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Mirafra Technology

Turnkey ASIC design and semiconductor engineering

Multimedia Engineer

Embedded EngineeringConfirmed live in the last 24 hours
Full-timeSan Diego, CA, USANo salary listedIn-person

About the Job

Requirements

  • Three to four years of professional experience in multimedia engineering, embedded software, device-driver programming, object-oriented programming, and media frameworks or applications focused on real-time audio and video.
  • Programming proficiency in C and C++.
  • Experience with embedded software development and device-driver programming.
  • Experience with object-oriented programming.
  • Experience with media frameworks and applications focused on real-time audio and video.
  • A required Bachelor's degree in Computer Engineering, Computer Science, and/or Electrical Engineering.

Responsibilities

  • Work across multiple layers of the software stack on Android and Linux.
  • Interface with internal software and hardware developers.

Desired Qualifications

  • Experience with architecture, design, implementation, and testing of embedded software modules and Linux device drivers.
  • Experience with Linux, C, MIPS, and ARM.
  • Experience with Android bring-up on ARM-based platforms.
  • Experience with camera bring-up and DSI display bring-up.
  • Experience debugging software and solving complex problems across Linux, video, audio, OpenGL graphics, and display technologies.
  • A preferred Master's degree in Computer Engineering, Computer Science, and/or Electrical Engineering.

About the Company

Mirafra Technology

Turnkey ASIC design and semiconductor engineering

Mirafra Technologies delivers end-to-end turnkey ASIC design and semiconductor engineering services to help global tech companies move from concept to silicon to system. It covers the full lifecycle: architecture, design, verification, physical implementation, package/board design, embedded software, post-silicon validation, test and product engineering, and system solutions. With 2,200+ engineers and delivery centers worldwide, Mirafra has completed 650+ tape-outs for over 50 semiconductor customers, from startups to established firms. Its edge comes from a one-stop engineering partner model that combines deep domain expertise with scalable AI, cloud, data engineering, and software capabilities to speed time-to-market and reduce engineering complexity.

Company size
1,001-5,000
Company stage
Not listed
Total funding
Not listed
Headquarters
Bengaluru, India
Founded
2004

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