifications:
Required:Bachelor's, Computer Engineering and/or Computer Science and/or
Electrical Engineering
Preferred:Master's, Computer Engineering and/or Computer Science and/or
Electrical Engineering
Thanks and regards
Arun Kumar
Sr.Technical Recruiter,
Mirafra Inc.
(M) +1 408-372-4371 | arunramanaidu(AT)mirafra(DOT)com
Arun Kumar
Sr.Technical Recruiter,
Mirafra Inc.
(M) +1 408-372-4371 | arunramanaidu(AT)mirafra(DOT)com
Turnkey ASIC design and semiconductor engineering
Mirafra Technologies delivers end-to-end turnkey ASIC design and semiconductor engineering services to help global tech companies move from concept to silicon to system. It covers the full lifecycle: architecture, design, verification, physical implementation, package/board design, embedded software, post-silicon validation, test and product engineering, and system solutions. With 2,200+ engineers and delivery centers worldwide, Mirafra has completed 650+ tape-outs for over 50 semiconductor customers, from startups to established firms. Its edge comes from a one-stop engineering partner model that combines deep domain expertise with scalable AI, cloud, data engineering, and software capabilities to speed time-to-market and reduce engineering complexity.
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