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SK hynix

Global producer of DRAM and NAND.

Director System in Package Architecture

Hardware Systems IntegrationConfirmed live in the last 24 hours
Full-timeSan Jose, CA, USA$240k - $300k

About the Job

Requirements

  • A Bachelor of Science in Electrical Engineering, or an equivalent combination of education and progressive industry experience.
  • At least 7 years of specialized experience in advanced packaging architecture definition, strategy, and development.
  • Demonstrated success driving cross-functional alignment across engineering, product, and operations teams to deliver complex solutions.
  • A proven track record of leading, mentoring, and scaling high-performing engineering teams.
  • Exceptional verbal and written communication skills, including the ability to articulate technical strategies.
  • Strong working knowledge of 2.5D/3D packaging technologies and large-body substrate technologies.
  • Strong proficiency in Signal Integrity and Power Integrity analysis and optimization.

Responsibilities

  • Lead end-to-end development of advanced packaging system architectures to maximize System in Package performance, with a specific focus on High Bandwidth Memory.
  • Drive mechanical and electrical test vehicle design and development when necessary.
  • Lead research and development of novel technologies to enhance System in Package performance, and drive the roadmap for System-on-Chip and High Bandwidth Memory integration in 2.5D and 3D packaging environments.
  • Lead strategic collaborations with internal teams and external partners to ensure seamless technology development and time-to-market.

Desired Qualifications

  • Experience managing managers or team leads.
  • A Master's degree or PhD in Electrical Engineering, Materials Science, or a related field.
  • At least 10 years of experience in advanced packaging architecture, specifically with 2.5D and 3D packaging technologies.
  • Direct experience in High Bandwidth Memory architecture and integration.

About the Company

SK hynix

Global producer of DRAM and NAND.

Summary of SK hynix: 1) What does the company do? It is a global producer of semiconductor memory, specializing in DRAM and NAND Flash that power IT devices like computers, phones, and servers. 2) How do its products work? DRAM stores data using tiny capacitors and requires periodic refreshing to keep data, providing fast volatile memory. NAND Flash stores data in non-volatile memory cells and preserves data without power, serving as durable storage. Both chips are mounted in devices to enable fast processing and data retention. 3) How is the company different from competitors? It ranks as the second-largest memory chip maker with a broad product portfolio and strong technology, backed by the SK Group, giving it scale, resources, and global reach. 4) What is the company's goal? To become the world’s best semiconductor company by meeting diverse customer needs and leading in memory technology.

Company size
5,001-10,000
Company stage
IPO
Headquarters
Seoul, South Korea
Founded
1983

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